Quotables
"We are probably nearing the limit of all we can know about astronomy."
Simon Newcomb, astronomer ; 1888
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8092696 | Method for manufacturing printed circuit board An insulating layer made of an insulator film or the like is prepared. Then, a thin metal film and a thin copper film are formed in sequence on the insulating layer. The thin copper film is subsequently laminated with a dry film or the like, and exposed and develope... | 01/10/2012 |
| 7785482 | Method of making an ignition device A method of manufacturing an ignition device is provided. The method includes patterning a plurality of resistors on a membrane to form heating elements and thermally isolating the heating elements from an external environment via a cavity disposed adjacent to the h... | 08/31/2010 |
| 7403095 | Thin film resistor structure and method of fabricating a thin film resistor structure A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is a combination of a Titanium (Ti) layer and a Titanium Nitride (TiN) l... | 07/22/2008 |
| 7396711 | Method of fabricating a multi-cornered film Embodiments of the present invention describe a method of forming a multi-cornered film. According to the embodiments of the present invention, a photoresist mask is formed on a hard mask film formed on a film. The hard mask film is then patterned in alignment with ... | 07/08/2008 |
| 7368173 | Siloxane resin-based anti-reflective coating composition having high wet etch rate Herein we disclose a composition, comprising a siloxane resin having the formula (HSiO3/2)a. (SiO4/2)b(HSiX3/2)c(SiX4/2)d, wherein each X is independently —O—, —OH, or —O... | 05/06/2008 |
| 7361447 | Photoresist polymer and photoresist composition containing the same Photoresist polymers and photoresist compositions containing the same. Photoresist patterns of less than 50 nm are achieved with EUV (Extreme Ultraviolet) as an exposure light source with photoresist compositions comprising (i) a photoresist polymer comprising a pol... | 04/22/2008 |
| 7361869 | Method for the production of an electrically conductive resistive layer and heating and/or cooling device An electrically conductive resistive layer (26) is produced by thermally spraying an electrically conductive material (18) onto the surface of a non-conductive substrate (12). Initially, the material layer (14) arising therefrom has no de... | 04/22/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7341958 | Integrated process for thin film resistors with silicides The formation of devices in semiconductor material. In one embodiment, a method of forming a semiconductor device is provided. The method comprises forming at least one hard mask overlaying at least one layer of resistive material. Forming at least one opening to a ... | 03/11/2008 |
| 7326872 | Multi-frequency dynamic dummy load and method for testing plasma reactor multi-frequency impedance match networks In one implementation, a method is provided for testing a plasma reactor multi-frequency matching network comprised of multiple matching networks, each of the multiple matching networks having an associated RF power source and being tunable within a tunespace. The m... | 02/05/2008 |
| 7326624 | Method of making thin-film chip resistor A method of making a thin-film chip resistor includes: a step of making a material plate A formed with lengthwise breaking grooves A1 and crosswise breaking grooves A2 along which the plate is to be divided into individual chip substrates 1 each... | 02/05/2008 |
| 7309657 | Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board Provided is a method for manufacturing a circuit board including an electrode wiring formed above a surface portion of a substrate, and a plurality of electrothermal converting elements which have a heating resistor film for generating thermal energy formed above th... | 12/18/2007 |
| 7303785 | Antireflective film material, and antireflective film and pattern formation method using the same It is an object of the present invention to provide a material for an antireflective film that has high etching selectivity with respect to the resist, that is, that has a faster etching speed than the resist, a pattern formation method for forming an antireflective... | 12/04/2007 |
| 7282257 | Resin composition and adhesive film for multi-layered printing wiring board The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being... | 10/16/2007 |
| 7278202 | Method for making overlay surface mount resistor A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween... | 10/09/2007 |
| 7268663 | Precision thin film AC voltage divider A precision AC input voltage divider of input resistance RI and feedback resistance RF on a substrate is printed as a serpentine pattern for a thin line of resistive material. The input resistance is formed between a first and second terminal, ... | 09/11/2007 |
| 7247250 | Method for manufacturing a fast heat rise resistor A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conducti... | 07/24/2007 |
| 7244370 | Method for producing circuit substrate In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a... | 07/17/2007 |
| 7223668 | Method of etching metallic thin film on thin film resistor An Al film is formed on a barrier metal covering a thin film resistor to have a first opening. A photo-resist is formed on the Al film and in the opening, and is patterned to have a second opening having an opening area smaller than that of the first opening and ope... | 05/29/2007 |
| 7223480 | Metal laminate and etching method therefor The present invention relates to a metal laminate which is broadly used for a flexible wiring board or the like and an etching method therefor. In particular, the present invention relates to a metal laminate which includes a layer obtained by laminating a metal lay... | 05/29/2007 |
| 7202013 | Antireflective film material, and antireflective film and pattern formation method using the same It is an object of the present invention to provide a material for an antireflective film that has high etching selectivity with respect to the resist, that is, that has a faster etching speed than the resist, a pattern formation method for forming an antireflective... | 04/10/2007 |
| 7189631 | Semiconductor device and manufacturing method thereof It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Fur... | 03/13/2007 |
| 7166534 | Method of dry cleaning photoresist strips after via contact etching Semiconductor manufacturing processes that reduce production costs as well as increase throughput by substituting the PR strip and ACT wet cleaning procedure after the via contact etching of a semiconductor with dry cleaning to be performed while removing a photores... | 01/23/2007 |
| 7160476 | Method of manufacturing an electronic device The electronic device (100) comprises an electrical element (30), for instance a MEMS capacitor or a BAW filter in a cavity (37) that is protected from the environment by a cover (38). The cover (38) is a patterned layer which is m... | 01/09/2007 |
| 7159311 | Method of making an interposer with contact structures A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package.... | 01/09/2007 |
| 7151385 | Contact probe, method of manufacturing the contact probe, and device and method for inspection A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the res... | 12/19/2006 |
| 7150820 | Thiourea- and cyanide-free bath and process for electrolytic etching of gold An aqueous thiourea-free gold etching bath for electrolytically etching gold from a microelectronic workpiece. One embodiment of the aqueous thiourea-free bath contains: (a) about 0.5–1.5 M iodide; (b) about 0.1–0.3 M sulfite; and (c) about 1.0–3.0 g/L wetting... | 12/19/2006 |
| 7151431 | Resistor element, stress sensor and method for manufacturing them A stress sensor in which the direction and magnitude of a stress being applied to a post (6) bonded to or integrated with the surface of an insulating board (3) can be grasped from variation in the resistance of a plurality of resistor elements (8 | 12/19/2006 |
| 7143509 | Circuit board and processing method thereof A circuit board essentially comprises a first laminated structure, at least a first plated through hole, at least a second laminated structure, a middle dielectric layer and at least a second plated through hole is disclosed. The first laminated structure has at lea... | 12/05/2006 |
| 7132056 | Method of fabricating a fluid ejection device using a planarizing step A method of fabricating a fluid ejection device includes the step of forming a plurality of micro-electromechanical fluid ejection devices on a substrate that incorporates drive circuitry such that each device includes a micro-electromechanical actuator that is in e... | 11/07/2006 |
| 7112286 | Thin film resistor structure and method of fabricating a thin film resistor structure A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is a combination of a Titanium (Ti) layer and a Titanium Nitride (TiN) l... | 09/26/2006 |
| 7100270 | Method of fabricating a thin film integrated circuit with thick film resistors A method of fabricating printed circuit boards integrating thick film resistor components and thin film circuit portions thereon is disclosed. This is a two-phase process, where the first phase is to create multiple thick film resistors, and the second phase is to c... | 09/05/2006 |
| 7097923 | Method for forming thin film heads using a tri-layer anti-reflection coating for photolithographic applications and a structure thereof A tri-layer anti-reflective coating for use in photolithographic applications, and specifically, for use in ultraviolet photolithographic processes. The tri-layered anti-reflective coating is used to minimize pattern distortion due to reflections from neighboring fe... | 08/29/2006 |
| 7087183 | Method of using an etchant solution for removing a thin metallic layer A method for removing a thin metallic layer using an etchant solution is provided for essentially eliminating undercutting in a thin metallic layer such as a seed layer in a magnetic recording head. The etchant solution has a suitable solvent additive such as glycer... | 08/08/2006 |
| 7082844 | Strain sensor having improved accuracy A strain sensor that is suited for use as an occupant weight sensor in a vehicle seat is disclosed. The strain sensor includes a substrate having a top surface and a bottom surface. Several bumps are located on the top surface. The bumps extend above the top surface... | 08/01/2006 |
| 7059041 | Methods for producing passive components on a semiconductor substrate Methods are specified for producing passive components on a substrate, which methods permit, with a low outlay and a good yield, the production of different components, in particular high-resistance and low-resistance resistor elements and/or capacitor elements havi... | 06/13/2006 |
| 7049928 | Resistor and method of manufacturing the same The resistor of the present invention comprises a substrate, a pair of electrodes, and a resistor element comprising rectangular sections connected to the pair of electrodes and a S-shaped section disposed between the rectangular sections and is free of trimming por... | 05/23/2006 |
| 7025893 | Structure and method to compensate for thermal edge loss in thin film heaters A thin film heater includes at least two open regions formed along each of two spaced-apart edges of the thin film material, which edges are parallel to two spaced-apart edges of the underlying substrate. The open regions expose areas of underlying substrate. When e... | 04/11/2006 |
| 7025892 | Method for creating gated filament structures for field emission displays A method is provided for creating gated filament structures for a field emission display. A multi-layer structure is provided that includes a substrate, an insulating layer and a metal gate layer positioned on at least a portion of a top surface of the insulating la... | 04/11/2006 |
| 7026254 | Manufacture of masks and electronic parts A precursor that may be imaged by heat is made up of a substrate, for example a copper board, and a composite layer structure composed of two layers. Preferably, the first layer is composed of an aqueous developable polymer mixture containing a photothermal conversi... | 04/11/2006 |
