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| Number | Title | Issue Date |
| 7922923 | Anti-scatter grid and collimator designs, and their motion, fabrication and assembly Grids and collimators, for use with electromagnetic energy emitting devices, include at least a metal layer that is formed, for example, by electroplating/electroforming or casting. The metal layer includes top and bottom surfaces, and a plurality of solid integrate... | 04/12/2011 |
| 7883628 | Method of reducing the surface roughness of a semiconductor wafer A method for reducing the roughness of a free surface of a semiconductor wafer that includes establishing a first atmosphere in an annealing chamber, replacing the first atmosphere with a second atmosphere that includes a gas selected to and in an amount to substant... | 02/08/2011 |
| 7491342 | Bonded semiconductor substrate manufacturing method thereof The present invention provides a bonded substrate fabricated to have its final active layer thickness of 200 nm or lower by performing the etching by only 1 nm to 1 μm with a solution having an etching effect on a surface of an active layer of a bonded substrate wh... | 02/17/2009 |
| 7413670 | Method for forming wiring on a substrate A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate with a soft polyimide substrate, and etching the copper substrate.... | 08/19/2008 |
| 7354699 | Method for producing alignment mark A method for producing an alignment mark is performed such that the alignment mark can be removed from the surface of a substrate without leaving any trace thereof after the alignment mark has been used for alignment. After a first photoresist layer has been formed ... | 04/08/2008 |
| 7346981 | Method for fabricating microelectromechanical system (MEMS) devices A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate to the one side of the wafer using an adhesive bonding agent, the sub... | 03/25/2008 |
| 7291278 | Electrode forming method An electrode forming method with an excellent yield, includes: (a) forming an adhesion preventing member having a predetermined pattern on a base member: (b) forming a conductive layer on the base member and the adhesion preventing member; and (c) forming an electro... | 11/06/2007 |
| 7276181 | Method for preparing decorative glass using glass etching composition A method for preparing a decorative glass using a glass etching composition, wherein a frosting of elaborate patterns and designs is applied on the surface of the glass having an arbitrary shape, such a plane, a curved plane or a tube, by utilizing the silk-screen p... | 10/02/2007 |
| 7263763 | Planarization method for a structure having a first surface for etching and a second surface A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures... | 09/04/2007 |
| 7247248 | Method of forming atomic force microscope tips The invention relates to a method for forming silicon atomic force microscope tips. The method includes the steps of depositing a masking layer onto a first layer of doped silicon so that some square or rectangular areas of the first layer of doped silicon are not c... | 07/24/2007 |
| 7235464 | Patterning method The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomer... | 06/26/2007 |
| 7229899 | Process for the transfer of a thin film A process for transferring a thin film includes forming a layer of inclusions to create traps for gaseous compounds. The inclusions can be in the form of one or more implanted regions that function as confinement layers configured to trap implanted species. Further,... | 06/12/2007 |
| 7229564 | Method for manufacturing bipolar plate and direct methanol fuel cell A DMFC (direct methanol fuel cell) includes two bipolar plates, a membrane electrode assembly, a bonding layer, and a fuel container base. The bipolar plate is a releasable substrate that includes a releasable copper carrier, a release layer, and a metal foil. The b... | 06/12/2007 |
| 7214324 | Technique for manufacturing micro-electro mechanical structures A technique for manufacturing a micro-electro mechanical structure includes a number of steps. Initially, a cavity is formed into a first side of a handling wafer, with a sidewall of the cavity forming a first angle greater than about 54.7 degrees with respect to a ... | 05/08/2007 |
| 7214326 | Increased capacity leadframe and semiconductor package using the same In accordance with the present invention, there is provided a method for manufacturing a semiconductor package. The method comprises the initial step of applying first and second photoresist layers to respective ones of opposed first and second surfaces of a metal p... | 05/08/2007 |
| 7196872 | Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homog... | 03/27/2007 |
| 7189335 | Conformal coverings for electronic devices Stand-alone conformal coverings for electronic devices and methods of making and using such coverings. ... | 03/13/2007 |
| 7186349 | Fluid ejection device and method of fabricating the same A fluid ejection device includes a first substrate having a first crystal orientation, a second substrate having a second crystal orientation, bound to the first substrate, a manifold through the first and second substrates, a chamber formed in the second substrate,... | 03/06/2007 |
| 7175876 | Patterned coating method employing polymeric coatings Patterned articles can be prepared by applying a release polymer to a substrate in a desired pattern, applying a substrate-adherent polymer over the pattern and substrate, and mechanically removing the substrate-adherent polymer from the pattern without requiring so... | 02/13/2007 |
| 7163826 | Method of fabricating multi layer devices on buried oxide layer substrates A method for fabricating multi layer devices on a substrate with a buried oxide layer is disclosed. Multi layer microelectromechanical, microfluidic, and integrated circuit devices are fabricated on a substrate with layers of predetermined weak and strong bond regio... | 01/16/2007 |
| 7145219 | Vertical integrated circuits A method for fabricating a vertical integrated circuit is disclosed. Integrated circuits are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed layers of integrated circuits are fabricated at or on the weak bond r... | 12/05/2006 |
| 7144517 | Manufacturing method for leadframe and for semiconductor package using the leadframe In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer, the primary leadframe including a die paddle and a plurality of leads ... | 12/05/2006 |
| 7128844 | Metal/ceramic circuit board and method for producing same A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mix... | 10/31/2006 |
| 7129109 | Method for structuring an oxide layer applied to a substrate material The invention relates to a method for structuring an oxide layer applied to a substrate material. The aim of he invention is to provide an inexpensive method for structuring such an oxide layer. To this end, a squeegee paste that contains an oxide-etching component ... | 10/31/2006 |
| 7114448 | Method for large-area patterning dissolved polymers by making use of an active stamp A method of patterning soluble materials on a substrate is described. In the method, a stamp is applied to a liquid carrier solution. The raised areas of the stamp removes mainly a liquid carrier leaving behind a precipitate while the non-raised areas of the stamp l... | 10/03/2006 |
| 7112377 | Magnetic recording medium, method of manufacturing the same, magnetic medium substrate employed in the magnetic recording medium, and magnetic storage unit A magnetic recording medium is disclosed that includes a substrate; an anodic alumina film formed on the substrate; a pore formed in the anodic alumina film; a carbon layer covering the surface of the anodic alumina film and the inner wall of the pore; a magnetic pa... | 09/26/2006 |
| 7083739 | Transfer body and method using the same There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting body has a heat resisting property enough to withstand heat treatment... | 08/01/2006 |
| 7082876 | Method for transferring a pattern A method and a device for forming at least a first pattern on a substrate (6,28), which is coated with a layer (5) on at least a first planar surface, are described. According to the method, a first pressing means (27) is arranged with a first s... | 08/01/2006 |
| 7081657 | MEMS and method of manufacturing MEMS The present invention relates to micro electro-mechanical systems (MEMS) and production methods thereof, and more particularly to vertically integrated MEMS systems. Manufacturing of MEMS and vertically integrated MEMS is facilitated by forming, preferably on a wafe... | 07/25/2006 |
| 7077970 | Sliders bonded by a debondable nonstoichiometric encapsulant A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant. The solid encapsulant is comprised of a polymer prepared by polymerizing a mixture of first and second monomers in a nonstoichiometric ratio effective to render... | 07/18/2006 |
| 7063796 | Micromechanical component and method for producing the same A method of manufacturing a micromechanical component has a substrate (1), a movable sensor structure (6) in a micromechanical functional layer (5) located over the substrate; a first sealing layer (8) on the first micromechanical functio... | 06/20/2006 |
| 7060522 | Membrane structures for micro-devices, micro-devices including same and methods for making same A structure for a micro-device is fabricated by forming: a first layer of sacrificial material, a layer of structural material over the first sacrificial material layer, a second layer of sacrificial material over the structural material layer and a protective layer... | 06/13/2006 |
| 7045878 | Selectively bonded thin film layer and substrate layer for processing of useful devices A layered structure generally includes a first layer suitable for having a useful element formed therein or thereon selectively attached or bonded to a second layer. A method to form a layered structure generally comprises selectively adhering a first substrate to a... | 05/16/2006 |
| 7035489 | Thin film electro-optical deflector device and a method of fabrication of such a device An electro-optical deflector device, having a thin ferroelectric oxide film and a method of fabricating the deflector device is described. One embodiment of a thin film electro-optic deflector device includes: a planar optical waveguide, having a thin ferroelectric ... | 04/25/2006 |
| 6966997 | Methods for patterning polymer films, and use of the methods In a method for patterning a polymer film forming a coating on a material surface, a thin film of polymer is deposited on the surface and the patterning takes place by applying to the material surface a stamp made of an elastomeric material in conformal contact with... | 11/22/2005 |
| 6953530 | Forming method of ink jet print head substrate and ink jet print head substrate, and manufacturing method of ink jet print head and ink jet print head The invention provides a forming method of an ink jet print head substrate and an ink jet print head substrate, and a manufacturing method of an ink jet print head and an ink jet print head, in which adhesion between a substrate for forming an ink discharging pressu... | 10/11/2005 |
| 6952055 | Intermediate structures in porous substrates in which electrical and optical microdevices are fabricated and intermediate structures formed by the same The invention is a method of fabricating electrically passive components or optical elements on top or underneath of an integrated circuit by using a porous substrate that is locally filled with electrically conducting, light emitting, insulating or optically diffra... | 10/04/2005 |
| 6929987 | Microelectronic device fabrication method In a method of forming a semiconductor device with a first channel layer formed over a portion of a second channel layer, a portion of the second channel underlying the first channel is etched so as to form an overhanging ledge in the first channel, and then a metal... | 08/16/2005 |
| 6922890 | Planarization process for thin film surfaces A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures... | 08/02/2005 |
| 6881644 | Smoothing method for cleaved films made using a release layer A method for treating a film of material, which can be defined on a substrate, e.g., silicon. The method includes providing a substrate comprising a cleaved surface, which had a porous silicon layer thereon. The substrate may have a distribution of hydrogen bearing ... | 04/19/2005 |
