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Class 216/61 - By electrical means or of an electrical property


Subclass of Class 216 - Etching a substrate: processes
Definition: Process where the test is performed electrically or determines
No. of patents: 177
Last issue date: 03/27/2012


1          
NumberTitleIssue Date
8142674Plasma processing apparatus and plasma processing method
The invention provides a plasma processing apparatus and a plasma processing method capable of controlling the voltage of the processing substrate with high accuracy, thereby enabling a highly accurate plasma processing. According to the invention, a voltage of the ...
03/27/2012
8083961Method and system for controlling the uniformity of a ballistic electron beam by RF modulation
A method and system for treating a substrate using a ballistic electron beam is described, whereby the radial uniformity of the electron beam flux is adjusted by modulating the source radio frequency (RF) power. For example, a plasma processing system is described h...
12/27/2011
8048327Plasma processing apparatus and control method thereof
In a plasma processing apparatus for processing an object to be processed by generating plasma in a processing chamber: a first electrode is arranged in the processing chamber and a second electrode is arranged to face the first electrode in the processing chamber; ...
11/01/2011
7815813End point detection method, end point detection device, and gas phase reaction processing apparatus equipped with end point detection device
An end point detection method in the case where a catalyst arranged in a treatment chamber of a gas phase reaction processing apparatus is heated at high temperature by supplying electric power thereto and the treatment is carried out by cracking a reaction gas by t...
10/19/2010
7442318Method of making thermal print head
A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor layer formation step, a single conductor layer including first and se...
10/28/2008
7440859Method for determining plasma characteristics
Methods for determining characteristics of a plasma are provided. In one embodiment, a method for determining characteristics of a plasma includes obtaining metrics of a plasma at two different frequencies, and determining at least one characteristic of the plasma u...
10/21/2008
7431857Plasma generation and control using a dual frequency RF source
A method and apparatus for generating and controlling a plasma in a semiconductor substrate processing chamber using a dual frequency RF source is provided. The method includes the steps of supplying a first RF signal from the source to an electrode within the proce...
10/07/2008
7422511Element for detecting the amount of lapping having a resistive film electrically connected to the substrate
An element for detecting an amount of lapping of a stacked structure that includes a substrate and a magnetic field detecting sensor is provided. The element comprises: a resistive film that is arranged on a lapping surface of the stacked structure, the resistive fi...
09/09/2008
7413673Method for adjusting voltage on a powered Faraday shield
An apparatus and method for adjusting the voltage applied to a Faraday shield of an inductively coupled plasma etching apparatus is provided. An appropriate voltage is easily and variably applied to a Faraday shield such that sputtering of a plasma can be controlled...
08/19/2008
7402257Plasma state monitoring to control etching processes and across-wafer uniformity, and system for performing same
The present invention is generally directed to plasma state monitoring to control etching processes and across-wafer uniformity, and a system for performing same. In one illustrative embodiment, the method comprises generating a plasma within an etching tool, monito...
07/22/2008
7359177Dual bias frequency plasma reactor with feedback control of E.S.C. voltage using wafer voltage measurement at the bias supply output
A plasma reactor has a dual frequency plasma RF bias power supply furnishing RF bias power comprising first and second frequency components, f(1), f(2), respectively, and an RF power path having an input end coupled to the plasma RF bias power supply a...
04/15/2008
7353771Method and apparatus of providing power to ignite and sustain a plasma in a reactive gas generator
According to a first aspect, a power supply and a method of providing power for igniting a plasma in a reactive gas generator is provided that includes (i) coupling a series resonant circuit that comprises a resonant inductor and a resonant capacitor between a switc...
04/08/2008
7354778Method for determining the end point for a cleaning etching process
A method is provided for determining the end point during cleaning etching of processing chambers by means of plasma etching, which is used for carrying out coating or etching processes during the manufacture of semiconductor components. The invention provides a met...
04/08/2008
7341644Method for predicting consumption of consumable part, method for predicting deposited-film thickness, and plasma processor
There is not known a conventional method for predicting the consumed degree of consumable supplies and the thickness of deposited films without opening a processing chamber. A method for predicting the consumed degree of a consumable supply and the thickness ...
03/11/2008
7338887Plasma control method and plasma control apparatus
A method that controls the distribution of plasma generated in a vacuum chamber, for example, as part of a plasma thin film deposition or plasma etching process. For thin film deposition, the method serves to minimize variations in film thickness caused by the varia...
03/04/2008
7335611Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer
A method of forming a conductor in a thin film structure on a semiconductor substrate includes forming high aspect ratio openings in a base layer having vertical side walls, depositing a dielectric barrier layer comprising a dielectric compound of a barrier metal on...
02/26/2008
7329549Monitoring method of processing state and processing unit
The present invention is a monitoring method of monitoring a change of a processing state of an object to be processed when a predetermined process is conducted to the object to be processed by using a processing unit. The method includes: a step of respectively set...
02/12/2008
7328497Incremental tuning process for electrical resonators based on mechanical motion
A method is provided for adjusting the resonant frequency of a mechanical resonator whose frequency is dependent on the overall resonator thickness. Alternating selective etching is used to remove distinct adjustment layers from a top electrode. One of the electrode...
02/12/2008
7323401Semiconductor substrate process using a low temperature deposited carbon-containing hard mask
A method of processing a thin film structure on a semiconductor substrate using an optically writable mask includes placing the substrate in a reactor chamber, the substrate having on its surface a target layer to be etched in accordance with a predetermined pattern...
01/29/2008
7323116Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage
A method for in-situ monitoring a process in a plasma processing system having a plasma processing chamber is disclosed. The method includes positioning a substrate in the plasma processing chamber. The method also includes striking a plasma within the plasma proces...
01/29/2008
7320734Plasma immersion ion implantation system including a plasma source having low dissociation and low minimum plasma voltage
A system for processing a workpiece includes a plasma immersion ion implantation reactor with an enclosure having a side wall and a ceiling and defining a chamber, and a workpiece support pedestal within the chamber having a workpiece support surface facing the ceil...
01/22/2008
7314537Method and apparatus for detecting a plasma
The present invention presents an improved apparatus and method for monitoring a material processing system, where the material processing system includes a processing tool, test signal source, and a filter/detector. The test signal source providing a first test sig...
01/01/2008
7312162Low temperature plasma deposition process for carbon layer deposition
A method of depositing a carbon layer on a workpiece includes placing the workpiece in a reactor chamber, introducing a carbon-containing process gas into the chamber, generating a reentrant toroidal RF plasma current in a reentrant path that includes a process zone...
12/25/2007
7312148Copper barrier reflow process employing high speed optical annealing
A method of forming a barrier layer for a thin film structure on a semiconductor substrate includes forming high aspect ratio openings in a base layer having vertical side walls, depositing a dielectric barrier layer comprising a dielectric compound of a barrier met...
12/25/2007
7303982Plasma immersion ion implantation process using an inductively coupled plasma source having low dissociation and low minimum plasma voltage
A method for implanting ions in a surface layer of a workpiece includes placing the workpiece on a workpiece support in a chamber with the surface layer being in facing relationship with a ceiling of the chamber, thereby defining a processing zone between the workpi...
12/04/2007
7294563Semiconductor on insulator vertical transistor fabrication and doping process
A process for conformally doping through the vertical and horizontal surfaces of a 3-dimensional vertical transistor in a semiconductor-on-insulator structure employs an RF oscillating torroidal plasma current to perform either conformal ion implantation, or conform...
11/13/2007
7291545Plasma immersion ion implantation process using a capacitively couple plasma source having low dissociation and low minimum plasma voltage
A method of ion implanting a species in a workpiece to a selected ion implantation profile depth includes placing a workpiece having a semiconductor material on an electrostatic chuck in or near a processing region of a plasma reactor chamber and applying a chucking...
11/06/2007
7291360Chemical vapor deposition plasma process using plural ion shower grids
A chemical vapor deposition process is carried out in a reactor chamber having a set of plural parallel ion shower grids that divide the chamber into an upper ion generation region and a lower process region, each of the ion shower grids having plural orifices in mu...
11/06/2007
7288491Plasma immersion ion implantation process
One method of performing plasma immersion ion implantation on a workpiece in a plasma reactor chamber includes initially depositing a seasoning film on the interior surfaces of the plasma reactor chamber before the workpiece is introduced, by introducing a seasoning...
10/30/2007
7286948Method for determining plasma characteristics
Methods for determining characteristics of a plasma are provided. In one embodiment, a method for determining characteristics of a plasma includes obtaining metrics of current and voltage information for first and second waveforms coupled to a plasma at different fr...
10/23/2007
7264676Plasma apparatus and method capable of adaptive impedance matching
A plasma apparatus capable of adaptive impedance matching comprises a plasma reactor which can produce plasma to proceed with CVD (chemical vapor deposition) process, a bi-polar electrostatic chuck which locates inside the plasma reactor and is used to support and s...
09/04/2007
7247218Plasma density, energy and etch rate measurements at bias power input and real time feedback control of plasma source and bias power
A plasma reactor process measurement instrument includes an input phase processor receiving wafer bias voltage, current and power and computing an input impedance, an input current and an input voltage to the transmission line; a transmission line processor for comp...
07/24/2007
7244474Chemical vapor deposition plasma process using an ion shower grid
A chemical vapor deposition process is carried out in a reactor chamber with an ion shower grid that divides the chamber into an upper ion generation region and a lower process region, the ion shower grid having plural orifices oriented in a non-parallel direction r...
07/17/2007
7245133Integration of photon emission microscope and focused ion beam
An integrated FIB/PEM apparatus and method for performing failure analysis on integrated circuits. In-situ failure analysis is enabled by integrating Photon Emission Microscopy into a Focused Ion Beam system, thereby improving throughput and efficiency of Failure An...
07/17/2007
7244475Plasma treatment apparatus and control method thereof
A frequency control circuit (45) controls an oscillation frequency of a second high frequency power source 51 based on a phase difference between a voltage component and a current component measured by a phase difference sensor (41) and an input...
07/17/2007
7223676Very low temperature CVD process with independently variable conformality, stress and composition of the CVD layer
A low temperature process for depositing a coating containing any of silicon, nitrogen, hydrogen or oxygen on a workpiece includes placing the workpiece in a reactor chamber facing a processing region of the chamber, introducing a process gas containing any of silic...
05/29/2007
7220937Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination
A gas distribution ceiling electrode for use as a capacitive source power applicator and gas distribution showerhead in a plasma reactor includes a metal base and a process-compatible protective layer on the interior surface of he electrode having a dopant impurity ...
05/22/2007
7217371Optical control interface between controller and process chamber
The present invention relates to interfacing new sensors to incumbent controls. In particular, it relates to optically interfacing a new sensor, such as a spectrometer with plasma generator, to an incumbent electro-optical sensor. Logic and resources to control acti...
05/15/2007
7196283Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface
An overhead gas distribution electrode forming at least a portion of the ceiling of a plasma reactor has a bottom surface facing a processing zone of the reactor. The electrode includes a gas supply manifold for receiving process gas at a supply pressure at a top po...
03/27/2007
7196896Dechucking method and apparatus for workpieces in vacuum processors
A glass workpiece being processed in a vacuum plasma processing chamber is dechucked from a monopolar electrostatic chuck by gradually reducing the chucking voltage during processing while maintaining the voltage high enough to clamp the workpiece. A reverse polarit...
03/27/2007
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