Did You Know...
...that in 1800 ether was first used by partyers as a fun diversion? Sniffing the gas led to hilarious and raucous laughter as people watched each other become more and more intoxicated and silly. Several doctors independently realized the value ether would have to anesthetize surgery patients. Of those who claimed rights to the "discovery," none had a happy ending. One had a seizure and died defending his rights. Another spent his life in an asylum because he had been denied acclaim. A third became addicted to chloroform and, in a New York City jail, he soaked a cloth in the drug, severed an artery and bled to death.
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| Number | Title | Issue Date |
| 8187478 | Fabricating process of structure with embedded circuit A fabricating process of a structure with an embedded circuit is described as follows. Firstly, a substrate having an upper surface and a lower surface opposite to the upper surface is provided. Afterward, a dielectric layer is formed on the upper surface of the sub... | 05/29/2012 |
| 8187479 | Manufacturing method of printed circuit board Disclosed is a manufacturing method of a printed circuit board. The method in accordance with an embodiment of the present invention includes: providing a laminated substrate having an insulator as well as a first metal layer and a second metal layer, which are sequ... | 05/29/2012 |
| 8177987 | Method for producing electron-emitting device and method for producing image display apparatus including the same A method for producing an electron-emitting device includes forming a first conductive film on a side surface of an insulation layer including the side surface and a top surface connected to the side surface; forming a second conductive film from the top surface to ... | 05/15/2012 |
| 8123964 | Image sensor and method for fabricating the same An image sensor and a method for fabricating the same are provided. The image sensor includes a first conductive type substrate including a trench formed in a predetermined portion of the first conductive type substrate, a second conductive type impurity region for ... | 02/28/2012 |
| 8119016 | Removal of surface oxides by electron attachment for wafer bumping applications The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprisin... | 02/21/2012 |
| 8114303 | Method of manufacturing ceramic probe card Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Th... | 02/14/2012 |
| 8088294 | Method for manufacturing printed circuit boards An exemplary method for manufacturing printed circuit boards is provided. In the method, a copper clad substrate having a copper layer thereon is provided. A surface of the copper layer is roughened by applying an atmospheric pressure plasma thereto. A photoresist l... | 01/03/2012 |
| 8083954 | Method for fabricating component-embedded printed circuit board A method for fabricating a component-embedded PCB includes: providing a carrier plate having a plating metal layer plated thereon; disposing an electronic component on the plating metal layer of the carrier plate; laminating a metal layer onto the plating metal laye... | 12/27/2011 |
| 8075788 | Fabrication method of printed circuit board and printed circuit board machining apparatus A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of... | 12/13/2011 |
| 8066891 | Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a la... | 11/29/2011 |
| 8052881 | Method of manufacturing multilayer printed circuit board having buried holes A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer rele... | 11/08/2011 |
| 8043514 | Method of manufacturing a wiring board by utilizing electro plating When a wiring pattern is formed on a wiring board utilizing electroplating, an unnecessary portion is removed by proceeding as follows. First electroless plating layers are formed on both sides of an insulating substrate, which are covered with metallic foils in adv... | 10/25/2011 |
| 8012360 | Pressure sensor A pressure sensor for measuring an external pressure fabricated upon a ceramic substrate penetrated by a via extending from the top to the bottom of the ceramic substrate is disclosed. A sacrificial layer is deposited on a portion of the top of the ceramic substrate... | 09/06/2011 |
| 7972521 | Method of making reliable wafer level chip scale package semiconductor devices The present invention relates to a method of making a robust wafer level chip scale package and, in particular, a method that prevents cracking of the passivation layer during solder flow and subsequent multiple thermal reflow steps. In one embodiment, a passivation... | 07/05/2011 |
| 7964106 | Method for fabricating a packaging substrate A method of fabricating a packaging substrate is disclosed. A cladding sheet comprised of a first metal foil, a second metal foil and an etch stop layer interposed between the first and second metal foils is provided. The first metal foil is then patterned into a fi... | 06/21/2011 |
| 7959816 | Wet-processing apparatus and method of fabricating display panel The wet-processing apparatus includes a wet-step bath in which a wet-step is carried out, and a vibration-type film separator for separating impurities out of a solution used in the wet-step. The wet-processing apparatus further includes a re-supply path through whi... | 06/14/2011 |
| 7951301 | Method for producing a ceramic printed-circuit board A method produces of a ceramic circuit board that has a ceramic substrate on a top side of the circuit board, solderable contact pads for components, and solderable contacts on an underside of the circuit board. The metallization for the solderable contact pads is p... | 05/31/2011 |
| 7938972 | Fabrication method of electronic device A fabrication method of an electronic device is provided. First, a substrate is provided. Then, a patterned amorphous carbon (α-C) layer is formed on the substrate and exposes part of the substrate. Next, a first α-C layer covering the patterned α-C layer and par... | 05/10/2011 |
| 7922918 | Method of manufacturing circuit board used for switch device There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that requ... | 04/12/2011 |
| 7922919 | Crossbar-array designs and wire addressing methods that tolerate misalignment of electrical components at wire overlap points Various embodiments of the present invention are directed to crossbar array designs that interfaces wires to address wires, despite misalignments between electrical components and wires. In one embodiment, a nanoscale device may be composed of a first layer of two o... | 04/12/2011 |
| 7897055 | Method for manufacturing multilayer flexible printed circuit board The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the... | 03/01/2011 |
| 7867404 | Method for converting electrical components A method for removing an undesirable material from an electronic or electrical component and introducing a desirable material in place of the undesirable material. The method can include the replacement of a leaded material found on the component with a no-lead mate... | 01/11/2011 |
| 7857982 | Methods of etching features into substrates The invention includes methods of etching features into substrates. A plurality of hard mask layers is formed over material of a substrate to be etched. A feature pattern is formed in such layers. A feature is etched only partially into the substrate material using ... | 12/28/2010 |
| 7857983 | Method for manufacturing piezoelectric resonator To provide a method for manufacturing a piezoelectric resonator which can widen the range of frequency adjustment while saving metal thereby suppressing reduction of the yields when forming a metal film for frequency adjustment at the tip of an vibrating arm. The me... | 12/28/2010 |
| 7780862 | Device and method for etching flash memory gate stacks comprising high-k dielectric In one implementation, a method is provided capable of etching a wafer to form devices including a high-k dielectric layer. The method includes etching an upper conductive material layer in a first plasma chamber with a low cathode temperature, transferring the wafe... | 08/24/2010 |
| 7767102 | Systems and methods for harvesting and integrating nanowires The present invention is directed to methods to harvest, integrate and exploit nanomaterials, and particularly elongated nanowire materials. The invention provides methods for harvesting nanowires that include selectively etching a sacrificial layer placed on a nano... | 08/03/2010 |
| 7749396 | Method of manufacturing fine features for thin film transistors A process for fabricating fine features such as small gate electrodes on a transistor. The process involves the jet-printing of a mask and the plating of a metal to fabricate sub-pixel and standard pixel size features in one layer. Printing creates a small sub-pixel... | 07/06/2010 |
| 7744768 | Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof A resist pattern thickening material has resin, a crosslinking agent and a compound having a cyclic structure, or resin having a cyclic structure at a part. A resist pattern has a surface layer on a resist pattern to be thickened with etching rate (nm/s) ratio of th... | 06/29/2010 |
| 7699996 | Sidewall image transfer processes for forming multiple line-widths A method for simultaneously forming multiple line-widths, one of which is less than that achievable employing conventional lithographic techniques. The method includes providing a structure which includes a memory layer and a sidewall image transfer (SIT) layer on t... | 04/20/2010 |
| 7691275 | Use of step and flash imprint lithography for direct imprinting of dielectric materials for dual damascene processing In some embodiments, the present invention is directed to methods that involve the combination of step-and-flash imprint lithography (SFIL) with a multi-tier template to simultaneously pattern multiple levels of, for example, an integrated circuit device. In such em... | 04/06/2010 |
| 7670497 | Oxidant and passivant composition and method for use in treating a microelectronic structure A composition that may be used for cleaning a metal containing conductor layer, such as a copper containing conductor layer, within a microelectronic structure includes an aqueous acid, along with an oxidant material and a passivant material contained within the aqu... | 03/02/2010 |
| 7670496 | Process for producing structural body and etchant for silicon oxide film A structural body comprising a substrate and a structural layer formed on the substrate through an air gap in which the structural layer functions as a micro movable element is produced by a process comprising a film-deposition step of successively forming a sacrifi... | 03/02/2010 |
| 7666320 | Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed ... | 02/23/2010 |
| 7666321 | Method for decapsulating package A method for decapsulating a package is provided. The method comprises steps of providing a package having a chip therein, wherein the chip has an active surface and a rear surface. Further, the package further comprises a heat sink, a plurality of solder bumps, a s... | 02/23/2010 |
| 7615162 | Printed wiring board and method for manufacturing the same A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at... | 11/10/2009 |
| 7608192 | Image sensor and method for fabricating the same An image sensor and a method for fabricating the same are provided. The image sensor includes a first conductive type substrate including a trench formed in a predetermined portion of the first conductive type substrate, a second conductive type impurity region for ... | 10/27/2009 |
| 7597813 | Element substrate and method of manufacturing the same A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing a second support substrate on the first support substrate so that the... | 10/06/2009 |
| 7585420 | Carbon nanotube substrates and catalyzed hot stamp for polishing and patterning the substrates The present invention is generally directed to catalyzed hot stamp methods for polishing and/or patterning carbon nanotube-containing substrates. In some embodiments, the substrate, as a carbon nanotube fiber end, is brought into contact with a hot stamp (typically ... | 09/08/2009 |
| 7585419 | Substrate structure and the fabrication method thereof A substrate structure and the fabrication method thereof are provided herein. The present invention utilizes a laminate as the support of the package process and then removes the laminate after the following package steps so as to obtain a quite smooth surface for u... | 09/08/2009 |
| 7566404 | Method of fabricating a thin film transistor An etchant for patterning composite layer containing copper is provided. The etchant includes peracetic acid being about 5% to 40% by weight and serving as a major component, a peracetic acid stabilizer being about 5% to 15% by weight, an organic acid being about 5%... | 07/28/2009 |
