Celebrity Inventors
Comic actor Danny Kaye received patent D166,807 for the co-design of "Blowout Toy or the Like". It's similar to one of those toys that unravels when you blow into at a birthday party except Kaye's has three blowouts going in different directions, not just one.
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| Number | Title | Issue Date |
| 7767107 | Process for producing aluminum electrode foil for capacitor and aluminum foil for etching A process for producing an aluminum electrode foil for a capacitor, which includes a first step of preparing an emulsion from a mixture including a first phase of a liquid resin or a resin solution obtained by dissolving a resin in a solvent, a second phase of a liq... | 08/03/2010 |
| 7575694 | Method of selectively stripping a metallic coating A process for chemically stripping a metallic coating on an external surface of a substrate without attacking an internal surface defined by an internal passage within the substrate. Processing steps include depositing within the internal passage a thermally-decompo... | 08/18/2009 |
| 7384570 | Anodized aluminum etching process and related apparatus A process for selectively etching a surface of an anodized aluminum article. A preferred process includes: providing an aluminum sheet or web including first and second sides having anodized finishes; etching the first side to improve the adhesion capabilities of th... | 06/10/2008 |
| 7332024 | Aluminizing composition and method for application within internal passages An aluminizing composition includes an aluminum-based powder, an inert organic pyrolysable thickener, and a binder selected from the group consisting of colloidal silica, at least one organic resin, and combinations thereof. A method for aluminizing an internal pass... | 02/19/2008 |
| 7306637 | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP The invention provides chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or ... | 12/11/2007 |
| 7291283 | Combined wet etching method for stacked films and wet etching system used for same A combined wet etching method for stacked films which is capable of performing etching processes in a collective manner while controlling an amount of side-etching on each of stacked films and of making uniform side edges. In the wet etching method, two or more type... | 11/06/2007 |
| 7288203 | Process for producing structure, process for producing magnetic recording medium, and process for producing molded product A process for producing a structure having a porous layer is provided. The process forms the porous layer with high thickness-controllability. The process comprises steps of preparing a layered product having, on a substrate, a first nonporous layer and a second non... | 10/30/2007 |
| 7279424 | Method for fabricating thin film magnetic heads using CMP with polishing stop layer A method is described for thin film processing using a selected CMP slurry with a silicon dioxide stop layer. The slurry includes an abrasive, preferably alumina, a corrosion inhibitor, preferably benzotriazole (BTA), and an oxidizer preferably hydrogen peroxide. Th... | 10/09/2007 |
| 7264740 | Process for increasing strength, flexibility and fatigue life of metals A method is described for the surface treatment of metals to improve the strength, flexibility and fatigue life of the metal, which in a preferred embodiment includes the steps of thoroughly cleaning and drying the metal surface, etching the surface of the metal to ... | 09/04/2007 |
| 7247227 | Buffer layer in flat panel display In devices such as flat panel displays, an aluminum oxide layer is provided between an aluminum layer and an ITO layer when such materials would otherwise be in contact to protect the ITO from optical and electrical defects sustained, for instance, during anodic bon... | 07/24/2007 |
| 7247256 | CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method A first chemical mechanical polishing (CMP) slurry includes a polishing agent, an oxidant, a pH control additive, and an oxide film removal retarder which reduces a removal rate of the silicon oxide film. A second chemical mechanical polishing (CMP) slurry includes ... | 07/24/2007 |
| 7232528 | Surface treatment agent for copper and copper alloy The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in elec... | 06/19/2007 |
| 7214125 | Method for controlling pH during planarization and cleaning of microelectronic substrates A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a p... | 05/08/2007 |
| 7169315 | Method of producing an aluminium surface with a high total reflectance A method of producing a reflector sheet, which method comprises treating an Al alloy sheet to increase the total reflectance of a surface of the sheet for use as a lighting reflector by bringing the sheet into contact with an acid or alkaline fluid that dissolves al... | 01/30/2007 |
| 7159298 | Method for the formation of RF antennas by demetallizing A thin and flexible radio frequency (RF) antenna tag or label is disclosed which contains an RF circuit connected to an antenna which is created by demetallizing the area around the antenna pattern on a thin, metallized substrate such as a film or paper web. Antenna... | 01/09/2007 |
| 7138064 | Semiconductor device and method of manufacturing the same The present invention relates to a method of manufacturing a semiconductor device. In the method, an etching-back layer consisting of aluminum or copper is formed on a base substrate and a multilayer wiring board is manufactured on the etching-back layer. After that... | 11/21/2006 |
| 7138065 | Method for removing at least one area of a layer of a component consisting of metal or a metal compound The invention relates to a method for removing an area of a layer of a component consisting of metal or a metal compound. According to prior art, corrosion products of a component are removed in a first step by applying a molten mass or by heating in a voluminous po... | 11/21/2006 |
| 7115193 | Sputtering target producing very few particles, backing plate or apparatus within sputtering device and roughening method by electric discharge machining Provided is a sputtering target, backing plate or apparatus inside a sputtering device in which an electrical discharge machining mark is formed on the face to which unwanted films during sputtering are deposited, and the electrical discharge machining mark is forme... | 10/03/2006 |
| 7097780 | Aluminum composite material and method of producing the same An aluminum composite material has a surface structure in which a part of lubricative granules projects by 2 μm to 25 μm from the surface of the aluminum alloy base material. The lubricative property of the lubricative granules is utilized sufficiently, and the ab... | 08/29/2006 |
| 7091862 | System and method for providing secure identification solutions utilizing a radio frequency device in a non-metallized region connected to a metallized region The present invention provides systems and methods for transmitting and receiving information from a radio frequency (RF) transponder. A conductive adhesive connects an antenna in a non-metallized region to a metallized region. This feature transforms the entire met... | 08/15/2006 |
| 7037350 | Composition for chemical-mechanical polishing and method of using same A composition for chemical-mechanical polishing, comprising an aqueous solution and an abrasive that comprises polymer particles, is described. The polymer particles carry an electrical charge, such that nearby particles repel one another. Accordingly, aggregation o... | 05/02/2006 |
| 7034688 | Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith A method for selectively removing metal from a metallized substrate (e.g., a metallized polymer film) and the formation fo devices thereby are provided. The method involves selectively exposing the metallized surface to a demetallizing (i.e., an oxidizing) chemical ... | 04/25/2006 |
| 7029597 | Anodized aluminum etching process and related apparatus A process for selectively etching a surface of an anodized aluminum article. A preferred process includes: providing an aluminum sheet or web including first and second sides having anodized finishes; etching the first side to improve the adhesion capabilities of th... | 04/18/2006 |
| 7022254 | Chromate-free method for surface etching of titanium Non-chromate solutions for treating and/or etching metals, particularly, aluminum, aluminum alloys, steel and titanium, and method of applying same wherein the solutions include either a titanate or titanium dioxide as a “drop-in replacement” for a chromium-cont... | 04/04/2006 |
| 7001533 | Chromate-free method for surface etching of aluminum and aluminum alloys Non-chromate solutions for treating and/or etching metals, particularly, aluminum, aluminum alloys, steel and titanium, and method of applying same wherein the solutions include either a titanate or titanium dioxide as a “drop-in replacement” for a chromium-cont... | 02/21/2006 |
| 6908561 | Polymide-to-substrate adhesion promotion in HDI Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of applying adhesion promoter to a clean surface of the substrate, and curing... | 06/21/2005 |
| 6893578 | Selective etchant for oxide sacrificial material in semiconductor device fabrication An etching composition and method is disclosed for removing an oxide sacrificial material during manufacture of semiconductor devices including micromechanical, microelectromechanical or microfluidic devices. The etching composition and method are based on the combi... | 05/17/2005 |
| 6821447 | Friction member and a method for its surface treatment A method of surface treatment of friction members includes providing a friction member made of PMMC material. A transfer layer is formed on the active surface of the friction member of removing the top layer of the matrix material to expose a surface with the embedd... | 11/23/2004 |
| 6811583 | Polishing composition for a substrate for a magnetic disk and polishing method employing it A polishing composition for a substrate for a magnetic disk, which comprises: (a) a polishing accelerator composed of at least one compound selected from the group consisting of malic acid, glycolic acid, succinic acid, citric acid... | 11/02/2004 |
| 6793838 | Chemical milling process and solution for cast titanium alloys The present invention relates to a chemical milling solution and a chemical milling process for removing a desired depth of material from metal parts. The milling solution contains nitric acid, hydrofluoric acid, a wetting agent, such as a surfactant, dissolved tita... | 09/21/2004 |
| 6776810 | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP The invention provides a chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 o... | 08/17/2004 |
| 6764773 | Heat-dissipating substrate, method for making the same, and semiconductor device including the same A heat-dissipating substrate is made of a composite material comprising a first composition primarily composed of aluminum and a second composition primarily composed of silicon carbide and/or silicon The heat-dissipating substrate has a recess in one of its main fa... | 07/20/2004 |
| 6706207 | Non-chromate metal surface etching solutions Non-chromate solutions for treating and/or etching metals, particularly, aluminum, aluminum alloys, steel and titanium, and method of applying same wherein the solutions include either a titanate or titanium dioxide as a “drop-in replacement” for a chromium-cont... | 03/16/2004 |
| 6666983 | Patterned coated articles and methods for producing the same The present invention is directed to an article with a patterned appearance provided by a visually observable contrast between one or more genereally transparent thin film coatings deposited over a substrate. At least one of the deposited coatings exhibit... | 12/23/2003 |
| 6641630 | CMP compositions containing iodine and an iodine vapor-trapping agent The invention provides a chemical-mechanical polishing system, and a method of polishing using the system, comprising (a) an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b) iodine, (c) an iodine vapor-trapping agent, and (d) a liqu... | 11/04/2003 |
| 6625862 | Method of manufacturing a processing apparatus A wafer processing apparatus (14) has a wafer processing vessel (16). A wafer is mounted on a susceptor (22) included in the wafer processing apparatus. Process gases are supplied to the wafer through a shower head (74) disposed in an upper region within ... | 09/30/2003 |
| 6596150 | Production method for an aluminum support for a lithographic printing plate Disclosed is a production method of an aluminum support for a lithographic printing plate, capable of stable and low-cost production of an aluminum support for a lithographic printing plate, the support being scarcely subject to generation of treatment un... | 07/22/2003 |
| 6589882 | Copper post-etch cleaning process The invention includes a method of cleaning a surface of a copper-containing material by exposing the surface to an acidic mixture comprising NO3-, F- and one or more organic acid anions having carboxylate groups. The inve... | 07/08/2003 |
| 6533951 | Method of manufacturing fluid pump A method of manufacturing a pump [10] for pumping various primary fluids. A body is formed from silicon dies [102,104]. A primary fluid channel [110] is formed in the body and a primary fluid supply [122] is coupled to the primary fluid channel [110] to s... | 03/18/2003 |
| 6527818 | Aqueous dispersion for chemical mechanical polishing There is provided an aqueous dispersion for CMP with an excellent balance between chemical etching and mechanical polishing performance. The aqueous dispersion for CMP of the invention is characterized by comprising an abrasive, water and a heteropolyacid... | 03/04/2003 |
