Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 8177988 | Method for manufacturing liquid discharge head A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a se... | 05/15/2012 |
| 8097175 | Method for selectively permeating a self-assembled block copolymer, method for forming metal oxide structures, method for forming a metal oxide pattern, and method for patterning a semiconductor structure Methods of forming metal oxide structures and methods of forming metal oxide patterns on a substrate using a block copolymer system formulated for self-assembly. The metal oxide structures and patterns may be used, for example, as a mask for sublithographic patterni... | 01/17/2012 |
| 8038890 | Piezoelectric-driven MEMS device and method for manufacturing the same A piezoelectric-driven MEMS device can be fabricated reliably and consistently. The piezoelectric-driven MEMS device includes: a movable flat beam having a piezoelectric film disposed above a substrate with a recessed portion such that the piezoelectric film is brid... | 10/18/2011 |
| 8017022 | Selective electroless plating for electronic substrates In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including forming a film on a surface of a substrate, the film designed to prevent the seeding of an electroless plating catalyst, laser... | 09/13/2011 |
| 7993535 | Robust self-aligned process for sub-65nm current-perpendicular junction pillars A method for fabricating a device includes forming a first insulation layer to cover a removable mask and a device structure that has been defined by the mask. The device structure is below the mask. The mask is lifted off to expose a top portion of the device struc... | 08/09/2011 |
| 7972522 | Slotted guide structure The invention relates to a method for producing a slotted guide, in which: a) a layer of a material having a refractive index less than that of silicon, for example Material having a refractive index less than that of silicon (2... | 07/05/2011 |
| 7964107 | Methods using block copolymer self-assembly for sub-lithographic patterning Block copolymers can be self-assembled and used in methods as described herein for sub-lithographic patterning, for example. The block copolymers can be diblock copolymers, triblock copolymers, multiblock copolymers, or combinations thereof. Such methods can be usef... | 06/21/2011 |
| 7951302 | Method for forming bump of probe card A method for forming a bump of a probe card is disclosed. In accordance with the method, a bump having a high aspect ratio for supporting a probe tip and a probe beam is formed using a semiconductor substrate as a mold eliminating a need for a photoresist film. ... | 05/31/2011 |
| 7910010 | Ink jet head having an electrostatic actuator and manufacturing method of the same An inkjet head having an electrostatic actuator and a manufacturing method of the same are disclosed. The inkjet head having an electrostatic actuator, comprising a stator, on which is formed a plurality of comb pattern shaped first protrusion parts and second protr... | 03/22/2011 |
| 7867405 | Process for producing microfluidic arrangements from a plate-shaped composite structure A process for producing a multiplicity of microfluidic arrangements from a plate-shaped composite structure and an atomiser which is provided with such nozzle arrangements is proposed. Each arrangement has a groove structure which forms flow channels and the dimensi... | 01/11/2011 |
| 7828983 | Semiconductor texturing process The invention provides a process for texturing a surface of a semiconductor material, the process comprising: applying a layer of a protective substance on said surface wherein said layer is sufficiently thin that it has a plurality of apertures therethrough; and co... | 11/09/2010 |
| 7727408 | Semiconductor texturing process The invention provides a process for texturing a surface of a semiconductor material, the process comprising: applying a layer of a protective substance on said surface wherein said layer is sufficiently thin that it has a plurality of apertures therethrough; and co... | 06/01/2010 |
| 7658858 | Band filter using film bulk acoustic resonator and method of fabricating the same A band filter using a film bulk acoustic resonator and a method of fabricating the same. The method includes the steps of forming a membrane layer on a substrate, forming a plurality of resonators on an upper surface of the membrane layer, depositing a mask layer on... | 02/09/2010 |
| 7585421 | Method of producing a sheet comprising through pores and the application thereof in the production of micronic and submicronic filters The method comprises the following steps: preparing a sheet having thickness of 5 μm to a few tens of micrometers, suitable for being etched by a lithographic operation; making a mask on a face of the sheet, the m... | 09/08/2009 |
| 7540969 | High thermal conducting circuit substrate and manufacturing process thereof A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two si... | 06/02/2009 |
| 7497960 | Method for manufacturing a filter A method for manufacturing a filter is provided which can easily manufacture the filter that has both excellent anti-corrosion properties and anti-abrasion properties. In the method, a first substrate is produced that has a plurality of holes, a ceramic layer will b... | 03/03/2009 |
| 7497959 | Methods and structures for protecting one area while processing another area on a chip Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both... | 03/03/2009 |
| 7488428 | Method for forming stacked via-holes in printed circuit boards A method for forming stacked via-holes on a printed circuit board includes the steps of: providing a printed circuit board having a conductive trace formed on a side surface thereof; forming a first copper-clad laminate on the side surface having the conductive trac... | 02/10/2009 |
| 7442318 | Method of making thermal print head A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor layer formation step, a single conductor layer including first and se... | 10/28/2008 |
| 7431860 | Etching process A method for etching a pattern in a material in precise target areas comprising depositing selectively onto the material droplets of a substance for dissolving or reacting chemically with the material. Droplets may be deposited from a print head of the type having a... | 10/07/2008 |
| 7429335 | Substrate passage formation A method for forming an opening through a substrate includes removing a first portion of a first face of a substrate to form a first recessed surface oblique to the first face and removing a second portion of the substrate to form a passage extending through the sub... | 09/30/2008 |
| 7422696 | Multicomponent nanorods Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of... | 09/09/2008 |
| 7407596 | Fluxgate sensor integrated in printed circuit board and method for manufacturing the same A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound ar... | 08/05/2008 |
| 7407595 | Optical member, manufacturing method of the optical member, waveguide substrate, and photo-electric integrated substrate A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by etching, forming openings corresponding to the inclined surfaces in a plat... | 08/05/2008 |
| 7403095 | Thin film resistor structure and method of fabricating a thin film resistor structure A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is a combination of a Titanium (Ti) layer and a Titanium Nitride (TiN) l... | 07/22/2008 |
| 7399423 | Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 07/15/2008 |
| 7396475 | Method of forming stepped structures employing imprint lithography The present invention provides a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the substrate. ... | 07/08/2008 |
| 7393457 | Method for making a shadow mask for an opposed discharge plasma display panel The present invention is to provide a method for making a shadow mask for an opposed discharge plasma display panel by etching one lateral surface of a metal slab to produce a plurality of parallel and equidistant barrier ribs along the vertical and horizontal direc... | 07/01/2008 |
| 7390422 | Method for manufacturing printing plate A method for manufacturing a printing plate is realizes a precise and fine pattern by minimizing a variation of etching critical dimension. The method includes forming a hard mask having an opening on an insulating substrate; forming a first trench having a first de... | 06/24/2008 |
| 7387740 | Method of manufacturing metal cover with blind holes therein An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; ste... | 06/17/2008 |
| 7387739 | Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrument A plurality of penetrating holes are formed in a substrate, each of the penetrating holes connecting a first opening and a second opening larger than the first opening. An etching resistant film is formed on a first surface of the substrate avoiding areas in which t... | 06/17/2008 |
| 7371663 | Three dimensional IC device and alignment methods of IC device substrates Alignment methods of IC device substrates. A first IC device substrate has a first front side for defining a plurality of first IC features, a first backside opposite the first front side, and a first alignment pattern formed on the first front side or the first bac... | 05/13/2008 |
| 7367114 | Method for plasma etching to manufacture electrical devices having circuit protection Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair of conductive electrodes connected to an electrical protection compone... | 05/06/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7361284 | Method for wafer-level package A method for wafer-level package. A cap wafer having cavities is bonded to a support wafer, and a portion of the cap wafer is etched through. The cap wafer is released from the support wafer, and bonded to a transparent wafer, and a portion of the cap wafer correspo... | 04/22/2008 |
| 7356905 | Method of fabricating a high frequency ultrasound transducer Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epo... | 04/15/2008 |
| 7358184 | Method of forming a conductive via plug A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low... | 04/15/2008 |
| 7352052 | Semiconductor device and manufacturing method therefor There is disclosed a semiconductor device comprising at least one semiconductor element, one chip mounting base being provided at least one first interconnection on one major surface thereof and at least one second interconnection on the other major surface thereof,... | 04/01/2008 |
| 7347949 | Method of manufacturing a wiring board by utilizing electro plating A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electrol... | 03/25/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
