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| Number | Title | Issue Date |
| 8173035 | Surface texturization method A surface texturization method is provided. First, a polymer film is formed on a substrate. Thereafter, a heating treatment is performed on the substrate. The heating treatment results in a textured polymer film having island-shaped and/or microcrack-shaped patterns... | 05/08/2012 |
| 8173034 | Methods of utilizing block copolymer to form patterns Some embodiments include methods of utilizing block copolymer to form patterns between weirs. The methods may utilize liners along surfaces of the weirs to compensate for partial-width segments of the patterns in regions adjacent the weirs. Some embodiments include ... | 05/08/2012 |
| 8163190 | Method for fabricating a fine pattern In a method for fabricating a fine pattern, a target layer to be patterned is formed on a semiconductor substrate. A sacrificial pattern is formed on the target layer. The sacrificial pattern includes first sacrificial patterns arranged at a first spacing, and secon... | 04/24/2012 |
| 8163189 | Method for producing a nanoporous substrate Nanoporous substrate with fine pores having a diameter from 3 to 40 nm arranged with less than 60 nm periodicity is prepared by a method comprising the steps of coating amphipathic block copolymer on a substrate, forming a film containing hydrophilic cylinders align... | 04/24/2012 |
| 8158014 | Multi-exposure lithography employing differentially sensitive photoresist layers A stack of a second photoresist having a second photosensitivity and a first photoresist having a first photosensitivity, which is greater than second photosensitivity, is formed on a substrate. A first pattern is formed in the first photoresist by a first exposure ... | 04/17/2012 |
| 8142673 | Compositions for dissolution of low-k dielectric films, and methods of use An improved composition and method for cleaning the surface of a semiconductor wafer are provided. The composition can be used to selectively remove a low-k dielectric material such as silicon dioxide, a photoresist layer overlying a low-k dielectric layer, or both ... | 03/27/2012 |
| 8137641 | Microfluidic module including an adhesiveless self-bonding rebondable polyimide A method of making a microfluidic module is disclosed that includes forming a fluid flow channel in a self-bonding rebondable polyimide film to provide a channel sheet, the self-bonding rebondable polyimide film having a first mask layer self-bonded thereto; removin... | 03/20/2012 |
| 8133402 | Pattern forming method, charged particle beam writing apparatus, and recording medium on which program is recorded A pattern forming method includes performing a first resist development during a first time period to a substrate obtained by coating a resist film having a predetermined thickness onto a predetermined film to be etched, measuring the film thickness of the resist fi... | 03/13/2012 |
| 8128832 | Processes and materials for step and flash imprint lithography A method of forming an image. The method includes: a transfer layer on a substrate; forming on the transfer layer, an etch barrier layer; pressing a template having a relief pattern into the etch barrier layer; exposing the etch barrier layer to actinic radiation fo... | 03/06/2012 |
| 8128831 | Plasma etching method and computer-readable storage medium A plasma processing apparatus includes a first and a second electrode disposed to face each other in a processing chamber, the second electrode supporting a substrate; a first RF power supply for applying a first RF power of a higher frequency to the second electrod... | 03/06/2012 |
| 8114306 | Method of forming sub-lithographic features using directed self-assembly of polymers Methods involving the self-assembly of block copolymers are described herein, in which by beginning with openings (in one or more substrates) that have a targeted CD (critical dimension), holes are formed, in either regular arrays or arbitrary arrangements. Signific... | 02/14/2012 |
| 8097176 | Digital mold texturizing methods, materials, and substrates Methods, materials, and systems for texturizing mold surfaces is disclosed. In one method and system of the invention, a first step involves generating a graphics file of a desired texture pattern. The graphics file is subsequently output to an ink jet printer, whic... | 01/17/2012 |
| 8092703 | Manufacturing method of semiconductor device It is an object of the present invention to provide a method of manufacturing a semiconductor device that reduces the deterioration in processed configuration and the pattern roughness of a film to be processed, and is close to the original design and applicable to ... | 01/10/2012 |
| 8083959 | Substrate processing method, substrate processing system, and computer-readable storage medium In the present invention, a plurality of rounds of patterning are performed on a substrate. In a patterning system, the substrate on which a first round of patterning has been performed is transferred to a planarizing film forming unit, where a planarizing film is f... | 12/27/2011 |
| 8083958 | Patterning method using a combination of photolithography and copolymer self-assemblying lithography techniques Disclosed are embodiments of a lithographic patterning method that incorporates a combination of photolithography and self-assembling copolymer lithography techniques in order to create, on a substrate, a grid-pattern mask having multiple cells, each with at least o... | 12/27/2011 |
| 8070972 | Etching method and etching apparatus The present invention relates to an etching method for etching a film to form a concave portion therein with the use of a photoresist mask provided with an opening. In this method, there is determined, in advance, a first correlation between a parameter value and an... | 12/06/2011 |
| 8070971 | Etch method An improved method of etching a structure and a structure etched by the method is disclosed. The bottom side of a leadframe of an IC-package is an example of a structure, which advantageously may be etched with the disclosed method. The method includes the steps of ... | 12/06/2011 |
| 8062538 | Etching apparatus and method for semiconductor device Disclosed is an etching method for a semiconductor device. The protecting layer, such as the hydrocarbon layer or the hydrocarbon layer containing phosphorous, is formed on the photoresist layer by using the precursor gas containing no fluorine. Therefore, the etchi... | 11/22/2011 |
| 8057691 | Method of manufacturing printing plate and method of manufacturing liquid crystal display device using the same A method of manufacturing a precise printing plate, and a method of manufacturing an LCD device using the same are disclosed, the method of manufacturing the precise printing plate comprising forming a mask layer of a predetermined pattern on a substrate; etching th... | 11/15/2011 |
| 8057690 | Single silicon-on-insulator (SOI) wafer accelerometer fabrication Methods for creating at least one micro-electromechanical (MEMS) structure in a silicon-on-insulator (SOI) wafer. The SOI wafer with an extra layer of oxide is etched according to a predefined pattern. A layer of oxide is deposited over exposed surfaces. An etchant ... | 11/15/2011 |
| 8038893 | Method for producing semiconductor optical device To grasp a removable particle contamination and appropriately removing a particle contamination exposing from a surface of a semiconductor layer, this production method of the semiconductor optical device includes a surface treatment step in which particle contamina... | 10/18/2011 |
| 8007674 | Method and devices for preventing restenosis in cardiovascular stents Described herein are devices and methods fabricating devices having nanostructures that allow adhesion or growth of one cell type, such as endothelial cells, more than another cell type, such as smooth muscle cells. In particular, stent covers having such nanostruct... | 08/30/2011 |
| 7993538 | Patterning by energetically-stimulated local removal of solid-condensed-gas layers and solid state chemical reactions produced with such layers The invention provides a method for forming a patterned material layer on a structure, by condensing a vapor to a solid condensate layer on a surface of the structure and then localized removal of selected regions of the condensate layer by directing a beam of energ... | 08/09/2011 |
| 7981304 | Process for producing a chip using a mold A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and a... | 07/19/2011 |
| 7943054 | Method for manufacturing semiconductor integrated circuit device Cracks are generated in a resist film part used to form an opening part in a photoreceptor part, whereby etching is performed as far as the inter-layer insulating film in unintended portions. In order to prevent this, the resist pattern used as an etching mask is fo... | 05/17/2011 |
| 7943053 | Method of forming a micro pattern in semiconductor device A method of forming a micro pattern in a semiconductor device includes forming an etching object layer and a hard mask layer on a semiconductor substrate. Cross-shaped first auxiliary patterns are formed on the hard mask layer. An insulating layer is formed on the h... | 05/17/2011 |
| 7931819 | Method for pattern formation There is provided a method for pattern formation, including a step of coating a composition comprising a block copolymer, a silicon compound, and a solvent for dissolving these components onto an object to form a layer of the composition on the object, a step of sub... | 04/26/2011 |
| 7914691 | Printing plate and method for fabricating the same A printing plate and method for fabricating the same is disclosed. A metal layer is first formed on a glass substrate. The metal layer is then patterned in a predetermined shape. The glass substrate is next etched to a predetermined depth using the patterned metal l... | 03/29/2011 |
| 7910012 | Composition, membrane, and associated method A composition is provided. The composition may include a reaction product of a first composition having two or more anhydride moieties, a second composition having two or more hydroxyl moieties, and a third composition having at least one aziridine moiety. A method ... | 03/22/2011 |
| 7906031 | Aligning polymer films A Method. The method includes forming a substructure, on a substrate, including a feature having a sidewall of a first material and a bottom surface of a second material. Applying a solution including two immiscible polymers and third material to the substructure. T... | 03/15/2011 |
| 7897058 | Device manufacturing method and computer program product A method of forming features, e.g. contact holes, at a higher density than is possible with conventional lithographic techniques involves forming an array of sacrificial positive features, conformally depositing a sacrificial layer so that negative features are form... | 03/01/2011 |
| 7875197 | Methods of etching articles via microcontact printing Improved methods of forming a patterned self-assembled monolayer on a surface and derivative articles are provided. According to one method, an elastomeric stamp is deformed during and/or prior to using the stamp to print a self-assembled molecular monolayer on a su... | 01/25/2011 |
| 7867408 | Anisotropic wet etching of silicon A silicon oxide film is formed on one principal surface of a silicon substrate by thermal oxidation, and thereafter, a silicon nitride film is formed on the silicon oxide film by CVD. A lamination layer of the silicon oxide film and silicon nitride film is selective... | 01/11/2011 |
| 7862735 | Method for forming contact hole on semiconductor device A method of forming a relatively fine contact hole using two masks. The two masks may have only their edge portions open, which may overlap each other. ... | 01/04/2011 |
| 7850862 | Textured surface having undercut micro recesses in a surface Textured surface having micro recesses such that the outer surface overhangs the micro recesses. Embodiments of the textured surface include sharp edges for promoting bone deposition and growth within the micro recesses, protrusions of varying depth from the surface... | 12/14/2010 |
| 7846345 | Method of manufacturing an imprinting template using a semiconductor manufacturing process and the imprinting template obtained The method of manufacturing an imprinting template according to the present invention utilizes a semiconductor manufacturing process and comprises a step of etching an oxide layer having a thickness of from 1000 to 8000 angstroms on a substrate by a microlithography... | 12/07/2010 |
| 7820064 | Spinodally patterned nanostructures Devices based on spinodally decomposed periodic structures and their fabrication techniques. ... | 10/26/2010 |
| 7794614 | Methods for generating sublithographic structures One possible embodiment is a method of manufacturing a structure on or in a substrate with the following steps a) positioning at least one spacer structure by a spacer technique on the substrate, b) using at least ... | 09/14/2010 |
| 7790048 | Treatment of the working layer of a multilayer structure The invention relates to a method for forming a plurality of electrically conductive islands in a working layer of a multilayer structure made from semiconductor materials, with the structure including an electrically insulating layer located beneath the working lay... | 09/07/2010 |
| 7790047 | Method for removing masking materials with reduced low-k dielectric material damage Methods for removing masking materials from a substrate having exposed low-k materials while minimizing damage to exposed surfaces of the low-k material are provided herein. In one embodiment a method for removing masking materials from a substrate includes providin... | 09/07/2010 |
