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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 7645393 | Metal surface treatment composition A process is described for treating metal surfaces with roughening compositions that use poly(ethyleneamino propionitrile) polymer as an additive in the composition to improve adhesion of polymeric materials to the metal surfaces and to improve peel strength for the... | 01/12/2010 |
| 7404910 | Etching solution, etched article and method for etched article An etching solution which contains hydrogen fluoride (HF) and exhibits an etching rate ratio: etching rate for a boron-glass film (BSG) or boron-phosphorus-glass film (BPSG)/etching rate for a thermally oxidized film (THOX) of 10 or more at 25° C. ... | 07/29/2008 |
| 7393461 | Microetching solution The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal layer to a subsequently applied layer. The microetching composition is an... | 07/01/2008 |
| 7384871 | Chemical mechanical polishing compositions and methods relating thereto The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by wei... | 06/10/2008 |
| 7368065 | Implants with textured surface and methods for producing the same Compositions and methods are provided for preparing a metal substrate having a uniform textured surface with a plurality of indentations with a diameter in the nanometer and micrometer range. The textured surface is produced by exposing the substrate to an etching f... | 05/06/2008 |
| 7357879 | Etching solution, method of etching and printed wiring board There is provided an etching solution comprised of a cupric chloride solution and a high-concentration triazole type compound added to the cupric chloride solution and capable of forming an etching-inhibiting coating. In a process of forming a circuit pattern by etc... | 04/15/2008 |
| 7348302 | Foam cleaning and brightening composition comprising a sulfate/bisulfate salt mixture A cleaning composition including a metal bisulfate and metal inorganic salt acid package, and at least one surfactant. The cleaning composition can be a one-step wheel cleaner/brightener. The composition preferably contains no HF, no bifluoride, no oxalic acid, or o... | 03/25/2008 |
| 7341958 | Integrated process for thin film resistors with silicides The formation of devices in semiconductor material. In one embodiment, a method of forming a semiconductor device is provided. The method comprises forming at least one hard mask overlaying at least one layer of resistive material. Forming at least one opening to a ... | 03/11/2008 |
| 7306681 | Method of cleaning a semiconductor substrate A cleaning method and cleaning recipes are disclosed. The present invention relates to a method for cleaning a semiconductor substrate and cleaning recipes. The present invention utilizes a first cleaning solution including diluted hydrofluoric acid and a second cle... | 12/11/2007 |
| 7303993 | Chemical mechanical polishing compositions and methods relating thereto The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer bl... | 12/04/2007 |
| 7285229 | Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, c... | 10/23/2007 |
| 7279425 | Polishing method A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film fo... | 10/09/2007 |
| 7258808 | High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same A high-power BGA includes a printed circuit board with a through hole, connection pads formed on the bottom of the printed circuit board, matrix solder balls surrounding the through hole and adjacent to the connection pads, a heat spreader on the top surface of the ... | 08/21/2007 |
| 7232528 | Surface treatment agent for copper and copper alloy The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in elec... | 06/19/2007 |
| 7232529 | Polishing compound for chemimechanical polishing and polishing method This invention provides a polishing medium for CMP, comprising an oxidizing agent, a metal-oxide-dissolving agent, a protective-film-forming agent, a water-soluble polymer, and water, and a polishing method making use of this polishing medium. Also, it is preferable... | 06/19/2007 |
| 7232478 | Adhesion promotion in printed circuit boards An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is... | 06/19/2007 |
| 7229569 | Etching reagent, and method for manufacturing electronic device substrate and electronic device The present invention provides an etching agent that is able to etch a Cu film by a simple chemical etching method such as an immersion method when the low resistance Cu film is used for a wiring material, while allowing time-dependent changes of the etching rate to... | 06/12/2007 |
| 7189336 | Etchant, method for roughening copper surface and method for producing printed wiring board An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manu... | 03/13/2007 |
| 7186305 | Process for improving the adhesion of polymeric materials to metal surfaces A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, an unsaturated alkyl substituted with an aromatic or non-aromatic cyclic groups, and optionally but preferably a source of adhesion enhancin... | 03/06/2007 |
| 7163897 | Method for assaying elements in a substrate for optics, electronics, or optoelectronics The invention provides a method of assaying at least one element in a material including silicon. The method includes the steps of decomposing a portion of the material with an etching agent to form a solution containing hexafluorosilicic acid and at least one eleme... | 01/16/2007 |
| 7153445 | Method for roughening copper surfaces for bonding to substrates The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened... | 12/26/2006 |
| 7128825 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 10/31/2006 |
| 7108795 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con... | 09/19/2006 |
| 7087183 | Method of using an etchant solution for removing a thin metallic layer A method for removing a thin metallic layer using an etchant solution is provided for essentially eliminating undercutting in a thin metallic layer such as a seed layer in a magnetic recording head. The etchant solution has a suitable solvent additive such as glycer... | 08/08/2006 |
| 7067068 | Method for preventing lead from dissolving from a lead-containing copper-based alloy A lead-containing copper-based alloy is immersed into a weak acidic or neutral etching solution having a buffer effect which is formed by adding an organic acid into a complexing agent having a high ability to form a complexing ion with lead, and lead particles pres... | 06/27/2006 |
| 7063800 | Methods of cleaning copper surfaces in the manufacture of printed circuit boards The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing age... | 06/20/2006 |
| 7060631 | Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates The invention encompasses a semiconductor processing method of cleaning a surface of a copper-containing material by exposing the surface to an acidic mixture comprising Cl−, NO3− and F−. The invention also includes ... | 06/13/2006 |
| 7037350 | Composition for chemical-mechanical polishing and method of using same A composition for chemical-mechanical polishing, comprising an aqueous solution and an abrasive that comprises polymer particles, is described. The polymer particles carry an electrical charge, such that nearby particles repel one another. Accordingly, aggregation o... | 05/02/2006 |
| 7030033 | Method for manufacturing circuit devices Priorly, semiconductor devices wherein a flexible sheet with a conductive pattern was employed as a supporting substrate, a semiconductor element was mounted thereon, and the ensemble was molded have been developed. In this case, problems occur that a multilayer wir... | 04/18/2006 |
| 6969638 | Low cost substrate for an integrated circuit device with bondpads free of plated gold Disclosed herein is a process for assembling an integrated circuit, as well as the assembly resulting from the process, employing a surface treatment of bondpad surfaces. In one aspect, a method of assembling an integrated circuit includes providing a substrate havi... | 11/29/2005 |
| 6949470 | Method for manufacturing circuit devices Priorly, semiconductor devices wherein a flexible sheet with a conductive pattern was employed as a supporting substrate, a semiconductor element was mounted thereon, and the ensemble was molded have been developed. In this case, problems occur that a multilayer wir... | 09/27/2005 |
| 6946027 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con... | 09/20/2005 |
| 6902626 | Method for roughening copper surface A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive p... | 06/07/2005 |
| 6902591 | Polishing composition A polishing composition comprising an abrasive, water and an organic acid or a salt thereof, wherein the composition has a specified viscosity of from 1.0 to 2.0 mPa·s at a shearing rate of 1500 s−1 and 25° C.; a roll-off reducing agent comprising a B... | 06/07/2005 |
| 6899814 | Creating a mask for producing a printing plate In order to simplify the sequence of creating a mask, in particular for producing a printing plate, and at the same time to improve the quality of the printing plate produced by means of a mask, the use of laser-induced thermal transfer is provided. The structure in... | 05/31/2005 |
| 6899818 | Method and composition for removing sodium-containing material from microcircuit substrates A method and composition for removing sodium-containing materials such as photoresist from microcircuit substrate material utilizes 1,2-Diaminocyclohexanetetracarboxylic Acid in an organic solvent. ... | 05/31/2005 |
| 6893578 | Selective etchant for oxide sacrificial material in semiconductor device fabrication An etching composition and method is disclosed for removing an oxide sacrificial material during manufacture of semiconductor devices including micromechanical, microelectromechanical or microfluidic devices. The etching composition and method are based on the combi... | 05/17/2005 |
| 6861369 | Method of forming silicidation blocking layer Disclosed is a method of manufacturing a semiconductor device. First, a silicidation blocking layer is formed on a semiconductor substrate by a plasma enhanced chemical vapor deposition process. Next, the silicidation blocking layer in a region in which a metal sili... | 03/01/2005 |
| 6818142 | Potassium hydrogen peroxymonosulfate solutions A solution comprising potassium hydrogen peroxymonosulfate containing an elevated level of KHSO5 and having a weight ratio of SO5 to SO4 of greater than 1.0:1, and its use in microetching metal substrates is disclosed. ... | 11/16/2004 |
| 6793838 | Chemical milling process and solution for cast titanium alloys The present invention relates to a chemical milling solution and a chemical milling process for removing a desired depth of material from metal parts. The milling solution contains nitric acid, hydrofluoric acid, a wetting agent, such as a surfactant, dissolved tita... | 09/21/2004 |
