Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 7439190 | Fabrication method of semiconductor device Provided is a fabrication method of a semiconductor device having an improved production yield. An insulating film for forming sidewall insulating films of a gate electrode is deposited on the main surface of a semiconductor wafer and then, subjected to the t... | 10/21/2008 |
| 7431861 | Etchant, replenishment solution and method for producing copper wiring using the same An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen a... | 10/07/2008 |
| 7396483 | Uniform chemical etching method The invention concerns a method of wet chemical etching of a wafer comprising at least one surface layer of silicon-germanium (SiGe) for etching by dispensing an etching solution deposited on a rotating wafer, the method being characterized in that it comprises a fi... | 07/08/2008 |
| 7390423 | Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises a carrying fluid, colloidal particles, etchant, and a surfactant ads... | 06/24/2008 |
| 7387741 | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member.... | 06/17/2008 |
| 7367345 | Apparatus and method for providing a confined liquid for immersion lithography A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate. ... | 05/06/2008 |
| 7367140 | Method of drying molds and apparatus for supplying drying air In a method of drying molds or mold parts for the manufacture of optical lenses, in particular ophthalmic lenses and especially contact lenses, the mold or mold part to be dried is exposed to drying air. For this purpose, humid pressurized air (T) is used to which t... | 05/06/2008 |
| 7364626 | Substrate processing apparatus and substrate processing method Substrate cleaning apparatus and method capable of preventing adhesion of particles to a substrate irrespective of being hydrophilic or hydrophobic are provided. Although a cleaning liquid ejected from a two-fluid nozzle 36 rebounds from a cup CP and scatters... | 04/29/2008 |
| 7353560 | Proximity brush unit apparatus and method An apparatus is provided for producing a wet region and corresponding dry region on a wafer. A proximity brush unit delivers fluids with a rotatable brush to produce the wet region on the wafer. As the proximity brush unit moves in a selected scan method across the ... | 04/08/2008 |
| 7351642 | Deglaze route to compensate for film non-uniformities after STI oxide processing A process and method for compensating for a radial non-uniformity on a wafer that includes the steps of: centering a rotational thickness non-uniformity of a film on the wafer about the axis of the spin susceptor following a CMP process; positioning a nozzle in the ... | 04/01/2008 |
| 7350316 | Meniscus proximity system for cleaning semiconductor substrate surfaces A system and apparatus for cleaning a substrate is provided. The system includes a first head configured as a bar shape that extends approximately a diameter of the substrate. The first head is configured for placement on a first side of the substrate. A second head... | 04/01/2008 |
| 7332440 | Wet etching apparatus and method A wet etching apparatus and method to shorten processing time and to eliminate formation of unintended mask pattern are described. In the conventional art, after a mask pattern is formed, alien substances such as water mist or stain are left on the substrate. The al... | 02/19/2008 |
| 7328713 | Nozzle apparatus for stripping edge bead of wafer There is provided a nozzle apparatus for stripping an edge bead from a wafer, which includes a rotatable support arm, and a side rinse nozzle coupled to a leading end of the support arm to remove the bead of photoresist remaining on the edge of a wafer. The side rin... | 02/12/2008 |
| 7319920 | Method and apparatus for self-calibration of a substrate handling robot A substrate-handling robot which serves a processing tool such as a plating tool may be automatically controlled by a controller to perform a self-calibration procedure. As part of the procedure, an end effector of the robot is moved to interact with sensors provide... | 01/15/2008 |
| 7319336 | Charged particle beam device probe operation An apparatus including a positioner control device, a measuring device and a control routine. The positioner control device is communicatively coupled to a chamber of a charged particle beam device (CPBD) and is configured to individually manipulate each of a plural... | 01/15/2008 |
| 7300598 | Substrate processing method and apparatus The invention relates to a process including a chemical liquid treatment and a rinse liquid treatment on a substrate, more particularly to a technique for reducing consumption of a chemical liquid while achieving uniform process and preventing particle generation. I... | 11/27/2007 |
| 7293571 | Substrate proximity processing housing and insert for generating a fluid meniscus An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process ... | 11/13/2007 |
| 7291283 | Combined wet etching method for stacked films and wet etching system used for same A combined wet etching method for stacked films which is capable of performing etching processes in a collective manner while controlling an amount of side-etching on each of stacked films and of making uniform side edges. In the wet etching method, two or more type... | 11/06/2007 |
| 7291282 | Method of fabricating a mold for imprinting a structure The present invention provides a method of fabricating an imprint mold for molding a structure. The method includes directing a first and a second flux for forming a first material and a second material, respectively, to a substrate to form a layered structure havin... | 11/06/2007 |
| 7285778 | Probe current imaging A method including directing a first electrical signal to at least one of a plurality of probes each positioned within a chamber of a charged particle beam device. At least one of the plurality of probes is exposed to a charged particle beam of the charged particle ... | 10/23/2007 |
| 7279116 | Method for the wet treatment of disk-like objects The invention relates to a method for the treatment of disk-like objects with one first liquid and at least one second liquid at least in a defined edge region of a disk-like object. ... | 10/09/2007 |
| 7264007 | Method and apparatus for cleaning a substrate using megasonic power A method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process t... | 09/04/2007 |
| 7264742 | Method of planarizing a surface A method for removing at least a portion of a structure, such as a layer, film, or deposit, including ruthenium metal and/or ruthenium dioxide includes contacting the structure with a material including ceric ammonium nitrate. A material for removing ruthenium metal... | 09/04/2007 |
| 7261986 | Photoconductive member for an electrophotographic machine and method of forming same A method for producing a substrate for a photoconductive member includes etching the substrate with a self-limiting acid that removes the metal oxides from but does not affect the surface roughness of the substrate inner and outer surface. ... | 08/28/2007 |
| 7252097 | System and method for integrating in-situ metrology within a wafer process A system and method for processing a wafer includes applying a process to the wafer. The process being supported by a surface tension gradient device. A result of the process is monitored. The monitored result is output. ... | 08/07/2007 |
| 7252100 | Systems and methods for processing a set of circuit boards A circuit board processing system includes a wash tank configured to contain cleaning fluid, and a positioning subsystem configured to immerse a set of circuit boards into the wash tank. The system further includes a flow control subsystem having (i) a first set of ... | 08/07/2007 |
| 7252778 | Etching method and etching device An etching method and etching device are provided, enabling uniform rendering of the thickness of a film for processing on a wafer regardless of the film thickness profile thereof, and thereby enabling global planarizing of the wafer surface. In an etching method, t... | 08/07/2007 |
| 7247209 | Dual outlet nozzle for the combined edge bead removal and backside wash of spin coated wafers An apparatus and method for the improved combined edge bead removal and backside wash of spin coated semiconductor wafers is disclosed. This is preferably accomplished by providing a nozzle having a plurality of outlets adapted for the ejection of a cleaning fluid o... | 07/24/2007 |
| 7244665 | Wafer edge ring structures and methods of formation An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) ... | 07/17/2007 |
| 7241342 | Non-dripping nozzle apparatus According to one aspect of the invention, a dispense head for a wafer processing apparatus is provided. The dispense head may include an inlet, at least one outlet, a drain, and a passageway therethrough interconnecting the inlet, the outlet, and the drain. The inle... | 07/10/2007 |
| 7240679 | System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold One of many embodiments of a substrate preparation system is provided which includes a drying system, the drying system including at least one proximity head for drying a substrate. The system also includes a cleaning system for cleaning the substrate. ... | 07/10/2007 |
| 7234477 | Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface ... | 06/26/2007 |
| 7220973 | Modular manipulation system for manipulating a sample under study with a microscope A modular manipulation system and method for using such modular manipulation system for manipulating a sample under study with a microscope are provided. According to at least one embodiment, a platform is provided that comprises an interface to a microscope, a samp... | 05/22/2007 |
| 7198055 | Meniscus, vacuum, IPA vapor, drying manifold A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface an... | 04/03/2007 |
| 7198727 | Etching process for micromachining materials and devices fabricated thereby The present invention provides an optical microbench having intersecting structures etched into a substrate. In particular, microbenches in accordance with the present invention include structures having a planar surfaces formed along selected crystallographic plane... | 04/03/2007 |
| 7192494 | Method and apparatus for annealing copper films A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system. ... | 03/20/2007 |
| 7192488 | Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multip... | 03/20/2007 |
| 7179753 | Process for planarizing substrates of semiconductor technology In a process for planarization of semiconductor substrates in which a layer which has been applied to a semiconductor substrate which has a trench and/or contact holes is removed such that the layer remains solely in the area of the trenches or contact holes, instea... | 02/20/2007 |
| 7176135 | EBR shape of spin-on low-k material providing good film stacking In accordance with the objectives of the invention a new method is provided to tune the Edge Bead Remove hump and to further prevent a pointed or tip shaped Edge Bead Remove edge, thus preventing peeling of the low-k dielectric film after the process of Chemical Mec... | 02/13/2007 |
| 7172674 | Device for liquid treatment of wafer-shaped articles A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shap... | 02/06/2007 |
