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Class 216/87 - Irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to ethching to change properties of substrate toward the etchant


Subclass of Class 216 - Etching a substrate: processes
Definition: Process wherein a substrate is altered by contacting prior
No. of patents: 247
Last issue date: 07/12/2011


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NumberTitleIssue Date
7976717Method of forming polarization reversal area, apparatus thereof and device using it
Provided are a method and an apparatus for forming a nanometer-order polarization-reversed region in a ferroelectric single crystal, and a device using the ferroelectric single crystal. The method according to the present invention for forming a polarization-...
07/12/2011
7790051Isolating and moving single atoms using silicon nanocrystals
A method is disclosed for isolating single atoms of an atomic species of interest by locating the atoms within silicon nanocrystals. This can be done by implanting, on the average, a single atom of the atomic species of interest into each nanocrystal, and then measu...
09/07/2010
7691280Ink jet printing of etchants and modifiers
The present invention is directed to processes for ink jet printing of etchant or modifier materials for creating patterns, particularly for electronics and display applications. The present invention also relates to devices made using the processes. ...
04/06/2010
7419612Method of creating pores in a thin sheet of polyimide
The invention concerns a method which consists in first subjecting the polyimide sheet to ionic bombardment, followed by an irradiation in the visible domain and finally a relatively brief chemical etching. Said method enables a thin polyimide sheet comprising pores...
09/02/2008
7358196Wet chemical treatment to form a thin oxide for high k gate dielectrics
Described herein are methods of forming a thin silicon dioxide layer having a thickness of less than eight angstroms on a semiconductor substrate to form the bottom layer of a gate dielectric. A silicon dioxide layer having a thickness of less than eight angstroms m...
04/15/2008
7354733Method for sorting and separating living cells
We disclose methods of sorting or separating mixtures of living cells (e.g., eukaryotic, prokaryotic, mammalian, pathogenic, bacterial, viral, etc.). We perform our methods by activating cell-selective photophoric labels, which photosensitize and chemically reduce a...
04/08/2008
7332068Selective removal of dielectric materials and plating process using same
A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, the...
02/19/2008
7333125Marking replaceable resource units within printing devices
A marking beam of electromagnetic energy is generated within a printing device and a visibly markable portion of a replaceable subsystem that is at least partially arranged within the printing device is altered by illuminating at least part of the markable portion w...
02/19/2008
7332440Wet etching apparatus and method
A wet etching apparatus and method to shorten processing time and to eliminate formation of unintended mask pattern are described. In the conventional art, after a mask pattern is formed, alien substances such as water mist or stain are left on the substrate. The al...
02/19/2008
7316919Composite materials comprising supported porous gels
This invention relates to a composite material that comprises a support member that has a plurality of pores extending through the support member and, located in the pores of the support member, and filling the pores of the support member, a macroporous cross-linked...
01/08/2008
7276175Semiconductor device fabrication method
A semiconductor device fabrication method comprises (1) forming a patterned mask layer on an oxide layer of a Mn-containing perovskite type oxide; (2) heat-treating the oxide layer; and (3) patterning the oxide layer with an etching solution containing at least one ...
10/02/2007
7272099Exposure apparatus of an optical disk master, method of exposing an optical disk master and pinhole mechanism
An exposure apparatus of an optical disk master having a laser source, a deflector for deflecting a recording laser beam obtained based on the laser beam of the laser source and an objective lens for focusing the recording laser beam on an optical disk master, has a...
09/18/2007
7255800Wet etching process
The present invention illustrates a bulk silicon etching technique that yields straight sidewalls, through wafer structures in very short times using standard silicon wet etching techniques. The method of the present invention employs selective porous silicon format...
08/14/2007
7253120Selectable area laser assisted processing of substrates
A system and method for selectable area laser treatment of a substrate, such as thin film transistors, the system including a holder holding a substrate in proximity to reactant, and laser beams each addressing independently selectable mutually set apart locations o...
08/07/2007
7247248Method of forming atomic force microscope tips
The invention relates to a method for forming silicon atomic force microscope tips. The method includes the steps of depositing a masking layer onto a first layer of doped silicon so that some square or rectangular areas of the first layer of doped silicon are not c...
07/24/2007
7247247Selective etching method
A selective etching method with lateral protection function is provided. The steps includes: (a) providing a substrate; (b) forming a plurality of tunnels; (c) forming a lateral strengthening structure at a peripheral wall of the tunnels; (d) removing a bottom porti...
07/24/2007
7241559Lens array and method for fabricating the lens array
A lens array and a method for fabricating the lens array are described herein. The lens array is made from a photosensitive glass plate containing a relatively small amount of a photosensitive agent (e.g., silver, gold or combination thereof) such that when the phot...
07/10/2007
7236434Exposure apparatus of an optical disk master, method of exposing an optical disk master, and wavefront fluctuation correction mechanism
Apparatus and method for exposing an optical disk master having a laser source, a deflector for deflecting a recording laser beam based on the laser beam of the laser source and an objective lens for focusing the recording laser beam on an optical disk master, inclu...
06/26/2007
7229565Chemically assisted surface finishing process
A method of surface refinement for refining a first roughness of a surface of a component to a second roughness. The method includes wetting the first roughness surface with an aqueous mixture that includes solid media. The aqueous mixture chemically alters the surf...
06/12/2007
7220362Planarization with reduced dishing
A method of forming a planarized layer on a substrate, where the substrate is cleaned, and the layer is formed having a surface with high portions and low portions. A resistive mask is formed over the low portions of the layer, but not over the high portions of the ...
05/22/2007
7194798Method for use in making a write coil of magnetic head
Methods suitable for use in making a write coil of a magnetic head includes the steps of forming a seed layer made of ruthenium (Ru) over a substrate; forming, over the seed layer, a patterned resist having a plurality of write coil trenches patterned therein; elect...
03/27/2007
7192860Highly selective silicon oxide etching compositions
Silicon oxide etching solutions containing the product of at least one bifluoride source compound dissolved in a solvent consisting of at least one carboxylic acid, and further comprising from about 0.5 to about 3 percent by solution weight of hydrofluoric acid and ...
03/20/2007
7192885Method for texturing surfaces of silicon wafers
A method for texturing surfaces of silicon wafers comprising the steps of dipping the silicon wafers in an etching solution of water, concentrated hydrofluoric acid and concentrated nitric acid and setting a temperature for the etching solution. The etching solution...
03/20/2007
7186657Method for patterning HfO2-containing dielectric
A wafer has a trench, a STI layer formed in the trench, an HfO2-containing gate dielectric covering the wafer and the STI layer, a gate electrode formed on the HfO2-containing gate dielectric, and at least a spacer formed beside the gate electrode. The wafer is preh...
03/06/2007
7169686Cutting thin layer(s) from semiconductor material(s)
An apparatus for cutting at least one thin layer from a substrate or ingot forming element for an electronic or optoelectronic or optical component or sensor. This apparatus includes a device for directing a pulse of energy into the substrate or forming element wher...
01/30/2007
7171063Controllable electro-optic device having substrate trenches between electrodes
An optical modulator which has substantially low loss and has an improvement in voltage reduction is disclosed having an electro-optic lithium niobate substrate. The substrate has first, second and third ridges extending along its surface. Extending along the first ...
01/30/2007
7161795COG dielectric composition for use with copper electrodes
Multilayer ceramic chip capacitors which satisfy COG requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as copper and copper alloys thereof may be used for internal and external electrodes are made in ac...
01/09/2007
7153440Surfactant-enhanced protection of micromechanical components from galvanic degradation
A microelectromechanical structure is formed by depositing sacrificial and structural material over a substrate to form a structural layer on a component electrically attached with the substrate. The galvanic potential of the structural layer is greater than the gal...
12/26/2006
7138065Method for removing at least one area of a layer of a component consisting of metal or a metal compound
The invention relates to a method for removing an area of a layer of a component consisting of metal or a metal compound. According to prior art, corrosion products of a component are removed in a first step by applying a molten mass or by heating in a voluminous po...
11/21/2006
7132054Method to fabricate hollow microneedle arrays
An inexpensive and rapid method for fabricating arrays of hollow microneedles uses a photoetchable glass. Furthermore, the glass hollow microneedle array can be used to form a negative mold for replicating microneedles in biocompatible polymers or metals. These micr...
11/07/2006
7132034Apparatus for etching a glass substrate
In an apparatus for etching a glass substrate according to the present invention, impurities that are attached to the surface of a glass substrate, which are formed by assembling a color filter substrate and a TFT substrate provided in the etching bath filled with e...
11/07/2006
7118656Thin film stent
A method for fabricating a stent or other medical device by creating a free standing thin film of metal. ...
10/10/2006
7119334Thermal imaging system and method
Systems and methods for thermal sensing and imaging using the electro-optic effect. A thermal detection system comprises a temperature sensing element that includes an electro-optic (EO) material layer having a length axis and characterized by a temperature dependen...
10/10/2006
7098140Method of compensating for etch rate non-uniformities by ion implantation
Etch uniformity is improved in that a specified material layer to be etched is exposed to an ion beam so as to implant an ion species, wherein at least one implantation parameter is varied in conformity with local etch rates of the specified material layer. In this ...
08/29/2006
7081208Method to build a microfilter
Methods are provided for making microfilters by subtractive techniques which remove a component or part of a filter material to form pores in the filter material and additive techniques which deposit a filter material onto a porous underlying substrate. All the meth...
07/25/2006
7074101Method for manufacturing plasma display panel
A method of manufacturing a plasma display panel, whose glass substrate is not tinged and luminance is high, is provided, even when silver material is used. A layer including silver compounds, which include sulfur generated on a surface of an electrode by reacting o...
07/11/2006
7070702Pattern formation method using light-induced suppression of etching
A method of selectively etching a substrate (1) comprises applying etchant (4) at a surface of the substrate and illuminating an area of the surface with light from a light source (7), whereby etching is at least partially inhibited in the illum...
07/04/2006
7071565Patterning three dimensional structures
A three dimensional circuit structure including tapered pillars between first and second signal lines. An apparatus including a first plurality of spaced apart coplanar conductors disposed in a first plane over a substrate; a second plurality of spaced apart coplana...
07/04/2006
7052627Etching solution, etched article and method for etched article
An etching solution which exhibits etching rates for both of a thermally oxidized film (THOX) and a boron-phosphorus-glass film (BPSG) of 100 Å/min or less at 25° C., and an etching rate ratio: etching rate for BPSG/etching rate for a thermally oxidized film (THO...
05/30/2006
7049234Multiple stage electroless deposition of a metal layer
A multiple stage method of electrolessly depositing a metal layer is presented. This method may have the two main stages of first forming a thin metal layer on a metal surface using an electroless plating solution containing activating agents that are highly reactiv...
05/23/2006
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