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| Number | Title | Issue Date |
| 8105498 | Method for fabricating variable parallel plate capacitors A method for fabricating micromachined structures is provided. A structure including a dielectric layer, a metal layer and a passivation layer is formed, wherein the dielectric layer has a via thereon. An etching window is formed on the passivation layer. An etching... | 01/31/2012 |
| 8092704 | System, method and apparatus for fabricating a c-aperture or E-antenna plasmonic near field source for thermal assisted recording applications A method of fabricating a c-aperture or E-antenna plasmonic near field source for thermal assisted recording applications in hard disk drives is disclosed. A c-aperture or E-antenna is built for recording head applications. The technique employs e-beam lithography, ... | 01/10/2012 |
| 7993539 | Methods of etching nanodots, methods of removing nanodots from substrates, methods of fabricating integrated circuit devices, methods of etching a layer comprising a late transition metal, and methods of removing a layer comprising a late transition metal from a substrate Embodiments of the invention include methods of etching nanodots, to methods of removing nanodots from substrates, and to methods of fabricating integrated circuit devices. In one embodiment, a method of etching nanodots that include a late transition metal includes... | 08/09/2011 |
| 7837889 | Methods of etching nanodots, methods of removing nanodots from substrates, methods of fabricating integrated circuit devices, methods of etching a layer comprising a late transition metal, and methods of removing a layer comprising a late transition metal from a substrate Embodiments of the invention include methods of etching nanodots, to methods of removing nanodots from substrates, and to methods of fabricating integrated circuit devices. In one embodiment, a method of etching nanodots that include a late transition metal includes... | 11/23/2010 |
| 7758760 | Thin film transistor array panel and method of manufacturing the same A thin film transistor (TFT) array panel and method of manufacturing the same are provided. The method includes forming a semiconductor layer and an ohmic contact layer over a gate line, forming a conductive layer on the ohmic contact layer, forming a first photosen... | 07/20/2010 |
| 7662301 | Method of making a free standing structure A method of producing a free standing structure, the method comprising: providing a substrate having a raised pattern formed on a surface of said substrate, said raised pattern comprising at least one material which forms said surface; depositing material over said ... | 02/16/2010 |
| 7459099 | Quartz-based nanoresonators and method of fabricating same A method for fabricating a quartz nanoresonator which can be integrated on a substrate, along with other electronics is disclosed. In this method a quartz substrate is bonded to a base substrate. The quartz substrate is metallized so that a bias voltage is applied t... | 12/02/2008 |
| 7442648 | Method for fabricating semiconductor device using tungsten as sacrificial hard mask The present invention relates to a method for fabricating a semiconductor device using tungsten as a sacrificial hard mask material. The method includes the steps of: forming a layer on an etch target layer; forming a photoresist pattern on the layer; etching the la... | 10/28/2008 |
| 7431855 | Apparatus and method for removing photoresist from a substrate An apparatus and method for removing photoresist from a substrate, which includes treating the photoresist with a first reactant to cause swelling, cracking or delamination of the photoresist, treating the photoresist with a second reactant to chemically alter the p... | 10/07/2008 |
| 7419612 | Method of creating pores in a thin sheet of polyimide The invention concerns a method which consists in first subjecting the polyimide sheet to ionic bombardment, followed by an irradiation in the visible domain and finally a relatively brief chemical etching. Said method enables a thin polyimide sheet comprising pores... | 09/02/2008 |
| 7402523 | Etching method A method for etching an insulation film through a patterned mask, includes the steps of etching the insulation film until just before an underlayer is about to be exposed by applying a plasma, and modifying a quality of a remaining film of the insulation film by app... | 07/22/2008 |
| 7378028 | Method for fabricating patterned magnetic recording media A method of fabricating a patterned magnetic layer comprises sequential steps of: (a) providing a workpiece comprising a non-magnetic substrate, a layer of magnetic material overlying a surface of the substrate, and a layer of a non-magnetic material overlyin... | 05/27/2008 |
| 7368064 | Cleaning solution and manufacturing method for semiconductor device A method of manufacturing a semiconductor device forms an interlayer insulating film on a nickel silicide layer formed on a substrate, and forms a through hole by performing dry etching using a resist pattern, formed on the interlayer insulating film, as a mask and ... | 05/06/2008 |
| 7357873 | Polymide thin film self-assembly process The invention presents a novel polyimide-based thin film self-assembly technology, including five process steps described as follows: (1) deposits a sacrificial layer and a low-stress microstructure layer on a silicon substrate; (2) patterns and etches the low-stres... | 04/15/2008 |
| 7347951 | Method of manufacturing electronic device A method of manufacturing an electronic device comprises forming a wiring material layer made of aluminum or an aluminum alloy on the surface of an insulating film on a substrate, patterning the wiring material layer by a reactive ion etching treatment with a resist... | 03/25/2008 |
| 7338610 | Etching method for manufacturing semiconductor device A wafer having a dielectric layer and an electrode partially protruding from the top surface of the dielectric layer is provided. The dielectric layer is etched with a chemical solution such as LAL. Prior to etching, the protruding portion of the electrode is remove... | 03/04/2008 |
| 7323080 | Apparatus for treating substrate The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the waf... | 01/29/2008 |
| 7319573 | Magnetic disk drive having a suspension mounted transmission line including read and write conductors and a lower conductor Embodiments of the invention provide a magnetic disk drive which has improved electrical properties owing to a reduction in the loss of transmission line, improved vibration properties owing to a reduction in the stiffness of wiring around the head, and a flat imped... | 01/15/2008 |
| 7311192 | Systems and methods for providing an improved timing conveyor Methods and apparatus for a conveyor system for evenly spacing conveyed objects are provided. In one embodiment, the conveyor system includes a conveyor belt that includes a conveyor having cavities, rollers in some of cavities, and a positioning component. The conv... | 12/25/2007 |
| 7291565 | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid A method and system is described for treating a substrate with a high pressure fluid, such as carbon dioxide in a supercritical state. A process chemistry is introduced to the high pressure fluid for treating the substrate surface. The process chemistry comprises fl... | 11/06/2007 |
| 7280313 | High aspect ratio co-planar structure fabrication consisting of different materials A a method for fabricating a structure, such as a magnetic head, having two coplanar metallic features of different compositions, both deposited on their own seed layers. The features may be made tall relative to their widths (ie. have a high aspect ratio), and are ... | 10/09/2007 |
| 7276175 | Semiconductor device fabrication method A semiconductor device fabrication method comprises (1) forming a patterned mask layer on an oxide layer of a Mn-containing perovskite type oxide; (2) heat-treating the oxide layer; and (3) patterning the oxide layer with an etching solution containing at least one ... | 10/02/2007 |
| 7271071 | Method of forming a catalytic surface comprising at least one of Pt, Pd, Co and Au in at least one of elemental and alloy forms The invention includes methods of forming a substrate having a surface comprising at least one of Pt, Pd, Co and Au in at least one of elemental and alloy forms. In one implementation, a substrate is provided which has a first substrate surface comprising at least o... | 09/18/2007 |
| 7267726 | Method and apparatus for removing polymer residue from semiconductor wafer edge and back side A method for cleaning a semiconductor device has the steps of securing a wafer (16) with a modified chuck (11) and applying a cleaning solution (18) to the backside (20) of the wafer (16). The cleaning solution (18) is formu... | 09/11/2007 |
| 7264007 | Method and apparatus for cleaning a substrate using megasonic power A method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process t... | 09/04/2007 |
| 7258809 | MRAM wet etch method An etching process is employed to selectively pattern the top magnetic film layer, the tunnel barrier, and the pinned bottom magnetic layer of a magnetic thin film structure. The pinned bottom magnetic film layer has an antiferromagnetic layer or a Ru spacer formed ... | 08/21/2007 |
| 7255772 | High pressure processing chamber for semiconductor substrate A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical... | 08/14/2007 |
| 7255805 | Photonic structures, devices, and methods Photonic crystal structures are made by a method including steps of providing a substrate, depositing at least one planar layer to form a stack, each planar layer of the stack comprising two or more sublayers having different sublayer refractive indices, depositing ... | 08/14/2007 |
| 7252774 | Selective chemical etch method for MRAM soft layers An etching process is employed to selectively pattern the exposed magnetic film layer of a magnetic thin film structure. The magnetic structure to be etched includes at least one bottom magnetic film layer and at least one top film layer which are separated by a tun... | 08/07/2007 |
| 7250114 | Methods of finishing quartz glass surfaces and components made by the methods Methods of surface finishing a component useful for a plasma processing apparatus are provided. The component includes at least one plasma-exposed quartz glass surface. The method includes mechanically polishing, chemically etching and cleaning the plasma-exposed su... | 07/31/2007 |
| 7249669 | Apparatus and methods for high speed conveyor switching Disclosed are conveyors and methods for making and using a conveyor. In some embodiments, the conveyor comprises a modular conveyor belt that includes at least one mat-top chain having at least one cavity and at least one first roller disposed in the cavity of the m... | 07/31/2007 |
| 7250374 | System and method for processing a substrate using supercritical carbon dioxide processing A method and system for processing a substrate in a film removal system. The method includes providing the substrate in a substrate chamber of a film removal system, where the substrate has a micro-feature containing a dielectric film on a sidewall of the micro-feat... | 07/31/2007 |
| 7247248 | Method of forming atomic force microscope tips The invention relates to a method for forming silicon atomic force microscope tips. The method includes the steps of depositing a masking layer onto a first layer of doped silicon so that some square or rectangular areas of the first layer of doped silicon are not c... | 07/24/2007 |
| 7247247 | Selective etching method A selective etching method with lateral protection function is provided. The steps includes: (a) providing a substrate; (b) forming a plurality of tunnels; (c) forming a lateral strengthening structure at a peripheral wall of the tunnels; (d) removing a bottom porti... | 07/24/2007 |
| 7240679 | System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold One of many embodiments of a substrate preparation system is provided which includes a drying system, the drying system including at least one proximity head for drying a substrate. The system also includes a cleaning system for cleaning the substrate. ... | 07/10/2007 |
| 7235188 | Aqueous phosphoric acid compositions for cleaning semiconductor devices The present invention relates to dilute aqueous solutions containing phosphoric acid and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The solution according to the invention may advantageous contain ... | 06/26/2007 |
| 7234477 | Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface ... | 06/26/2007 |
| 7223352 | Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal A post-etch residue cleaning composition for cleaning ashed or unashed aluminum/SiN/Si post-etch residue from small dimensions on semiconductor substrates. The cleaning composition contains supercritical CO2 (SCCO2), alcohol, fluoride source, an aluminum ... | 05/29/2007 |
| 7220714 | Process and composition for removing residues from the microstructure of an object A process for removing residues from the microstructure of an object is provided, which comprises steps of preparing a remover including carbon dioxide, an additive for removing the residues and a co-solvent dissolving the additive in said carbon dioxide at a pressu... | 05/22/2007 |
| 7214324 | Technique for manufacturing micro-electro mechanical structures A technique for manufacturing a micro-electro mechanical structure includes a number of steps. Initially, a cavity is formed into a first side of a handling wafer, with a sidewall of the cavity forming a first angle greater than about 54.7 degrees with respect to a ... | 05/08/2007 |
