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Class 216/49 - Mask resist contains organic compound


Subclass of Class 216 - Etching a substrate: processes
Definition: Process wherein the resist material contains an organic
No. of patents: 349
Last issue date: 09/23/2008


1                  
NumberTitleIssue Date
7427360Process and ink for making electronic devices
A process for making an electronic device comprising a dielectric substrate laminated with an electrically conductive metal or alloy which comprises applying a non-aqueous etch-resistant ink by ink jet printing to selected areas of the metal or alloy, exposing the e...
09/23/2008
7427477Method of activating a silicon surface for subsequent patterning of molecules onto said surface
The present invention relates to a method of activating a silicon surface for subsequent patterning of molecules onto said surface, and to patterns produced by this method, and further to uses of said pattern. ...
09/23/2008
7405161Method for fabricating a semiconductor device
Method for fabricating a semiconductor device in which a by-product of etching is deposited on a photoresist film for using as a mask. The method for fabricating a semiconductor device includes the steps of depositing a polysilicon, and a bottom anti-refection coati...
07/29/2008
7396475Method of forming stepped structures employing imprint lithography
The present invention provides a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the substrate. ...
07/08/2008
7393795Methods for post-etch deposition of a dielectric film
Methods for post-etch deposition on a dielectric film are provided in the present invention. In one embodiment, the method includes providing a substrate having a low-k dielectric layer disposed thereon in a etch reactor, etching the low-k dielectric layer in the et...
07/01/2008
7378028Method for fabricating patterned magnetic recording media
A method of fabricating a patterned magnetic layer comprises sequential steps of: (a) providing a workpiece comprising a non-magnetic substrate, a layer of magnetic material overlying a surface of the substrate, and a layer of a non-magnetic material overlyin...
05/27/2008
7371400Multilayer device for tissue engineering
The invention provides for translating two-dimensional microfabrication technology into the third dimension. Two-dimensional templates are fabricated using high-resolution molding processes. These templates are then bonded to form three-dimensional scaffold structur...
05/13/2008
7367781Packaged micromachined device such as a vacuum micropump, device having a micromachined sealed electrical interconnect and device having a suspended micromachined bonding pad
A number of micromachined devices including a micromachined pump for on-chip vacuum is provided. For example, a single-chip micromachined implementation of a Knudsen pump having one or more stages and which uses the principle of thermal transpiration with no moving ...
05/06/2008
7357877Dispersion of nanowires of semiconductor material
A method of manufacturing nanowires (104) is provided, according to which method the nanowires are prepared by anodic etching a semiconductor substrate (10) with an alternating current density, so as to create first regions (4) and second region...
04/15/2008
7354525Specimen surface processing apparatus and surface processing method
For a surface processing apparatus using a plasma, a mixed gas of a fluorine-containing gas and an oxygen gas is used as an ashing gas. A mixed gas of an oxygen gas and a fluorine-containing gas is introduced as an ashing gas. This allows the following steps to be c...
04/08/2008
7353863Method of surface treating aluminum alloy base body of heat exchanger and heat exchanger produced by the method
A method of surface treating an aluminum alloy base body of an heat exchanger which method enables an etching procedure to be carried out uniformly and quickly and a corrosion-resistant chemical conversion coating to be formed, is effected by pretreating the Al heat...
04/08/2008
7351303Microfluidic systems and components
Microfluidic systems and components. A microfluidic system includes one or more functional units or microfluidic chips, configured to perform constituent steps in a process and interconnected to form the system. A multi-layer microfluidic system includes a separate ...
04/01/2008
7343248Distributed database for analytical instruments
Techniques for controlling analytical instruments are provided. A sequence of steps can be utilized to specify wells of a microfluidic device, mobility to be applied to fluid in the wells, and the duration to apply the mobility. For example, fluids can be sequential...
03/11/2008
7338614Vapor HF etch process mask and method
A method of processing a semiconductor wafer provides a wafer, and then forms an organic mask on at least a portion of the wafer. The method then applies a vapor etching process to the wafer through holes in the organic mask. ...
03/04/2008
7335980Hardmask for reliability of silicon based dielectrics
The present invention provides a hardmask that is located on a surface of a low k dielectric material having at least one conductive feature embedded therein. The hardmask includes a lower region of a hermetic oxide material located adjacent to the low k dielectric ...
02/26/2008
7329545Methods for sampling a liquid flow
In a method for sampling a continuous liquid flow, the liquid flow is supplied to a surface along an input flow path. The liquid flow is sampled by forming a sample droplet from a portion of the liquid flow. The sample droplet is moved along an analysis flow path to...
02/12/2008
7318912Microfluidic systems and methods for combining discrete fluid volumes
Microfluidic devices capable of combining discrete fluid volumes generally include channels for supplying different fluids toward a sample chamber and means for establishing fluid communication between the fluids within the chamber. Discrete fluid plugs are defined ...
01/15/2008
7316784Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof
A method of patterning a transparent conductive film adaptive for selectively etching a transparent conductive film without any mask processes, a thin film transistor for a display device using the same and a fabricating method thereof are disclosed. In the method o...
01/08/2008
7311850Method of forming patterned thin film and method of fabricating micro device
In a method of forming a patterned thin film, first, an etching stopper film and a film to be patterned are formed in this order on a base layer. Next, a patterned first film is formed on the film to be patterned. Next, a second film is formed over an entire surface...
12/25/2007
7306742Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
A template 1 is brought close to or in contact with a surface to be patterned 111 and patterns are formed with liquid 62 on the surface 111. This method comprises the steps of: bringing the template 1 close to or essentially in con...
12/11/2007
7303689Method of manufacturing a nozzle assembly
A method of manufacturing a nozzle assembly, the method comprising the steps of depositing a first dielectric layer 18 on a substrate 16, depositing a first metal layer 102 at least partially on the first dielectric layer 18, depositing a...
12/04/2007
7300881Plasma etching method
A plasma etching is performed on a substrate having a pattern wherein an interval between neighboring openings formed on a resist mask is equal to or less than 200 nm, wherein the etching is performed by converting a processing gas comprising an active species gener...
11/27/2007
7297635Processing method
A processing method which, when an organic film layer such as a PR film layer 202 formed on the surface of a wafer W is to be removed from an SiO2 film layer 204 below it by generating plasma of a process gas in a chamber 1 comprises ...
11/20/2007
7291517Method for removing resin mask layer and method for manufacturing solder bumped substrate
Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the su...
11/06/2007
RE39913Method to control gate CD
The invention is a process for reducing variations in CD from wafer to wafer. It begins by increasing all line widths in the original pattern data file by a fixed amount that is sufficient to ensure that all lines will be wider than the lowest acceptable CD value. U...
11/06/2007
7270761Fluorine free integrated process for etching aluminum including chamber dry clean
A fluorine-free integrated process for plasma etching aluminum lines in an integrated circuit structure including an overlying anti-reflection coating (ARC) and a dielectric layer underlying the aluminum, the process being preferably performed in a single plasma rea...
09/18/2007
7262068Microneedle array module and method of fabricating the same
A microneedle array module is disclosed comprising a multiplicity of microneedles affixed to and protruding outwardly from a front surface of a substrate to form the array, each microneedle of the array having a hollow section which extends through its center to an ...
08/28/2007
7258808High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
A high-power BGA includes a printed circuit board with a through hole, connection pads formed on the bottom of the printed circuit board, matrix solder balls surrounding the through hole and adjacent to the connection pads, a heat spreader on the top surface of the ...
08/21/2007
7255804Process for making photonic crystal circuits using an electron beam and ultraviolet lithography combination
A process for making photonic crystal circuit and a photonic crystal circuit consisting of regularly-distributed holes in a high index dielectric material, and controllably-placed defects within this lattice, creating waveguides, cavities, etc. for photonic devices....
08/14/2007
7247247Selective etching method
A selective etching method with lateral protection function is provided. The steps includes: (a) providing a substrate; (b) forming a plurality of tunnels; (c) forming a lateral strengthening structure at a peripheral wall of the tunnels; (d) removing a bottom porti...
07/24/2007
7244368Manufacturing process of a magnetic head, magnetic head, pattern formation method
A manufacturing method of a magnetic head includes a process for forming a lift-off mask pattern on a magnetoresistance effect element, such that the upper part of the lift-off mask pattern is larger in size than the lower part, a process for forming a couple of ele...
07/17/2007
7238293Slotted substrate and method of making
The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less t...
07/03/2007
7238292Method of fabricating a write element with a reduced yoke length
A head including a write element for writing data to a magnetic media, and methods for its production are provided. A write element of the invention includes one or more of a recessed first pole, a heat sink layer, and a shortened yoke length. A method of the invent...
07/03/2007
7232768Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials
A method (100) of fabricating an electronic device (200) formed on a semiconductor wafer. The method forms a layer (215) of a first material in a fixed position relative to the wafer. The first material has a dielectric constant less than 3.6. T...
06/19/2007
7229564Method for manufacturing bipolar plate and direct methanol fuel cell
A DMFC (direct methanol fuel cell) includes two bipolar plates, a membrane electrode assembly, a bonding layer, and a fuel container base. The bipolar plate is a releasable substrate that includes a releasable copper carrier, a release layer, and a metal foil. The b...
06/12/2007
7220334Method of manufacturing microdevice having laminated structure
The present invention provides a method of manufacturing a microdevice having a fine capillary cavity formed as a cut portion of a very thin layer which is likely to be broken, particularly a method of manufacturing a microdevice having complicated passages formed i...
05/22/2007
7198965Method for making a neo-layer comprising embedded discrete components
A stackable neo-layer comprising one or more embedded discrete electrical components is provided. A plurality of conductive traces, some of which terminate at a peripheral edge of the layer, are formed on sacrificial substrate in a series of process steps and discre...
04/03/2007
7195715Method for manufacturing quartz oscillator
A method for manufacturing quartz oscillators is provided which permits quartz oscillators having an oscillation frequency, as designed, to be obtained with small variation of individual oscillation frequency and with high reliability. The method for manufacturing q...
03/27/2007
7189435Nanofabrication
Pathways to rapid and reliable fabrication of three-dimensional nanostructures are provided. Simple methods are described for the production of well-ordered, multilevel nanostructures. This is accomplished by patterning block copolymer templates with selective expos...
03/13/2007
7189367Reactor and process for production thereof
In order to be capable of a chemical reaction, analysis or the like wherein a small amount of samples is used, a reactor comprises a flat plate-like first substrate the inside of which is provided with a heating means; and a flat plate-like second substrate, which i...
03/13/2007
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