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| Number | Title | Issue Date |
| 7807062 | Electron induced chemical etching and deposition for local circuit repair A method of imaging and repairing defects on and below the surface of an integrated circuit (IC) is described. The method may be used in areas as small as one micron in diameter, and may remove the topmost material in the small spot, repeating with various layers, u... | 10/05/2010 |
| 7591956 | Method and composition for selectively stripping nickel from a substrate A method of stripping nickel from a printed wiring board comprises providing a printed wiring board with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an oxidizer. An aqueous solution comprises ammonium ions, phosphate ions ... | 09/22/2009 |
| 7361284 | Method for wafer-level package A method for wafer-level package. A cap wafer having cavities is bonded to a support wafer, and a portion of the cap wafer is etched through. The cap wafer is released from the support wafer, and bonded to a transparent wafer, and a portion of the cap wafer correspo... | 04/22/2008 |
| 7185969 | Droplet dispensation from a reservoir with reduction in uncontrolled electrostatic charge Devices and methods are provided for reducing the uncontrolled electrostatic charges that can alter the volume and/or trajectory of a droplet, which is typically ejected through the application of focused acoustic radiation. Also provided are reservoirs and substrat... | 03/06/2007 |
| 7145343 | Repair device for decorative light shunt A repair device for fixing a malfunctioning shunt across a failed filament in a light bulb in a group of series-connected miniature decorative bulbs includes a high-voltage pulse generator producing one or more pulses of a magnitude greater than the standard AC powe... | 12/05/2006 |
| 6902941 | Probing of device elements A new and improved method for the probing of integrated circuits (ICs) and is particularly suitable for probing various elements of an IC for failure analysis or other electrical testing and/or measurement of the IC. The method includes providing a probe access tren... | 06/07/2005 |
| 6857681 | Connecting structure of air duct of vehicular air conditioning unit In a connecting structure of an air duct of a vehicular air conditioning unit, an end of the air duct is engaged with an air conditioning case when an instrument panel is mounted on a vehicle body with the air duct. Therefore, a sealing member such as packing is not... | 02/22/2005 |
| 6838009 | Rework method for finishing metallurgy on chip carriers A method and apparatus are provided for reworking of finishing metallurgy on pads of electronic components. The pads are copper or copper/nickel and have a layer of nickel thereon and an overlying layer of gold. The gold layer is removed first followed by the nickel... | 01/04/2005 |
| 6458709 | Method for fabricating a repair fuse box for a semiconductor device A method for fabricating a repair fuse box of a semiconductor device is disclosed. An etching stop polysilicon layer formed at a belt shape in edge portions of a repair fuse box is broken during a repair etching process without substantial departure from ... | 10/01/2002 |
| 6248001 | Semiconductor die de-processing using a die holder and chemical mechanical polishing A method and apparatus for removing layers from a circuit side of a semiconductor die includes the use of a holder, for example a semiconductor wafer having an opening therein for receiving the semiconductor die. Additionally the holder can include one or... | 06/19/2001 |
| 6245586 | Wire-to-wire bonding system and method A system and method for preparing semiconductor samples for analytical techniques such as backside emission microscopy. Samples may be prepared from a wafer or packaged die. In package form, the package is affixed to a polishing jig such that the backside... | 06/12/2001 |
| 5976978 | Process for repairing data transmission lines of imagers A method of repairing severed or damaged data transmission lines of an imager provides a shunt path around the electrical defect in the data transmission line by means of a diode common transmission line. The repair shunt includes a first scan line segmen... | 11/02/1999 |
| 5733468 | Pattern plating method for fabricating printed circuit boards A pattern plating method for fabricating printed circuit boards begins by bonding a thin layer of copper (e.g., copper foil) to the surface of the board. A photoresist layer is laminated over the copper layer, and then selectively exposed and developed to... | 03/31/1998 |
| 5469981 | Electrically blowable fuse structure manufacturing for organic insulators An electrically blowable fuse structure usable with organic insulators in microelectronic parts is provided. The fuse structure is made of a first heat resistant member, a fusing element and a second heat resistant member. The heat resistant members are i... | 11/28/1995 |
| 5451292 | Method of manufacturing liquid-crystal elements A method of manufacturing liquid-crystal elements having two substrates on the surface of which a electrode group formed of stripe-shaped transparent electrodes and a metallic wiring pattern, and a liquid-crystal layer sandwiched between the two substrate... | 09/19/1995 |
| 5332470 | Process for manufacturing calibration structures particularly for the calibration of machines for measuring alignment in integrated circuits in general Process for the manufacture of calibration structures particularly for the calibration of machines for measuring alignment in integrated circuits in general, the peculiarity of which consists in the fact that calibration structures are provided in which t... | 07/26/1994 |
| 5236551 | Rework of polymeric dielectric electrical interconnect by laser photoablation A metal/polymeric dielectric substrate has metal conductors selectively disconnected by photoablating the polymeric dielectric with an excimer laser, etching the exposed metal using the polymeric dielectric as a mask, and coating an additional layer of po... | 08/17/1993 |
| 5145547 | Apparatus for self-induced repair of circuit short and near-shorts An automatic method to repair circuit shorts and near-shorts present in narrow bridges or remnants of bridges between circuit lines. By applying a voltage across a pair of lines, certain electrical phenomena take place at the area of the short or near-sho... | 09/08/1992 |
| 5063660 | Method for manufacturing preforms coated with hard solder for repairing interconnect interruptions A method for manufacturing preforms coated with hard solder for repairing interconnect interruptions. The manufacture of preforms with which interconnect interruptions are bridged and that are electrically and mechanically joined to the interconnect at bo... | 11/12/1991 |
| 5024725 | Method for self-inducted repair of circuit shorts and near-shorts An automatic method to repair circuit shorts and near-shorts present in narrow bridges or remnants of bridges between circuit lines. By applying a voltage across a pair of lines, certain electrical phenomena take place at the area of the short or near-sho... | 06/18/1991 |
| 5022955 | Apparatus and method for self-induced repair of circuit shorts and near-shorts An automatic method and apparatus for the repair of circuit shorts and near-shorts present in narrow bridges or remnants of bridges between circuit lines. By applying a voltage across a pair of lines, certain electrical phenomena take place at the area of... | 06/11/1991 |
| 5019001 | Method for manufacturing liquid crystal display device In a method for manufacturing a liquid crystal display device, address and data lines are provided over a substrate, and a short-circuit area and an area to be made short-circuit are provided to cause short-circuiting between the address and data lines. I... | 05/28/1991 |
| 4920403 | Selective tungsten interconnection for yield enhancement Methods of fabricating metal interconnection lines in an integrated circuit. In general, one method comprises the steps of depositing a layer of metal on an inter-dielectric oxide layer. The layer of metal is patterned and etched to form metal interconnec... | 04/24/1990 |
| 4878991 | Simplified method for repair of high density interconnect circuits A simplified method of gaining access to, for the purpose of replacing, a defective integrated circuit chip situated in a high density interconnect (HDI) circuit (10) comprises heating the HDI circuit to a temperature at which the peel strength of an adhe... | 11/07/1989 |
| 4836883 | Method of performing electrical reject selection A method of detecting defects in a passivating layer includes the step of providing masks on any portions of a device intentionally exposed through the passivating layer, exposing the device to an etchant which penetrates the passivating layer through any... | 06/06/1989 |
| 4830700 | Processing apparatus and method A radiant heating processing apparatus and method for a rapid thermal processing system, wherein only the base of the reflector module is directly water cooled. The sides of the reflector module are not directly water cooled; instead, the module is made t... | 05/16/1989 |
| 4588468 | Apparatus for changing and repairing printed circuit boards A printed circuit board modification and repair system is presented which functions under computer control. Modification is accomplished by securing the printed circuit board to an X-Y positioning fixture mounted on a work station table. After indexing to... | 05/13/1986 |
| 4544439 | System for repairing electrical short circuits between parallel printed circuits A system for cleaning a thru hole on a substantially planar electrical board. The electrical board has two major surfaces, upper and lower. A first gas and liquid transmission device is connected to the board to introduce etching gas and liquid into the t... | 10/01/1985 |
| 4540464 | Method of renewing defective copper conductors on the external planes of multilayer circuit boards After cleaning and removal of oxidic layers, the defective copper conductors are completely etched off the surface of the external planes of a multilayer circuit board, and the copper on the walls of the plated through holes is etched at an etching rate c... | 09/10/1985 |
