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| Number | Title | Issue Date |
| 8052882 | Method of manufacturing wiring substrate A method of manufacturing a wiring substrate of the present invention, includes the steps of forming a seed layer on an underlying layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a copper plating layer in the openin... | 11/08/2011 |
| 7892441 | Method and apparatus to change solder pad size using a differential pad plating A method of manufacturing an interposer is provided, including the steps of providing a sheet with a copper layer and polyimide layer, laser drilling holes in the polyimide layer down to the copper layer, filling the holes with copper and extending the copper above ... | 02/22/2011 |
| 7718078 | Manufacturing method of circuit board A manufacturing method of a circuit board is provided. Firstly, a substrate board having a plurality of through holes is provided. Next, a first metal layer is electro-less plated on the surface of the substrate board and the surface of the through holes. Then, a se... | 05/18/2010 |
| 7674390 | Zeolite—sol gel nano-composite low k dielectric A method for forming a sol gel-zeolite composite dielectric material is herein described. Zeolite particles may be dispersed in a sol creating a liquid sol-zeolite colloid. The liquid sol-zeolite colloid may be deposited on an underlying layer. The liquid sol-zeolit... | 03/09/2010 |
| 7531100 | Method of making a fuel cell component using an easily removed mask A method of making a fuel cell component using a mask, which is removed after further processing to yield a surface with variable properties. ... | 05/12/2009 |
| 7524429 | Method of manufacturing double-sided printed circuit board The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an elect... | 04/28/2009 |
| 7442318 | Method of making thermal print head A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor layer formation step, a single conductor layer including first and se... | 10/28/2008 |
| 7434311 | Printed wiring board manufacturing method This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through hol... | 10/14/2008 |
| 7431860 | Etching process A method for etching a pattern in a material in precise target areas comprising depositing selectively onto the material droplets of a substance for dissolving or reacting chemically with the material. Droplets may be deposited from a print head of the type having a... | 10/07/2008 |
| 7407595 | Optical member, manufacturing method of the optical member, waveguide substrate, and photo-electric integrated substrate A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by etching, forming openings corresponding to the inclined surfaces in a plat... | 08/05/2008 |
| 7404908 | Printed wiring board manufacturing method According to this manufacturing method, a copper foil is attached to both sides of an insulating material to form a substrate. First, a large number of through-holes is made in the substrate and the inside of the through-holes is made electrically conductive. Then, ... | 07/29/2008 |
| 7402529 | Method of applying cladding material on conductive lines of MRAM devices A method of fabricating a cladding region for use in MRAM devices includes the formation of a conductive bit line proximate to a magnetoresistive memory device. The conductive bit line is immersed in a first bath containing dissolved ions of a first conductive mater... | 07/22/2008 |
| 7403095 | Thin film resistor structure and method of fabricating a thin film resistor structure A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is a combination of a Titanium (Ti) layer and a Titanium Nitride (TiN) l... | 07/22/2008 |
| 7371452 | Conductive patterned sheet utilizing multi-layered conductive conduit channels Disclosed is an article comprising a polymer layer containing a plurality of integral polymer conduit channels that contain at least two layers with at least one comprising a conductive material and the other serving a function beyond protection. ... | 05/13/2008 |
| 7365272 | Circuit board with identifiable information and method for fabricating the same A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of th... | 04/29/2008 |
| 7361377 | Fluorinated precursors of superconducting ceramics, and methods of making the same This invention provides a method of making a fluorinated precursor of a superconducting ceramic. The method comprises providing a solution comprising a rare earth salt, an alkaline earth metal salt and a copper salt; spraying the solution onto a substrate to provide... | 04/22/2008 |
| 7361605 | System and method for removal of photoresist and residues following contact etch with a stop layer present In processing an integrated circuit structure including a contact arrangement that is initially covered by a stop layer, a first plasma is used to etch to form openings through an overall insulation layer covered by a patterned layer of photoresist such that one con... | 04/22/2008 |
| 7359608 | Constructing well structures for hybrid optical waveguides A well may be formed for access to an optical waveguide core by a process that results in an L-shaped well. The L-shaped well may then be filled with a polymer. By controlling the size of each portion of well, the occurrence of bubbles within the well and cuts to th... | 04/15/2008 |
| 7358184 | Method of forming a conductive via plug A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low... | 04/15/2008 |
| 7356923 | Rigid flex interconnect via A rigid-flexible printed wire assembly which employs a blind via for interconnection is disclosed. Preferably, the assembly includes a rigid section having a through hole formed therethrough and a flexible section having an inner metal layer. Laser ablation is prefe... | 04/15/2008 |
| 7354698 | Imprint lithography An imprinting method is disclosed which involves irradiating a photo-curable imprintable medium in a flowable state on a substrate with radiation to initiate curing of the medium, after the irradiating, contacting the medium with a template to form an imprint in the... | 04/08/2008 |
| 7355504 | Electrical devices An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a ma... | 04/08/2008 |
| 7350297 | Method of manufacturing a wiring substrate A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece h... | 04/01/2008 |
| 7347951 | Method of manufacturing electronic device A method of manufacturing an electronic device comprises forming a wiring material layer made of aluminum or an aluminum alloy on the surface of an insulating film on a substrate, patterning the wiring material layer by a reactive ion etching treatment with a resist... | 03/25/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7340829 | Method for fabricating electrical connection structure of circuit board A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plura... | 03/11/2008 |
| 7329601 | Method of manufacturing semiconductor device Disclosed is a method for manufacturing a semiconductor device, comprising forming a low dielectric constant insulating film having a porous structure above a semiconductor substrate, forming a recess in the low dielectric constant insulating film, providing a buryi... | 02/12/2008 |
| 7323699 | Apparatus and method for modifying an object A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material. ... | 01/29/2008 |
| 7320173 | Method for interconnecting multi-layer printed circuit board A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer expos... | 01/22/2008 |
| 7316783 | Method of wiring formation and method for manufacturing electronic components A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the platin... | 01/08/2008 |
| 7316063 | Methods of fabricating substrates including at least one conductive via A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by mask... | 01/08/2008 |
| 7314822 | Method of fabricating stacked local interconnect structure A method is provided for forming stacked local interconnects that do not extend into higher levels within a multilevel IC device, thereby economizing space available within the IC device and increasing design flexibility. In a first embodiment, the method of the pre... | 01/01/2008 |
| 7315082 | Semiconductor device having integrated circuit contact A process for forming vertical contacts in the manufacture of integrated circuits, and devices so manufactured, is disclosed. The process eliminates the need for precise mask alignment and allows the etch of the contact hole to be controlled independent of the etch ... | 01/01/2008 |
| 7303639 | Method for producing Z-axis interconnection assembly of printed wiring board elements A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to th... | 12/04/2007 |
| 7302982 | Label applicator and system A label applicator including a support surface having a central area and curving downwardly from the central area. A post assembly extends up from the central area such that a label having a label through-hole can be positioned in a support position generally on the... | 12/04/2007 |
| 7304247 | Circuit board with at least one electronic component A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at least one internally situated conductor path, a first insulating layer ... | 12/04/2007 |
| 7300882 | Etching method and semiconductor device fabricating method An etching method for plasma-etching a low-k film, wherein the plasma etching is conducted under an etching gas atmosphere including a fluorocarbon gas, O2 gas and Ar gas, and under the conditions of a pressure of 60 mTorr (7999.32 mPa) or higher and a hi... | 11/27/2007 |
| 7299818 | Integrated microvalve and method for manufacturing a microvalve An integrated microvalve has a substrate, a first function layer applied to the substrate, and a second function layer applied to the first function layer, the first function layer being designed as a diaphragm in at least one valve area, the second function layer b... | 11/27/2007 |
| 7297285 | Manufacturing process of emboss type flexible or rigid printed circuit board A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etc... | 11/20/2007 |
| 7287325 | Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing Disclosed are a damascene and dual damascene processes both of which incorporate the use of a release layer to remove trace amounts of residual material between metal interconnect lines. The release layer is deposited onto a dielectric layer. The release layer compr... | 10/30/2007 |
