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Class 216/103 - Etchant contains acid


Subclass of Class 216 - Etching a substrate: processes
Definition: Process wherein the substrate is etched with H+ ion
No. of patents: 189
Last issue date: 03/01/2011


1          
NumberTitleIssue Date
7897059High tin solder etching solution
A method is provided for the removal of tin or tin alloys from substrates such as the removal of residual tin solder from the molds used in the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-...
03/01/2011
7404910Etching solution, etched article and method for etched article
An etching solution which contains hydrogen fluoride (HF) and exhibits an etching rate ratio: etching rate for a boron-glass film (BSG) or boron-phosphorus-glass film (BPSG)/etching rate for a thermally oxidized film (THOX) of 10 or more at 25° C. ...
07/29/2008
7402261Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions
A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include ...
07/22/2008
7396484Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
Ophthalmic surgical blades are manufactured from either a single crystal or poly-crystalline material, preferably in the form of a wafer. The method comprises preparing the single crystal or poly-crystalline wafers by mounting them and etching trenches into the wafe...
07/08/2008
7384570Anodized aluminum etching process and related apparatus
A process for selectively etching a surface of an anodized aluminum article. A preferred process includes: providing an aluminum sheet or web including first and second sides having anodized finishes; etching the first side to improve the adhesion capabilities of th...
06/10/2008
7368065Implants with textured surface and methods for producing the same
Compositions and methods are provided for preparing a metal substrate having a uniform textured surface with a plurality of indentations with a diameter in the nanometer and micrometer range. The textured surface is produced by exposing the substrate to an etching f...
05/06/2008
7357878Etchant, and method for fabricating a thin film transistor subtrate including conductive wires using the etchant and the resulting structure
Provided are an etchant, a method for fabricating a wire using the etchant, and a method for fabricating a thin film transistor (TFT) substrate using the etchant. The etchant includes a material having the formula 1, ammonium acetic acid, and the remainder of deioni...
04/15/2008
7341958Integrated process for thin film resistors with silicides
The formation of devices in semiconductor material. In one embodiment, a method of forming a semiconductor device is provided. The method comprises forming at least one hard mask overlaying at least one layer of resistive material. Forming at least one opening to a ...
03/11/2008
7329366Method of polishing implantable medical devices to lower thrombogenecity and increase mechanical stability
The present invention relates to a method of polishing an implantable medical device. The method may include positioning an implantable medical device on a support. At least a portion of a surface of the implantable medical device may include a polymer. A fluid may ...
02/12/2008
7314575Manufacturing method of glass substrate for magnetic disk, and manufacturing method of magnetic disk
A method for manufacturing a glass substrate for a magnetic disk comprises mirror surface polishing and cleaning of a glass substrate, wherein polishing agent of which the principal component is rare-earth oxide with content of fluorine 5% by weight or less, is supp...
01/01/2008
7306681Method of cleaning a semiconductor substrate
A cleaning method and cleaning recipes are disclosed. The present invention relates to a method for cleaning a semiconductor substrate and cleaning recipes. The present invention utilizes a first cleaning solution including diluted hydrofluoric acid and a second cle...
12/11/2007
7288203Process for producing structure, process for producing magnetic recording medium, and process for producing molded product
A process for producing a structure having a porous layer is provided. The process forms the porous layer with high thickness-controllability. The process comprises steps of preparing a layered product having, on a substrate, a first nonporous layer and a second non...
10/30/2007
7285229Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, c...
10/23/2007
7276449Gas assisted method for applying resist stripper and gas-resist stripper combinations
A method for moving resist stripper across the surface of a semiconductor substrate includes applying a wet chemical resist stripper, such as an organic or oxidizing wet chemical resist stripper, to at least a portion of a photomask positioned over the semiconductor...
10/02/2007
7255782Selective catalytic activation of non-conductive substrates
A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided. The method comprises the steps of catalyzing the non-conductive subst...
08/14/2007
7252782Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
A chemical mechanical polishing aqueous dispersion comprises abrasives (A) containing ceria, an anionic water-soluble polymer (B) and a cationic surfactant (C), wherein the amount of the anionic water-soluble polymer (B) is in the range of 60 to 600 parts by mass ba...
08/07/2007
7204911Process and apparatus for forming discrete microcavities in a filament wire using a polymer etching mask
A microcavity-forming system for making microcavities in a wire (especially a tungsten filament wire). The system has a coating station receiving the wire and applying a polymer coating to the wire. A mask-forming station receives the polymer-coated wire and blows m...
04/17/2007
7201853Method for making a metal forming structure
A method for making a forming structure for use in an apparatus for making formed polymeric film. The method comprises a multiple step process of applying a photoresist polymer to a metal base sheet, curing the polymer, acid etching the portions of the metal base sh...
04/10/2007
7192489Method for polymer residue removal following metal etching
A method for removing polymer containing residues from a semiconductor wafer including metal containing features including providing a semiconductor wafer having a process surface including metal containing features said process surface at least partially covered wi...
03/20/2007
7179753Process for planarizing substrates of semiconductor technology
In a process for planarization of semiconductor substrates in which a layer which has been applied to a semiconductor substrate which has a trench and/or contact holes is removed such that the layer remains solely in the area of the trenches or contact holes, instea...
02/20/2007
7172708Process for the fabrication of thin-film device and thin-film device
A thin-film device is fabricated by forming a protective layer and a thin-film device layer one by one on a first substrate and bonding a second substrate on the thin-film device layer via a first adhesive layer or a coating layer and first adhesive layer, removing ...
02/06/2007
7169315Method of producing an aluminium surface with a high total reflectance
A method of producing a reflector sheet, which method comprises treating an Al alloy sheet to increase the total reflectance of a surface of the sheet for use as a lighting reflector by bringing the sheet into contact with an acid or alkaline fluid that dissolves al...
01/30/2007
7163897Method for assaying elements in a substrate for optics, electronics, or optoelectronics
The invention provides a method of assaying at least one element in a material including silicon. The method includes the steps of decomposing a portion of the material with an etching agent to form a solution containing hexafluorosilicic acid and at least one eleme...
01/16/2007
7161738Secure document of value and method of manufacturing same
A secure document value includes a sheet-like substrate and a thin film, optically variable security device on the substrate. The security device includes a carrier and a multilayer coating on the carrier. The multilayer coating includes a dielectric-metal stack hav...
01/09/2007
7115171Method for removing engine deposits from turbine components and composition for use in same
A method and cleaning composition for removing engine deposits from turbine components, in particular turbine disks and turbine shafts. This method comprises the following steps: (a) providing a turbine component having a surface with engine deposits thereon, wherei...
10/03/2006
7112530Method of forming contact hole
A method of forming a contact hole in a semiconductor device, by which a PMD layer as an insulating interlayer is prevented from being overetched by wet cleaning for removing polymer and photoresist after forming a contact hole perforating the PMD layer in a manner ...
09/26/2006
7090786Aqueous dispersion for chemical/mechanical polishing
The aqueous dispersion comprising (A) abrasive grains, (B) at least one compound selected from the group consisting of 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1, 3-butanediol, 2,2-dibromo-2-nitroethanol, and 2,2-dibromo-3-nitrilopropionamide, and (C) an org...
08/15/2006
7077918Stripping apparatus and method for removal of coatings on metal surfaces
A coating is stripped off a work piece by applying a chromous and aluminiforous coat directly on the work piece and stripping the work piece with an alkaline solution containing a strong oxidant. A single-compartment system can be used, which includes a spray chambe...
07/18/2006
7063800Methods of cleaning copper surfaces in the manufacture of printed circuit boards
The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing age...
06/20/2006
7041231Method of refurbishing a transition duct for a gas turbine system
A method of refurbishing a transition duct (100) for a gas turbine system includes providing the transition duct. The transition duct has a first wall (221) defining a first passageway (110) and having holes (223) through a metal layer (
05/09/2006
7037350Composition for chemical-mechanical polishing and method of using same
A composition for chemical-mechanical polishing, comprising an aqueous solution and an abrasive that comprises polymer particles, is described. The polymer particles carry an electrical charge, such that nearby particles repel one another. Accordingly, aggregation o...
05/02/2006
7029597Anodized aluminum etching process and related apparatus
A process for selectively etching a surface of an anodized aluminum article. A preferred process includes: providing an aluminum sheet or web including first and second sides having anodized finishes; etching the first side to improve the adhesion capabilities of th...
04/18/2006
7008553Method for removing aluminide coating from metal substrate and turbine engine part so treated
A method for selectively removing an aluminide coating from at least one surface of a metal-based substrate by: (a) contacting the surface of the substrate with at least one stripping composition comprising nitric acid at a temperature less than about 20° C. to deg...
03/07/2006
6946082Apparatus and method for demetallizing a metallized film
A system and method for at least partially demetallizing a metallized film that has a metallized side and an opposite support side. In one embodiment, the method includes rotating a heat transfer roller about an axis such that a surface of the heat transfer roller p...
09/20/2005
6936183Etch process for etching microstructures
A two-step method of releasing microelectromechanical devices from a substrate is disclosed. The first step comprises isotropically etching a silicon oxide layer sandwiched between two silicon-containing layers with a gaseous hydrogen fluoride-water mixture, the ove...
08/30/2005
6930606Security device having multiple security detection features
A security device, such as a security thread, uses multiple security detection features provided by combining metal and metal/magnetic security features on a carrier substrate. The security detection features basically comprise an optionally repeating pattern of dis...
08/16/2005
6902591Polishing composition
A polishing composition comprising an abrasive, water and an organic acid or a salt thereof, wherein the composition has a specified viscosity of from 1.0 to 2.0 mPa·s at a shearing rate of 1500 s−1 and 25° C.; a roll-off reducing agent comprising a B...
06/07/2005
6884740Photoelectrochemical undercut etching of semiconductor material
Photoelectrochemical (PEC) etching is restricted to a group III nitride semiconductor-barrier interface to laterally etch or undercut the target group III nitride. The barrier interface is provided by the transparent sapphire substrate on which the target group III ...
04/26/2005
6861122Ceramic member with fine protrusions on surface and method of producing the same
The ceramic member of this invention is formed on the surfaces of crystal grains with a plurality of protrusions having smaller diameter than that of the crystal grain, said crystal grain composing at least the surface or its vicinity of a dense ceramic base materia...
03/01/2005
6861369Method of forming silicidation blocking layer
Disclosed is a method of manufacturing a semiconductor device. First, a silicidation blocking layer is formed on a semiconductor substrate by a plasma enhanced chemical vapor deposition process. Next, the silicidation blocking layer in a region in which a metal sili...
03/01/2005
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