Bizarre Patents
Neuroimaging as a Marketing Tool
Neuroimaging as a means for validating whether a stimulus such as advertisement, communication, or product evokes a certain mental response such as emotion, preference, or memory, or to predict the consequences of the stimulus on later behavior such as consumption or purchasing.
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| Number | Title | Issue Date |
| 8110118 | Method of manufacturing circuit board An adhesive layer, an insulating layer and a copper foil are laminated together on both surfaces of a metallic base material by way of for example thermal press molding. In this case, openings (window holes) are formed in opposed positions on a portion of the adhesi... | 02/07/2012 |
| 8062537 | Method for manufacturing an electronics module Method for manufacturing an electronic module, which electronic module includes a component (6), which has contact areas (17), which are connected electrically to a conductor-pattern layer (14). The manufacture according to the method starts fro... | 11/22/2011 |
| 8007673 | Method of manufacturing circuit board An adhesive layer, an insulating layer and a copper foil are laminated together on both surfaces of a metallic base material by way of for example thermal press molding. In this case, openings (window holes) are formed in opposed positions on a portion of the adhesi... | 08/30/2011 |
| 7943052 | Method for self-assembling microstructures A method for self-assembling a plurality of microstructures onto a substrate comprising using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force. The microstructures are self-aligned with the substrate, and furt... | 05/17/2011 |
| 7922920 | Systems, methods, and apparatus of a low conductance silicon micro-leak for mass spectrometer inlet Systems, methods and apparatus are provided through which in some embodiments a mass spectrometer micro-leak includes a number of channels fabricated by semiconductor processing tools and that includes a number of inlet holes that provide access to the channels.... | 04/12/2011 |
| 7875195 | Thick porous anodic alumina films and nanowire arrays grown on a solid substrate The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an adhesion layer deposited on the wafer layer. An anodic alumina templ... | 01/25/2011 |
| 7413670 | Method for forming wiring on a substrate A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate with a soft polyimide substrate, and etching the copper substrate.... | 08/19/2008 |
| 7402254 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through... | 07/22/2008 |
| 7361284 | Method for wafer-level package A method for wafer-level package. A cap wafer having cavities is bonded to a support wafer, and a portion of the cap wafer is etched through. The cap wafer is released from the support wafer, and bonded to a transparent wafer, and a portion of the cap wafer correspo... | 04/22/2008 |
| 7354798 | Three-dimensional device fabrication method A method is described for fabricating a three-dimensional integrated device including a plurality of vertically stacked and interconnected wafers. Wafers (1, 2, 3) are bonded together using bonding layers (26, 36) of thermoplastic material such as poly... | 04/08/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7335517 | Multichip semiconductor device, chip therefor and method of formation thereof A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the c... | 02/26/2008 |
| 7332429 | Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates In some embodiments, laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates are presented. In this regard, a substrate in introduced having a dielectric layer wherein material has been removed from a surface... | 02/19/2008 |
| 7333302 | GMR sensor having an under-layer treated with nitrogen for increased magnetoresistance A magnetoresistive sensor having a substrate that has been treated with nitrogen (nitrogenated). The nitrogenated substrate includes an alumina base layer and a thin top layer of crystalline alumina that has had a very small amount of nitrogen deposited on top. The ... | 02/19/2008 |
| 7326463 | Conductive circuits or cables manufactured from conductive loaded resin-based materials Circuit conductors and cables are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin h... | 02/05/2008 |
| 7323245 | Electric connecting part It comprises an electric conduction pattern member (11) which is flexible and plate-shaped, a gel member (13) having the electric conduction pattern member embedded therein, and flexible substrate sheets (15a, 15b) holding the gel ... | 01/29/2008 |
| 7314708 | Method and apparatus for electronic synthesis of molecular structures A self-addressable, self-assembling microelectronic device is designed and fabricated to actively carry out and control multi-step and multiplex molecular biological reactions in microscopic formats. These reactions include nucleic acid hybridization, antibody/antig... | 01/01/2008 |
| 7312102 | Bridge connection type of chip package and fabricating method thereof A chip package having at least a substrate, a chip and a conductive trace is provided. The substrate has a first surface, a second surface, a cavity and at least one substrate contact all positioned on the first surface of the substrate. The chip has an active surfa... | 12/25/2007 |
| 7309020 | Deposition fabrication using inkjet technology A method of fabricating a circuit lead, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of substantially uniformly patterned micropores operative to drain a fluid component of the slurry... | 12/18/2007 |
| 7297285 | Manufacturing process of emboss type flexible or rigid printed circuit board A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etc... | 11/20/2007 |
| 7291283 | Combined wet etching method for stacked films and wet etching system used for same A combined wet etching method for stacked films which is capable of performing etching processes in a collective manner while controlling an amount of side-etching on each of stacked films and of making uniform side edges. In the wet etching method, two or more type... | 11/06/2007 |
| 7285906 | Film formation mask, organic EL panel, and method of manufacturing the organic EL panel In forming luminescent areas of organic EL devices of an organic EL display panel, it is necessary to prevent a display performance degradation in the vicinity of outermost edges of display area of the organic EL display panel. A film formation mask is used to form ... | 10/23/2007 |
| 7281325 | Method of manufacturing circuit board A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a ... | 10/16/2007 |
| 7279412 | Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without appl... | 10/09/2007 |
| 7251110 | GMR sensor having layers treated with nitrogen for increased magnetoresistance A magnetoresistive sensor having a substrate that has been treated with nitrogen (nitrogenated) and having a Ta cap layer with nitrogen added in situ during deposition. The nitrogenated substrate includes an alumina base layer and a thin top layer of crystalline alu... | 07/31/2007 |
| 7241419 | Circuits for the control of output current in an electronic device for performing active biological operations A circuit for control of an output current in a multiple unit cell array includes an array of unit cells arranged in rows and columns. Each unit cell includes a column select transistor being adapted for control by a column selector and a row select transistor being... | 07/10/2007 |
| 7240420 | System and method for post-fabrication reduction of minimum feature size spacing of microcomponents A system and method are disclosed which enable post-fabrication reduction of minimum feature size spacing of microcomponents. A method for producing an assembly of microcomponents is provided, in which at least two microcomponents are fabricated having a separation ... | 07/10/2007 |
| 7240430 | Manufacturing methods for printed circuit boards A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substr... | 07/10/2007 |
| 7233226 | Method of producing a platinum temperature sensor A Platinum temperature sensor comprises a ceramic substrate and a platinum thin-film resistor applied to said ceramic substrate, a ceramic cover layer and a connecting layer generated from a ceramic green layer by pressure and temperature treatment. The ceramic cove... | 06/19/2007 |
| 7229564 | Method for manufacturing bipolar plate and direct methanol fuel cell A DMFC (direct methanol fuel cell) includes two bipolar plates, a membrane electrode assembly, a bonding layer, and a fuel container base. The bipolar plate is a releasable substrate that includes a releasable copper carrier, a release layer, and a metal foil. The b... | 06/12/2007 |
| 7230188 | Printed wiring board and its manufacturing method The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be c... | 06/12/2007 |
| 7222421 | Circuit substrate manufacturing method A circuit substrate manufacturing method including the steps of preparing a substrate on which a metallic foil is formed in a releasable state, forming a build-up wiring on the metallic foil, obtaining a circuit member having a structure that the build-up wiring is ... | 05/29/2007 |
| 7220666 | Interconnection element for BGA housings and method for producing the same An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one ... | 05/22/2007 |
| 7217370 | Wiring board and process for producing the same A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected... | 05/15/2007 |
| 7214282 | Electromagnetic-wave shielding and light transmitting plate, manufacturing method thereof and display panel An electromagnetic-wave shielding and light transmitting plate 1 having an antireflection film 3, an electromagnetic-wave shielding film 10, a transparent substrate 2, and a near-infrared ray blocking film 5, laminated and united b... | 05/08/2007 |
| 7204020 | Method for fabricating a charge plate for an inkjet printhead A method for fabricating a charge plate for an ink jet printhead entails removing portions of conductive material from a dimensionally stable dielectric substrate with a coating of conductive material to form at least a first and second electrode on a first face wit... | 04/17/2007 |
| 7202544 | Giant magnetoresistance structure The present invention relates to a method for producing a GMR structure in which a metallic multiple layer is applied onto a carrier and in which the metallic multiple layer is patterned to produce the GMR structure, the carrier having a structure before the metalli... | 04/10/2007 |
| 7201850 | Method for providing surface texturing of aluminum sheet, substrate for lithographic plate and lithographic plate According to the present invention, since the concavo-convex pattern of the embossing form is formed by electrical discharge machining, the peaks on the surface of the resultant embossing form are all of the same level or height, which enables the enhancement of the... | 04/10/2007 |
| 7193329 | Semiconductor device The semiconductor device includes a tabular base metal having an insulating layer provided on a bottom surface thereof, and the insulating layer includes a plurality of wiring patterns, each of which is provided with a connecting pad at one end thereof. A semiconduc... | 03/20/2007 |
| 7185542 | Complex microdevices and apparatus and methods for fabricating such devices Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB™) ... | 03/06/2007 |
