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"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 8123965 | Interconnect structure with stress buffering ability and the manufacturing method thereof An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group ... | 02/28/2012 |
| 8017024 | Method for continual preparation of polycrystalline silicon using a fluidized bed reactor There is provided a method for continual preparation of granular polycrystalline silicon using a fluidized bed reactor, enabling a stable, long-term operation of the reactor by effective removal of silicon deposit accumulated on the inner wall of the reactor tube. T... | 09/13/2011 |
| 8012365 | Deep anisotropic silicon etch method A method of anisotropic plasma etching of a silicon wafer, maintained at a temperature from −40° C. to −120° C., comprising alternated and repeated steps of: etching with injection of a fluorinated gas, into the plasma reacto... | 09/06/2011 |
| 7833427 | Electron beam etching device and method Methods and devices for selective etching in a semiconductor process are shown. Chemical species generated in a reaction chamber provide both a selective etching function and concurrently form a protective coating on other regions. An electron beam provides activati... | 11/16/2010 |
| 7718080 | Electronic beam processing device and method using carbon nanotube emitter Methods and devices for selective etching in a semiconductor process are shown. Chemical species generated in a reaction chamber provide both a selective etching function and concurrently form a protective coating on other regions. An electron beam provides activati... | 05/18/2010 |
| 7531102 | Simultaneous selective polymer deposition and etch pitch doubling for sub 50nm line/space patterning First radicals and second radicals are simultaneous deposited into a space defined by two adjacent lines of photoresists and an underlying layer. A portion of the first radicals and the second radicals combine to form a polymer layer on the layer in the center of th... | 05/12/2009 |
| 7491343 | Line end shortening reduction during etch A method for etching features in an etch layer is provided. A patterned photoresist mask is provided over the etch layer, the photoresist mask having at least one photoresist line having a pair of sidewalls ending at a line end is provided. A polymer layer is placed... | 02/17/2009 |
| 7481943 | Method suitable for etching hydrophillic trenches in a substrate A method suitable for etching hydrophilic trenches into a substrate, such as silicon, is provided. The method comprises etching and sidewall passivation processes for achieving anisotropy. Sidewalls of the etched trench are made hydrophilic during the etch by virtue... | 01/27/2009 |
| 7459098 | Dry etching apparatus, dry etching method, and plate and tray used therein A dry etching apparatus that performs etching on a substrate 1 placed on a tray 13 inside a chamber 18 by covering the substrate 1 with a plate 14 provided with opening portions 15, in which a distance D between the surface ... | 12/02/2008 |
| 7438822 | Apparatus and method for shielding a wafer from charged particles during plasma etching A plasma etching system having a wafer chuck with a magnet that applies a magnetic field over a wafer to shield the wafer from charged particles. The magnetic field is parallel with the wafer, and is strongest near the wafer surface. The magnetic field may be straig... | 10/21/2008 |
| 7438824 | Fabrication of long range periodic nanostructures in transparent or semitransparent dielectrics To make high quality long-range periodic nanostructures in a transparent or semi-transparent substrate, the transparent or semi-transparent substrate is scanned with a linearly polarized laser beam generated by a femtosecond laser and exceeding a predetermined energ... | 10/21/2008 |
| 7416675 | Method of fabricating inkjet print heads A method of fabricating inkjet print heads usable in an ink jet printer. The method of fabricating ink jet print heads includes preparing a plurality of ink jet print heads on a wafer while forming sub sidewalls around the ink jet print heads when the ink jet print ... | 08/26/2008 |
| 7413990 | Method of fabricating a dual damascene interconnect structure A method of fabricating an interconnect structure (e.g., dual damascene interconnect structure, and the like) of an integrated circuit device is disclosed. The interconnect structure is fabricated using a bi-layer mask comprising an imaging film and an organic plana... | 08/19/2008 |
| 7407597 | Line end shortening reduction during etch A method for etching features in an etch layer is provided. A patterned photoresist mask is formed over the etch layer with at least one photoresist line having a pair of sidewalls ending at a line end. A coating is placed over the photoresist line comprising at lea... | 08/05/2008 |
| 7402261 | Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include ... | 07/22/2008 |
| 7399709 | Complementary replacement of material An image reversal method is described that removes the etch resistance requirement from a resist. A high resolution resist pattern comprised of islands, lines, or trenches is formed with a large process window by exposing through one or more masks including phase ed... | 07/15/2008 |
| 7396476 | Method for reducing harmonic distortion in comb drive devices Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch... | 07/08/2008 |
| 7368393 | Chemical oxide removal of plasma damaged SiCOH low k dielectrics A method for removing damages of a dual damascene structure after plasma etching is disclosed. The method comprises the use of sublimation processes to deposit reactive material onto the damaged regions and conditions to achieve a controlled removal of the damaged r... | 05/06/2008 |
| 7361605 | System and method for removal of photoresist and residues following contact etch with a stop layer present In processing an integrated circuit structure including a contact arrangement that is initially covered by a stop layer, a first plasma is used to etch to form openings through an overall insulation layer covered by a patterned layer of photoresist such that one con... | 04/22/2008 |
| 7361367 | Adding microscopic porosity to the surface of a microcoil to be used for medical implantation A vasoocclusive microcoil for therapeutic treatment of a patient's vasculature includes a surface with a plurality of voids or pores therein, and a therapeutic or bioactive material disposed within the plurality of voids or pores. The therapeutic or bioactive materi... | 04/22/2008 |
| 7357873 | Polymide thin film self-assembly process The invention presents a novel polyimide-based thin film self-assembly technology, including five process steps described as follows: (1) deposits a sacrificial layer and a low-stress microstructure layer on a silicon substrate; (2) patterns and etches the low-stres... | 04/15/2008 |
| 7357486 | Method of laser machining a fluid slot A method of laser machining a fluid slot includes directing a UV laser beam towards a substrate with microelectronics to form a slot through the substrate. ... | 04/15/2008 |
| 7354525 | Specimen surface processing apparatus and surface processing method For a surface processing apparatus using a plasma, a mixed gas of a fluorine-containing gas and an oxygen gas is used as an ashing gas. A mixed gas of an oxygen gas and a fluorine-containing gas is introduced as an ashing gas. This allows the following steps to be c... | 04/08/2008 |
| 7354650 | Multi-layer coatings with an inorganic oxide network containing layer and methods for their application Multi-layer coatings are disclosed that include (1) a first layer comprising an inorganic oxide network, and (2) a second layer applied over at least a portion of the first layer, wherein the second layer is deposited from at least one liquid composition that is hyd... | 04/08/2008 |
| 7354624 | Multi-layer coatings and related methods Multi-layer coatings are disclosed that include (a) a first layer deposited from at least one composition that includes a polymeric composition, and (b) a second layer applied over at least a portion of the first layer in which the second layer is deposited from at ... | 04/08/2008 |
| 7354522 | Substrate etching method for forming connected features A method of etching a substrate and an article(s) formed using the method are provided. The method includes providing a substrate; coating a region of the substrate with a temporary material having properties that enable the temporary material to remain substantiall... | 04/08/2008 |
| 7347953 | Methods for forming improved self-assembled patterns of block copolymers A method for forming self-assembled patterns on a substrate surface is provided. First, a block copolymer layer, which comprises a block copolymer having two or more immiscible polymeric block components, is applied onto a substrate that comprises a substrate surfac... | 03/25/2008 |
| 7341672 | Method of fabricating printhead for ejecting ink supplied under pulsed pressure A method of fabricating a printhead is provided in which sacrificial material is deposited on a drive circuitry substrate and etched to define first zones, thermally expandable material is deposited on the first zones and etched with the substrate to define second z... | 03/11/2008 |
| 7335391 | Method for coating implantable devices A method of forming a coating for an implantable medical device, such as a stent, is provided which includes applying a composition to the device in an environment having a selected pressure. ... | 02/26/2008 |
| 7335611 | Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer A method of forming a conductor in a thin film structure on a semiconductor substrate includes forming high aspect ratio openings in a base layer having vertical side walls, depositing a dielectric barrier layer comprising a dielectric compound of a barrier metal on... | 02/26/2008 |
| 7331789 | Method of manufacturing dental posts, obturators and restorations Dental posts and obturators are manufactured herein having a filling material applied to the apical end of the post and obturator such that the adherence strength between the filling material and the post or obturator is very high. The filling material is adhered to... | 02/19/2008 |
| 7329366 | Method of polishing implantable medical devices to lower thrombogenecity and increase mechanical stability The present invention relates to a method of polishing an implantable medical device. The method may include positioning an implantable medical device on a support. At least a portion of a surface of the implantable medical device may include a polymer. A fluid may ... | 02/12/2008 |
| 7329413 | Coatings for drug delivery devices having gradient of hydration and methods for fabricating thereof Coatings for implantable medical devices, and methods for fabricating thereof, are provided. The coatings include a first polymer layer and a second polymer layer, where the second polymer has a higher degree of hydration than the first polymer. ... | 02/12/2008 |
| 7326445 | Method and apparatus for manufacturing ultra fine three-dimensional structure A method is adopted for deposition technology using a focused ion beam device, characterized by enabling structures to be formed by using phenanthrene as a source gas and using ions of gallium or gold, silicon or beryllium etc. of energies of 5 to 100 keV from a liq... | 02/05/2008 |
| 7323115 | Substrate processing method and ink jet recording head substrate manufacturing method A substrate (wafer) processing method for producing an ink jet recording head substrate in which the reverse surface thereof, that is, the surface having the larger of the two openings of the ink supply hole, is precisely covered by a protective film to the very edg... | 01/29/2008 |
| 7323401 | Semiconductor substrate process using a low temperature deposited carbon-containing hard mask A method of processing a thin film structure on a semiconductor substrate using an optically writable mask includes placing the substrate in a reactor chamber, the substrate having on its surface a target layer to be etched in accordance with a predetermined pattern... | 01/29/2008 |
| 7318932 | Coatings for drug delivery devices comprising hydrolitically stable adducts of poly(ethylene-co-vinyl alcohol) and methods for fabricating the same A polymer coating for medical devices based on a derivatized poly(ethylene-co-vinyl alcohol) is disclosed. A variety of polymers are described to make coatings for medical devices, particularly, for drug delivery stents. The polymers include poly(ethylene-co-vinyl a... | 01/15/2008 |
| 7312148 | Copper barrier reflow process employing high speed optical annealing A method of forming a barrier layer for a thin film structure on a semiconductor substrate includes forming high aspect ratio openings in a base layer having vertical side walls, depositing a dielectric barrier layer comprising a dielectric compound of a barrier met... | 12/25/2007 |
| 7311980 | Polyactive/polylactic acid coatings for an implantable device A polymeric coating for a medical device that comprises poly(lactic acid) and a block copolymer including blocks of poly(ethylene glycol) and poly(butylene terephthalate) is provided. ... | 12/25/2007 |
| 7312162 | Low temperature plasma deposition process for carbon layer deposition A method of depositing a carbon layer on a workpiece includes placing the workpiece in a reactor chamber, introducing a carbon-containing process gas into the chamber, generating a reentrant toroidal RF plasma current in a reentrant path that includes a process zone... | 12/25/2007 |
