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| Number | Title | Issue Date |
| 8017028 | Method of increasing etchability of metals having chemical etching resistant microstructure A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substr... | 09/13/2011 |
| 7699997 | Method of reclaiming silicon wafers A method of reclaiming silicon wafers including a film removal process, a polishing process, and a cleaning process, wherein a heating/removal process for removing a silicon wafer surface part by heating at 150-300° C. for 20 minutes to 5 hours is further included ... | 04/20/2010 |
| 7438822 | Apparatus and method for shielding a wafer from charged particles during plasma etching A plasma etching system having a wafer chuck with a magnet that applies a magnetic field over a wafer to shield the wafer from charged particles. The magnetic field is parallel with the wafer, and is strongest near the wafer surface. The magnetic field may be straig... | 10/21/2008 |
| 7353863 | Method of surface treating aluminum alloy base body of heat exchanger and heat exchanger produced by the method A method of surface treating an aluminum alloy base body of an heat exchanger which method enables an etching procedure to be carried out uniformly and quickly and a corrosion-resistant chemical conversion coating to be formed, is effected by pretreating the Al heat... | 04/08/2008 |
| 7329361 | Method and apparatus for fabricating or altering microstructures using local chemical alterations A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure. ... | 02/12/2008 |
| 7316784 | Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof A method of patterning a transparent conductive film adaptive for selectively etching a transparent conductive film without any mask processes, a thin film transistor for a display device using the same and a fabricating method thereof are disclosed. In the method o... | 01/08/2008 |
| 7262137 | Dry etching process for compound semiconductors Accordingly, this invention relates to an dry etching process for semiconductor wafers. More particularly, the present invention discloses a dry etching process including a halogen etchant (24) and a nitrogen gas (28) that selectively etches a compound... | 08/28/2007 |
| 7229848 | Method and apparatus for fabricating self-assembling microstructures A method and apparatus for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate. The impr... | 06/12/2007 |
| 7138065 | Method for removing at least one area of a layer of a component consisting of metal or a metal compound The invention relates to a method for removing an area of a layer of a component consisting of metal or a metal compound. According to prior art, corrosion products of a component are removed in a first step by applying a molten mass or by heating in a voluminous po... | 11/21/2006 |
| 7132054 | Method to fabricate hollow microneedle arrays An inexpensive and rapid method for fabricating arrays of hollow microneedles uses a photoetchable glass. Furthermore, the glass hollow microneedle array can be used to form a negative mold for replicating microneedles in biocompatible polymers or metals. These micr... | 11/07/2006 |
| 7033514 | Method and apparatus for micromachining using a magnetic field and plasma etching This invention relates to a method and apparatus for forming a micromachined device, where a workpiece is plasma etched to define a microstructure. The plasma etching is conducted in the presence of a magnetic field, which can be generated and manipulated by an elec... | 04/25/2006 |
| 7024266 | Substrate processing apparatus, method of controlling substrate, and exposure apparatus A substrate processing apparatus includes a first chamber, a second chamber which has a first valve, a second valve and a chuck, wherein a substrate is transferred to the second chamber through the first valve, held by the chuck in the second chamber, and then trans... | 04/04/2006 |
| 6969471 | Process for manufacturing printed circuit boards with protected spaces between tracks It comprises the steps of: a) arranging a dielectric substrate (1) with at least one conducting plate (2) joined by an adhesive (8) to at least one of its sides; b) removing areas of said plate (2) by selective chemical milling to provide... | 11/29/2005 |
| 6969539 | Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide Metal silicates or phosphates are deposited on a heated substrate by the reaction of vapors of alkoxysilanols or alkylphosphates along with reactive metal amides, alkyls or alkoxides. For example, vapors of tris-(ter-butoxy)silanol react with vapors of tetrakis(ethy... | 11/29/2005 |
| 6943039 | Method of etching ferroelectric layers Method of etching a ferroelectric layer includes etching an upper electrode and partially through a ferroelectric layer. A dielectric material is subsequently deposited upon the upper electrode and the partially etched ferroelectric layer. A second etch step complet... | 09/13/2005 |
| 6932933 | Ultraviolet method of embedding structures in photocerams A laser direct write method creates true three dimensional structures within photocerams using an focused pulsed ultraviolet laser with a wavelength in a weakly absorbing region of the photoceram material. A critical dose of focused laser UV light selectively expose... | 08/23/2005 |
| 6933190 | Semiconductor device having a capacitor with rare metal electrode A method of manufacturing a semiconductor device, includes the steps of: (a) forming a first inter-level insulating film on a semiconductor substrate formed with semiconductor elements; (b) forming a contact hole through the first inter-level insulating film; (c) fo... | 08/23/2005 |
| 6927150 | Method of manufacturing a semiconductor device Disclosed is a method of manufacturing a semiconductor device. In ion implantation process for controlling the threshold voltage of the transistor or the semiconductor device such as a flash memory cell, the dose of the impurity capable of securing the uniformity is... | 08/09/2005 |
| 6821448 | Methods for producing thin film magnetic devices having increased orientation ratio A method of producing a thin film magnetic device comprising forming a thin film of magnetic material over a surface of a substrate having a controlled surface topography, wherein the surface of the substrate is first subject to isotropic etching so as to increase t... | 11/23/2004 |
| 6821446 | Removal method for coating of polymer coated glass capillary tubing and polymer coated glass capillary tubing The present invention provides a method for producing a high-quality capillary tube used in an electrophoresis apparatus in a safe and inexpensive manner. A polymer coating on a capillary tube is converted into gas and removed through an oxidative reaction with oxyg... | 11/23/2004 |
| 6773871 | Method of machining glass A low cost, durable mask for use in structuring anodically bondable glass materials and other structurable glass materials. ... | 08/10/2004 |
| 6743485 | Pre-treatment for salicide process A method for treating a silicon substrate is described. The silicon substrate is placed into a sputtering equipment. A sputtering step is performed to simultaneously dry clean and amorphize the silicon substrate surface by using the sputtering equipment. A titanium ... | 06/01/2004 |
| 6736982 | Micromachined vertical vibrating gyroscope A micromachined vertical vibrating gyroscope consists of three single crystal silicon assemblies: an outer single crystal silicon assembly, an intermediate single crystal silicon assembly, and an inner single crystal silicon assembly. The outer assembly includes a p... | 05/18/2004 |
| 6709609 | Plasma heating of a substrate with subsequent high temperature etching We have discovered a method of reducing the effect of material sputtered/etched during the preheating of a substrate. One embodiment of the method pertains to preheating a substrate which includes a metal-containing layer which is to be pattern etched subsequent to ... | 03/23/2004 |
| 6699398 | Effective dry etching process of actinide oxides and their mixed oxides in CF4/O2/N2 plasma A process for gas-phase etching of actinide oxides from a substrate by using plasma power comprising the steps of: a) preheating actinide oxides on the substrate within a process chamber filled with fluorine-containing gas and exposing it to plasma power,... | 03/02/2004 |
| 6692648 | Method of plasma heating and etching a substrate We have discovered a method of reducing the effect of material sputtered/etched during the preheating of a substrate. One embodiment of the method pertains to the preheating of a substrate which includes a material which is to be pattern etched at a tempe... | 02/17/2004 |
| 6663792 | Equipment for UV wafer heating and photochemistry The apparatus of the present invention provides for the dual use of a UV source to heat a substrate and to facilitate photochemistry necessary for the treatment of the substrate. The present invention also provides a method for processing a substrate by h... | 12/16/2003 |
| 6632375 | Method for forming a concave micro-relief in a substrate and use of said method for producing optical components Process for the formation of at least one concave relief (124, 145) in a substrate comprising forming at least one embossment of material subject to creep (100) on the substrate (120), --heating of the material subject to creep to a temperature sufficient... | 10/14/2003 |
| 6602428 | Method of manufacturing sensor having membrane structure A sensor for measuring a physical amount such as an amount of air includes a membrane structure composed of metal stripes sandwiched between first and second insulating layers. A metal layer made of platinum or the like is formed on the first insulating l... | 08/05/2003 |
| 6582617 | Plasma etching using polycarbonate mask and low-pressure high density plasma Provided is a method of etching an etch layer using a polycarbonate layer as a mask. The method includes placing an etch structure in a reaction chamber, the etch structure including an etch layer underlying a polycarbonate layer, the polycarbonate layer ... | 06/24/2003 |
| 6557225 | Method of producing surface acoustic wave device A method of producing a surface acoustic wave device by use of a flip chip process, includes the steps of forming on a piezoelectric substrate at least one interdigital transducer and a plurality of electrode pads electrically connected to the interdigita... | 05/06/2003 |
| 6553332 | Method for evaluating process chambers used for semiconductor manufacturing A process chamber (12) is used for plasma etching of a wafer (21) disposed therein. A gas mixture supplied to the chamber eventually passes through openings (28) in a baffle plate (27). After the chamber has been cleaned, several test wafers are etched un... | 04/22/2003 |
| 6547978 | Method of heating a semiconductor substrate Copper can be pattern etched in a manner which provides the desired feature dimension and integrity, at acceptable rates, and with selectivity over adjacent materials. To provide for feature integrity, the portion of the copper feature surface which has b... | 04/15/2003 |
| 6488861 | Coupling system to a microsphere cavity A system of coupling optical energy in a waveguide mode, into a resonator that operates in a whispering gallery mode. A first part of the operation uses a fiber in its waveguide mode to couple information into a resonator e.g. a microsphere. The fiber is ... | 12/03/2002 |
| 6409932 | Method and apparatus for increased workpiece throughput A method is disclosed for speeding workpiece thoughput in low pressure, high temperature semiconductor processing reactor. The method includes loading a workpiece into a chamber at atmospheric pressure, bringing the chamber down to an intermediate pressur... | 06/25/2002 |
| 6406637 | Thin film-planar structure and method for producing the same A thin film made of an amorphous material having a supercooled liquid phase region is formed on a substrate. Then, the thin film is processed by wet-etching, etc. to form a thin film-processed body having, for example, a one side-fixed beam like shape. Su... | 06/18/2002 |
| 6392187 | Apparatus and method for utilizing a plasma density gradient to produce a flow of particles An apparatus and method which uses a plasma having a density gradient in order to accelerate ions, thereby producing a flow of energetic ions and neutral parties. The plasma gradient is produced by applying a non-uniform magnetic field to the plasma and/o... | 05/21/2002 |
| 6355121 | Modified etching bath for the deposition of a protective surface chemistry that eliminates hydrogen absorption at elevated temperatures A method of controlling bulk absorption of atomic hydrogen and facilitating degassing of hydrogen from aluminum alloy workpieces during heat treatments in furnaces with ambient and/or moisture-laden atmospheres to prepare for fabrication in sequential wor... | 03/12/2002 |
| 6254739 | Pre-treatment for salicide process A method for treating a silicon substrate is described. The silicon substrate is placed into a sputtering equipment. A sputtering step is performed to simultaneously dry clean and amorphize the silicon substrate surface by using the sputtering equipment. ... | 07/03/2001 |
| 6171511 | Thermal etching process of a ceramic under oxidizing conditions The invention relates to a process for thermal etching under oxidizing conditions of a ceramic, more particularly with the aim of revealing its grain boundaries and for the study of its granular microstructure. The invention applies to technical and nucle... | 01/09/2001 |
