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Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 7973259 | System for testing and sorting electronic components A sorting system is provided for electronic components such as LED devices which includes a testing station for testing and determining a characteristic of each electronic component. A first tray has a plurality of receptacles for receiving tested electronic compone... | 07/05/2011 |
| 7875821 | Method for sorting integrated circuit devices A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of the IC devices and sorting the IC devices in accordance with their auto... | 01/25/2011 |
| 7851721 | Electronic device sorter comprising dual buffers A device handler for testing and sorting electronic devices has a testing station operative to test the electronic devices and to classify them according to different binning characteristics. A buffer assembly receives electronic devices which have been classified a... | 12/14/2010 |
| 7838790 | Multifunctional handler system for electrical testing of semiconductor devices A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separat... | 11/23/2010 |
| 7700891 | Process for handling semiconductor devices and transport media in automated sorting equipment A method for sorting devices in automated handling equipment, including placing a plurality of input trays containing a plurality of devices and a plurality of empty trays into a handler; sorting the plurality of devices in the plurality of input trays into the plur... | 04/20/2010 |
| 7629550 | System of testing semiconductor devices, a method for testing semiconductor devices, and a method for manufacturing semiconductor devices A system of testing semiconductor devices includes a classification module configured to classify a plurality of lots into a plurality of groups; an apparatus assignment module configured to assign a plurality of testing apparatuses to each of the groups; and a test... | 12/08/2009 |
| 7479614 | Radio frequency identification tag inlay sortation and assembly A method, system, and apparatus for a radio frequency identification (RFID) tag inlay tester and sorter system are described. A tag inlay is received. A characteristic of the tag inlay is tested. The tag inlay is disposed if the tag inlay is determined to fail the t... | 01/20/2009 |
| 7390158 | Handling device for electronic chip components and handling method for electronic chip components A handling device for electronic chip components includes an indexing table having a plurality of cavities for holding electronic chip components therein and a circulatory feeder for supplying the electronic chip components to the indexing table. One or more cavitie... | 06/24/2008 |
| 7368678 | Method for sorting integrated circuit devices A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of the IC devices and sorting the IC devices in accordance with their auto... | 05/06/2008 |
| 7368933 | Method for testing standby current of semiconductor package A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chip... | 05/06/2008 |
| 7365552 | Surface mount package fault detection apparatus A fault detection apparatus for surface mount packages is provided. The apparatus can include a retainer for releasably securing a circuit board such as a printed circuit board having an electrical component mounted thereon via a ball grid array surface mount packag... | 04/29/2008 |
| 7363102 | Method and apparatus for precise marking and placement of an object The present invention provides a precise marking apparatus for performing precise marking on an object and methods of using the same. The precise marking apparatus comprises an object input handler and an object output handler for handling the object; a transport sy... | 04/22/2008 |
| 7362111 | Device for evaluating at least one electrical conducting structure of an electronic component An apparatus and method for evaluating the integrity of each contact pin of an electronic component having multiple contact pins. In one embodiment, the apparatus includes a test device and a measuring instrument. The test device comprises a component fixture config... | 04/22/2008 |
| 7362090 | Automated tray transfer device for prevention of mixing post and pre-test dies, and method of using same A method of sorting automated tray transfer trays includes detecting if a die remains in the tray. The method includes the ability to interrupt the automated tray transfer process to prevent mixing processed and unprocessed dice. An apparatus includes a sensor for d... | 04/22/2008 |
| 7355386 | Method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester A method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester uses a set of laser distance sensors to align the vacuum nozzles with the target. Alignment occurs when certain combinations of distance and dista... | 04/08/2008 |
| 7350108 | Test system for integrated circuits A test board includes a plurality of sockets for connection to a plurality of integrated circuit chips to be tested. A test control device on the board turns on at least one test engine for testing the plurality of chips simultaneously. A checking circuit verifies t... | 03/25/2008 |
| 7348768 | Tray transfer unit and automatic test handler having the same Provided is a tray transfer apparatus having a transfer plate arranged and configured to support a tray containing a number of semiconductor devices in an array of pockets. The tray transfer apparatus further includes a driving means arranged and configured for the ... | 03/25/2008 |
| 7340359 | Augmenting semiconductor's devices quality and reliability A method for augmenting quality or reliability of semiconductor units, including providing few populations of semiconductor units that are subject to quality or reliability testing. The populations include few quality or reliability fail candidate populations and ot... | 03/04/2008 |
| 7316700 | Self optimizing lancing device with adaptation means to temporal variations in cutaneous properties A lancing device, an embodiment of which controls the advancement and retraction of a lancet by monitoring the position of the lancet in conjunction with a lancet controller which incorporates a feedback loop for modulating the lancet driver to follow a predetermine... | 01/08/2008 |
| 7294999 | Apparatus for automatically displaying the grade of liquid crystal display device and operating method thereof An apparatus for automatically displaying a grade of a liquid crystal display device and operating method thereof, includes a grade determining unit of a liquid crystal display panel; a grade inputting unit for inputting the grade of the liquid crystal display panel... | 11/13/2007 |
| 7292023 | Apparatus and method for linked slot-level burn-in A Burn-In Board (BIB) transfer module links a Burn-In Board (BIB) Loader/Unloader (BLU) to a burn-in chamber rack. The BIB transfer module is capable of transferring a BIB between the BLU and the burn-in chamber rack by moving the BIB in at least two perpendicular d... | 11/06/2007 |
| 7279888 | Handling unit for electronic devices A handling unit includes a frame, at least one arrangement module, and at least one chip carrier. The frame has at least one recess for the interchangeable mounting of at least one of the arrangement modules. The arrangement module has at least one receptacle for th... | 10/09/2007 |
| 7276672 | Method for sorting integrated circuit devices A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of the IC devices and sorting the IC devices in accordance with their auto... | 10/02/2007 |
| 7268535 | Hi-pot testing device with transfer table automatically connecting to testing signal generator An exemplary hi-pot testing device (2) includes a testing table (20), a transfer table (21) movably supported on the testing table and configured to support a product (200) to be tested, and a hi-pot testing signal generator (27) u... | 09/11/2007 |
| 7265568 | Semi-conductor component test process and a system for testing semi-conductor components A semi-conductor component test process, and a system for testing semi-conductor components, with which several different semi-conductor-component tests can be conducted in succession. A computer installation, in particular a test apparatus is provided, with which t... | 09/04/2007 |
| 7243776 | Loading and extraction of modular belt carriers of electronic components Replaceable component carriers (40) are adapted to be freely floating in belt apertures (74) and have alignment features (160), such as conical holes (170), mated to features (162), such as tapered pins (184), in processing ... | 07/17/2007 |
| 7239970 | Robotic system for optically inspecting workpieces A manufacturing cell for inspecting workpieces such as magnetic disk substrates comprises an input conveyor for providing workpieces to be tested, one or more testers for inspecting the workpieces, and three or more output receptacles for receiving tested workpieces... | 07/03/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7233162 | Arrangements having IC voltage and thermal resistance designated on a per IC basis Systems for testing a plurality of integrated circuits at a plurality of frequencies and voltages is disclosed. In one embodiment, a plurality of integrated circuits is tested at least once within a predetermined set of combinations of frequencies and voltages. If t... | 06/19/2007 |
| 7230442 | Semi-conductor component testing process and system for testing semi-conductor components The invention involves a semi-conductor component testing process, and a system for testing semi-conductor components, in which a central computer device, in particular a central test apparatus is provided, with which test result data obtained from at least two sepa... | 06/12/2007 |
| 7222737 | Die sorter with reduced mean time to convert An adapter frame has channels that hold multiple die carriers in each channel. The die carriers, such as 2″×2″ or 4″×4″ waffle packs or GEL-PAK die carriers, slide into the channels and are secured by a spring clip retention mechanism. In other embodiments... | 05/29/2007 |
| 7221180 | Device and method for testing electronic components A test device includes first and second testers each having at least one testing contact for making contact with at least one external contact of an electronic component; and a conveying device that conveys electronic components to the first and second testers in a ... | 05/22/2007 |
| 7222124 | Internet automatic electric data system The present invention discloses an Internet automatic electrical data system that comprises a process controller used to process the analyzing order for IC (integrated circuit) packages entrusted by clients. A database is used to store the input parameters of IC pac... | 05/22/2007 |
| 7215200 | High-linearity differential amplifier with flexible common-mode range An amplifier includes differential current sensing circuitry and an input bridge. Two paths of the input bridge receive the input signals and provide proportional current flows to the differential current sensing circuitry. The input bridge is configured to provide ... | 05/08/2007 |
| 7208938 | Test tray for handler A test tray includes a rectangular shaped frame and a plurality of transport modules to receive a plurality of semiconductor devices. A precise location-determining unit mounted on both sides of the frame to precisely determines and fixes the test tray location. Acc... | 04/24/2007 |
| 7202693 | Combined pick, place, and press apparatus An apparatus, a system, and a method for semiconductor processing automation, specifically for handling, are disclosed herein. In various embodiments, an apparatus for handling comprises a pick-and-place subassembly and a press subassembly. ... | 04/10/2007 |
| 7202684 | Thermal stratification test apparatus and method providing cyclical and steady-state stratified environments A method and apparatus for a thermal stratification test providing cyclical and steady-state stratified environments. In order to test an electronic device, for example one having one or more levels of ball-grid-array interconnections, e.g., connecting a chip to a f... | 04/10/2007 |
| 7199574 | Semiconductor test apparatus A semiconductor test apparatus comprising a test apparatus main body for generating a test pattern provided to a semiconductor device, a test head which contacts the semiconductor device and provides the test pattern generated by the test apparatus main body for the... | 04/03/2007 |
| 7195931 | Split manufacturing method for advanced semiconductor circuits A front-end-of-line piece of a semiconductor die is manufactured in a first manufacturing line. A back-end-of-line piece of a semiconductor die is manufactured using a second manufacturing line, which will typically be different than the first manufacturing line. Th... | 03/27/2007 |
| 7189938 | Process and system to package residual quantities of wafer level packages Various preferred processes and equipment are described herein that more efficiently handle residual semiconductor parts during packaging. The processes include picking and removing all of the bad parts from a wafer before picking the good parts and picking all of t... | 03/13/2007 |
