Bizarre Patents
Mouse device with a built-in printer
A mouse device for use as an input device of a computer is provided that includes a housing in which recording paper is loadable, and a printer unit provided within the housing for printing on the recording paper print information received from the computer.
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| Number | Title | Issue Date |
| 7534361 | Methods for making laminated member for circuit board, making circuit board and laminating flexible film The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit ... | 05/19/2009 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7354796 | Method for fabricating semiconductor package free of substrate A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in t... | 04/08/2008 |
| 7251872 | Method for forming a chip package A chip package is formed which has an array of leads, wherein successive leads are staggered in all three dimensions (X, Y, and Z) relative to one another to permit a large number of leads available in a confined space while maintaining the minimum separation necess... | 08/07/2007 |
| 7217990 | Tape package having test pad on reverse surface and method for testing the same A tape package in which a test pad is formed on a reverse surface is provided. The test pad is disposed on a reverse surface of a base film through a through hole of the base film. Accordingly, shapes of the test pads are standardized so that a universal probe card ... | 05/15/2007 |
| 7213335 | Method for manufacturing printed circuit boards The amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges can be reduced. A method is provided which includes the steps of forming holes which pass through an insulating board and a first conductor layer formed on ... | 05/08/2007 |
| 7214326 | Increased capacity leadframe and semiconductor package using the same In accordance with the present invention, there is provided a method for manufacturing a semiconductor package. The method comprises the initial step of applying first and second photoresist layers to respective ones of opposed first and second surfaces of a metal p... | 05/08/2007 |
| 7192807 | Wafer level package and fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 03/20/2007 |
| 7163896 | Biased Hetch process in deposition-etch-deposition gap fill Biased plasma etch processes incorporating H2 etch chemistries. In particular, high density plasma chemical vapor etch-enhanced (deposition-etch-deposition) gap fill processes incorporating etch chemistries which incorporate hydrogen as the etchant that c... | 01/16/2007 |
| 7161232 | Apparatus and method for miniature semiconductor packages A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent th... | 01/09/2007 |
| 7160401 | Use of a low-alloyed copper alloy and hollow profile component made therefrom Use of a low-alloyed, phosphorus-deoxidized copper alloy (DHP-Cu) for manufacturing hollow profile components by internal high-pressure forming, the copper alloy having the following composition: 0.030 to 0.080 wt-% of at least one element of a group including tin (... | 01/09/2007 |
| 7145222 | Leadless semiconductor package A leadless semiconductor package mainly comprises a leadless lead-frame, a chip, a silver paste and a plurality of electrically conductive wires. The leadless lead-frame includes a chip paddle and a plurality of leads surrounding the chip paddle wherein the chip pad... | 12/05/2006 |
| 7144517 | Manufacturing method for leadframe and for semiconductor package using the leadframe In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer, the primary leadframe including a die paddle and a plurality of leads ... | 12/05/2006 |
| 7138064 | Semiconductor device and method of manufacturing the same The present invention relates to a method of manufacturing a semiconductor device. In the method, an etching-back layer consisting of aluminum or copper is formed on a base substrate and a multilayer wiring board is manufactured on the etching-back layer. After that... | 11/21/2006 |
| 7135781 | Low profile, chip-scale package and method of fabrication Disclosed is a semiconductor device that includes an electrically insulating, sheet-like substrate (301) with first and second surfaces (301a, 301b), at least one opening (310), and a certain thickness (302). On the f... | 11/14/2006 |
| 7115443 | Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method The invention relates to a method of manufacturing a packaged semiconductor device comprising subjecting a metal carrier provided with at least one semiconductor crystal, the semiconductor crystal being provided with an encapsulation, to a singulation step in a dici... | 10/03/2006 |
| 7115496 | Method for protecting the redistribution layer on wafers/chips The invention relates to a method for protecting the redistribution layer on wafers/chips, which preferably comprises a structure constructed from a seed layer, a layer of copper situated on the seed layer, a nickel layer arranged thereon, and a gold layer covering ... | 10/03/2006 |
| 7102210 | Lead frame, manufacturing method of the same, and semiconductor device using the same In order to mount a semiconductor element of a small electrode pitch, an inner lead portion of a lead frame is made thin and narrow to reduce a pitch. Even a semiconductor element in which an electrode arrangement pitch is smaller than conventionally can be mounted ... | 09/05/2006 |
| 7102216 | Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making A leadframe, a semiconductor package, and methods of making the same are disclosed. A leadframe includes leads having an inner end segment. A first subset of the leads include a recess in a first surface of the inner end segment. A second subset of the leads include... | 09/05/2006 |
| 7091581 | Integrated circuit package and process for fabricating the same A process for fabricating an integrated circuit package includes: selectively etching a leadframe strip to define a die attach pad and at least one row of contact pads; mounting a semiconductor die to one side of the leadframe strip, on the die attach pad; wire bond... | 08/15/2006 |
| 7056766 | Method of forming land grid array packaged device A method of packaging an integrated circuit die (12) includes the steps of forming an array of soft conductive balls (14) in a fixture (30) and flattening opposing sides of the balls. The flattened balls are then transferred from the fixture to ... | 06/06/2006 |
| 7052619 | Method for manufacturing printed circuit boards from an extruded polymer Manufacturing process for manufacturing printed circuit boards from an extruded polymer, comprising the steps:-preparing an electro-conductive plate (10) and form embossments (11) by means of selective engraving on a first side (10a), cor... | 05/30/2006 |
| 7009286 | Thin leadless plastic chip carrier A leadless plastic chip carrier is fabricated by selectively etching a leadframe strip to reduce a thickness of the strip at a portion thereof. Selectively masking the surface of the leadframe strip using a mask, follows selectively etching, to provide exposed areas... | 03/07/2006 |
| 7002779 | Thermal pole-tip recession/slide shape variation reduction A bond pad is elevated from a slider body by a conductive post. The bond pad is disposed atop the post, which typically possesses a cross-sectional area smaller than the surface are of the bond pad. Thus, rather than having the entire surface of the bond pad in cont... | 02/21/2006 |
| 6967125 | Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on th... | 11/22/2005 |
| 6964918 | Electronic components such as thin array plastic packages and process for fabricating same A process for fabricating an integrated circuit package includes establishing a plating mask on a first surface of a metal carrier. The plating mask defines a plurality of components including a die attach pad, at least one row of contact pads and at least one addit... | 11/15/2005 |
| 6955941 | Methods and apparatus for packaging semiconductor devices A method and apparatus for increasing the integrated circuit density of a thin small outline package (“TSOP”) semicondctor assembly is provided by stacking two semiconductor dice and electrically connecting the substantially centrally located bond pads of substa... | 10/18/2005 |
| 6956182 | Method of forming an opening or cavity in a substrate for receiving an electronic component A method of forming an opening or cavity in a substrate, for receiving an electronic component, consists of or includes providing a patterned opaque masking layer on or adjacent a first major surface of the substrate, the masking layer having an opening overlying th... | 10/18/2005 |
| 6939745 | Method of producing tab tape carrier A method of producing a TAB tape carrier that can produce a TAB tape carrier in such a way as to prevent undulation at a split end surface thereof and tear of circuit pattern thereat, thereby producing the TAB tape carrier of high reliability with increased efficien... | 09/06/2005 |
| 6921682 | Method for manufacturing encapsulated electronic components, particularly integrated circuits A method for manufacturing encapsulated electronic components, particularly integrated circuits, includes the steps of: a) attaching electronic components on a first side of a lead frame and electrically connecting the electronic components to the lead frame; b) usi... | 07/26/2005 |
| 6835318 | Method for forming a recognition mark on a substrate for a KGD A method for forming a recognition mark on the back surface of a substrate for a KGD that can be easily produced at a low manufacturing cost and permits repeated use of a substrate is provided. In the method, wiring patterns are formed on a surface of one side of an... | 12/28/2004 |
| 6782610 | Method for fabricating a wiring substrate by electroplating a wiring film on a metal base The present invention relates to a method for fabricating a wiring substrate by forming an insulating film on a metal base having openings on the metal base at positions corresponding to metal bumps to be formed later; forming at least one layer of wiring on the bas... | 08/31/2004 |
| 6754952 | Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated A process facilitates manufacturing a multiple layer wiring board having therein a thin-film capacitor The process includes: forming a metallic film layer having a barrier metal layer and a metal layer to be sequentially anode oxidized on an insulating layer first c... | 06/29/2004 |
| 6663786 | Structure having embedded flush circuitry features and method of fabricating Embedded flush circuitry features are provided by depositing a conductive seed layer on the front side of a sacrificial carrier; plating a layer of conductive metal onto the seed layer and personalizing circuitry features. The front side of the carrier fi... | 12/16/2003 |
| 6602431 | Enhancements in sheet processing and lead formation A connection component for making microelectronic assemblies includes a dielectric structural layer having a first surface and a plurality of conductive leads having first and second ends overlying the first surface of the dielectric structural layer. An ... | 08/05/2003 |
| 6585905 | Leadless plastic chip carrier with partial etch die attach pad A leadless plastic chip carrier comprising a die attach pad, a semiconductor die mounted to a portion of the die attach pad and at least one row of contact pads circumscribing the die attach pad. The row of contact pads have a thickness greater than the t... | 07/01/2003 |
| 6576402 | Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures A metal layer, an etching resist and a photoresist are successively applied to an electrically insulating substrate. Whereupon the photoresist is patterned by photolithography in such a way that it covers a pattern of the later coarse conductor structures... | 06/10/2003 |
| 6540927 | Semiconductor packaging part and method producing the same A semiconductor packaging part and a method of forming the part by applying a minute plating with a high positional accuracy to a semiconductor chip to be packaged. A pair of alignment holes 2, 3 are formed at a pitch equal to n-times (n=1, 2 . . . ) of a... | 04/01/2003 |
| 6397455 | Method for forming a one-piece flexure for small magnetic heads A gimbal formed integral with a load beam by through etching a H pattern at the end of the beam to define a pair of tabs connected by a pair of beams; half etching from the head direction one tab with an defined area masked to form a load button; and half... | 06/04/2002 |
| 6306752 | Connection component and method of making same A method of making a connection component for a microelectronic element includes providing a sheet comprising an electrically conductive layer, a photoresist layer overlying the conductive layer and a photoimageable dielectric layer disposed under the con... | 10/23/2001 |
