Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 7442319 | Poly etch without separate oxide decap The use of an ammonium hydroxide spike to a hot tetra methyl ammonium hydroxide (TMAH) solution to form an insitu poly oxide decapping step in a polysilicon (poly) etch process, results in a single step rapid poly etch process having uniform etch initiation and a hi... | 10/28/2008 |
| 7398598 | Methods for manufacturing endodontic instruments A method of manufacturing endodontic files involves a chemical milling process to yield endodontic files having a desired taper and/or degree of sharpness. The process involves the steps of (a) forming helical cutting edges in the cutting portion of the metallic rod... | 07/15/2008 |
| 7390423 | Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises a carrying fluid, colloidal particles, etchant, and a surfactant ads... | 06/24/2008 |
| 7387963 | Semiconductor wafer and process for producing a semiconductor wafer A semiconductor wafer has an edge region with no defects larger than or equal to 0.3 μm. The wafers are produced by a process, comprising (a) providing a semiconductor wafer having a rounded and etched edge; (b) polishing the edge of the semiconductor wafer, in whi... | 06/17/2008 |
| 7377836 | Versatile wafer refining Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Met... | 05/27/2008 |
| 7364666 | Flexible circuits and method of making same Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method. ... | 04/29/2008 |
| 7357878 | Etchant, and method for fabricating a thin film transistor subtrate including conductive wires using the etchant and the resulting structure Provided are an etchant, a method for fabricating a wire using the etchant, and a method for fabricating a thin film transistor (TFT) substrate using the etchant. The etchant includes a material having the formula 1, ammonium acetic acid, and the remainder of deioni... | 04/15/2008 |
| 7358619 | Tape carrier for TAB A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides... | 04/15/2008 |
| 7357875 | Hybrid coating for magnetic heads A system and method for providing corrosion protection for a magnetic read/write head is disclosed. A monolayer surface coating is applied to cover those portions of the under layer of a magnetic read/write head not already covered by a previously applied diamond-li... | 04/15/2008 |
| 7354527 | Chemical mechanical polishing pad and chemical mechanical polishing process A chemical mechanical polishing pad which has a storage elastic modulus E′(30° C.) at 30° C. of 120 MPa or less and an (E′(30° C.)/E′(60° C.)) ratio of the storage elastic modulus E′(30° C.) at 30° C. to the storage elastic modulus E′(60° C.) at 60Â... | 04/08/2008 |
| 7351642 | Deglaze route to compensate for film non-uniformities after STI oxide processing A process and method for compensating for a radial non-uniformity on a wafer that includes the steps of: centering a rotational thickness non-uniformity of a film on the wafer about the axis of the spin susceptor following a CMP process; positioning a nozzle in the ... | 04/01/2008 |
| 7329366 | Method of polishing implantable medical devices to lower thrombogenecity and increase mechanical stability The present invention relates to a method of polishing an implantable medical device. The method may include positioning an implantable medical device on a support. At least a portion of a surface of the implantable medical device may include a polymer. A fluid may ... | 02/12/2008 |
| 7326359 | In-line demetallization process for flexible metallized substrates The present invention discloses a continuos process for the partial demetallization of a first multilayer substrate, comprising at least one metallic layer 21, characterized in that a designed lacquer comprising at least one metal dissolving etchant 25... | 02/05/2008 |
| 7314575 | Manufacturing method of glass substrate for magnetic disk, and manufacturing method of magnetic disk A method for manufacturing a glass substrate for a magnetic disk comprises mirror surface polishing and cleaning of a glass substrate, wherein polishing agent of which the principal component is rare-earth oxide with content of fluorine 5% by weight or less, is supp... | 01/01/2008 |
| 7275749 | Substrate supporting apparatus A substrate supporting apparatus for supporting a substrate or wafer in a non-contact state by Bernoulli theorem is disclosed. The substrate supporting apparatus 1 comprises a housing 2, a rotatable chuck 3 which is disposed in the housing 2 | 10/02/2007 |
| 7258560 | Spring-loaded assembly for a connector A spring-loaded assembly for coupling a connector to a computer component includes an assembly housing operable to receive a portion of a screw used to couple the connector to a chassis of an information handling system. The assembly further includes a sliding block... | 08/21/2007 |
| 7226705 | Method of manufacturing a mask blank and a mask, the mask blank and the mask, and useless film removing method and apparatus In a method of removing a useless film formed along a circumferential portion of a substrate, so as to provide a removed portion, a cover member is covered over the substrate to supply a solvent to the useless portion through solvent supply holes. The circumferentia... | 06/05/2007 |
| 7182821 | Substrate processing method and substrate processing apparatus Disclosed is a substrate processing method including a substrate rotating step for rotating a substrate with the substrate held almost horizontally within a chamber; a peripheral edge processing step for discharging a processing liquid to a lower surface of the subs... | 02/27/2007 |
| 7179753 | Process for planarizing substrates of semiconductor technology In a process for planarization of semiconductor substrates in which a layer which has been applied to a semiconductor substrate which has a trench and/or contact holes is removed such that the layer remains solely in the area of the trenches or contact holes, instea... | 02/20/2007 |
| 7159298 | Method for the formation of RF antennas by demetallizing A thin and flexible radio frequency (RF) antenna tag or label is disclosed which contains an RF circuit connected to an antenna which is created by demetallizing the area around the antenna pattern on a thin, metallized substrate such as a film or paper web. Antenna... | 01/09/2007 |
| 7091132 | Ultrasonic assisted etch using corrosive liquids An ultrasonic etching apparatus for chemically-etching a workpiece is disclosed. The apparatus includes an outer tank at least partially filled with an aqueous solution, an inner tank at least partially disposed within the outer tank and in contact with aqueous solu... | 08/15/2006 |
| 7071013 | Fixture and method for uniform electroless metal deposition on integrated circuit bond pads A method and an apparatus for uniform electroless plating of layers onto exposed metallizations in integrated circuits such as bond pads. The apparatus provides means for holding a plurality of wafers, and rotating each wafer at constant speed and synchronous within... | 07/04/2006 |
| 7056447 | Semiconductor processing methods Embodiments in accordance with the present invention provide for removing organic materials from substrates, for example substrates employed in the fabrication of integrated circuits, liquid crystal displays and the like. Such embodiments also provide for forming se... | 06/06/2006 |
| 7040209 | Tool fixtures for use in rotational processing A fixture for holding tools to be processed in a rotational processing apparatus. The fixture includes at least one mounting rod with a plurality of spacers slidably disposed on the mounting rod. A plurality of tools are disposed about the rod, each tool being space... | 05/09/2006 |
| 7037854 | Method for chemical-mechanical jet etching of semiconductor structures A chemical-mechanical jet etching method rapidly removes large amounts of material in wafer thinning, or produces large-scale features on a silicon wafer, gallium arsenide substrate, or similar flat semiconductor workpiece, at etch rates in the range of 10–100 mic... | 05/02/2006 |
| 6995089 | Method to remove copper without pattern density effect A new method is provided that allows for the application of electropolish for removal of copper and that is independent of pattern density of the removed copper. Electropolish of the copper is first accomplished by reversing current in the H2SO4 | 02/07/2006 |
| 6968619 | Method for manufacturing endodontic instruments A method of manufacturing endodontic files involves a chemical milling process to yield endodontic files having a desired taper. The process involves the steps of (a) providing a metallic rod having a cutting portion with a polygonal cross section; (b) torsioning th... | 11/29/2005 |
| 6964724 | Etching and cleaning methods and etching and cleaning apparatuses used therefor An etching/cleaning apparatus is provided, which makes it possible to effectively remove an unnecessary material or materials existing on a semiconductor wafer without damaging the device area with good controllability. The apparatus comprises (a) a rotating means f... | 11/15/2005 |
| 6946027 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con... | 09/20/2005 |
| 6941957 | Method and apparatus for pretreating a substrate prior to electroplating A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to t... | 09/13/2005 |
| 6939807 | Apparatus for manufacturing semiconductor devices with a moveable shield An apparatus for manufacturing semiconductor devices includes a supporter portion on which a semiconductor substrate is placed, a nozzle portion for injecting a fluid to an edge of the substrate placed on the supporter portion, a shielding cover for preventing the f... | 09/06/2005 |
| 6936183 | Etch process for etching microstructures A two-step method of releasing microelectromechanical devices from a substrate is disclosed. The first step comprises isotropically etching a silicon oxide layer sandwiched between two silicon-containing layers with a gaseous hydrogen fluoride-water mixture, the ove... | 08/30/2005 |
| 6932451 | System and method for forming a pattern on plain or holographic metallized film and hot stamp foil The system and method of the present invention forms an item specific pattern on a plain or holographic metallized film or hot stamp foil, including an embossed substrate with or without holograms. A piezoelectric ink jet printhead includes a plurality of ink jet ch... | 08/23/2005 |
| 6918989 | Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same In a manufacturing apparatus of printed wiring board an aperture of a nozzle pipe located in a central position is larger than that at both sides, or the aperture of the piping to the nozzle pipe in the central position is larger than that of the piping at both side... | 07/19/2005 |
| 6913523 | Method for controlling pH during planarization and cleaning of microelectronic substrates A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a p... | 07/05/2005 |
| 6899818 | Method and composition for removing sodium-containing material from microcircuit substrates A method and composition for removing sodium-containing materials such as photoresist from microcircuit substrate material utilizes 1,2-Diaminocyclohexanetetracarboxylic Acid in an organic solvent. ... | 05/31/2005 |
| 6867138 | Method of chemical/mechanical polishing of the surface of semiconductor device The surface of a semiconductor device is polished by first supplying a polishing pad with a slurry that contains a solvent, abrasive grains, and an additive for making the viscosity of the slurry variable so that the top portion of the polishing pad is soaked with t... | 03/15/2005 |
| 6861007 | Method for removing organic material from a substrate and for oxidizing oxidizable material thereon Embodiments in accordance with the present invention provide for removing organic materials from substrates, for example substrates employed in the fabrication of integrated circuits, liquid crystal displays and the like. Such embodiments also provide for forming se... | 03/01/2005 |
| 6841083 | Device and process for improved scouring efficiency A device for scouring a coating from a fibrous material includes a tank for immersing a plurality of fibers in scouring solvent therein. The device also includes a bubbling device positioned therein and having a chamber formed between a base plate and a cover plate ... | 01/11/2005 |
| 6802911 | Method for cleaning damaged layers and polymer residue from semiconductor device A method of cleaning damaged layers and polymer residue on semiconductor devices includes mixing HF and ozone water in a vessel to form a solution of HF and ozone water, and dipping a semiconductor device in the vessel containing the solution of HF and ozone water. ... | 10/12/2004 |
