Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 8123926 | Electrolytic copper process using anion permeable barrier Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a... | 02/28/2012 |
| 7846316 | Method for supplying a plating composition with deposition metal ion during a plating operation Method and plating bath apparatus for setting the ionic strength of a plating composition using Donnan dialysis by flowing the plating composition along a first surface of a membrane while simultaneously flowing a deposition metal ion exchange composition along a se... | 12/07/2010 |
| 7431815 | Method to reduce ferric ions in ferrous based plating baths A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode... | 10/07/2008 |
| 7393473 | Method for producing a composite plated product There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a large content of carbon and a large quantity of carbon particles on t... | 07/01/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| 7350905 | Internal pressure-stabilizing apparatus, ink tank and ink-jet printer including the same An ink tank includes an ink chamber and a pressure-adjusting tube communicated therewith. Low liquid-repellent areas and high liquid-repellent films having liquid repellence higher than that of the low liquid-repellent areas are formed alternately in the extending d... | 04/01/2008 |
| 7256132 | Substrate centering apparatus and method A semiconductor substrate centering mechanism includes a plurality of substrate support pins, each pin having a top surface. The top surfaces of the pins define a plane in which the substrate is supported. Each pin has a tab mounted eccentrically at the top surface ... | 08/14/2007 |
| 7179359 | Cup-shaped plating apparatus Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a pl... | 02/20/2007 |
| 7176993 | Reflection type display device using a light shading film with a light shading material evenly dispersed throughout Among insulating layers for insulating and separating first wiring lines, second wiring lines, and pixel electrodes constituting a reflection type display device, at least one layer is made of an insulating film in which a carbon-based material or a pigment is dispe... | 02/13/2007 |
| 7172979 | Substrate processing apparatus and method A substrate processing apparatus has a substrate holder for detachably holding a substrate so that a surface, to be processed, of the substrate faces downward, and a sealing ring for sealing a peripheral portion of the surface, to be processed, of the substrate held... | 02/06/2007 |
| 7163612 | Method, apparatus and article for microfluidic control via electrowetting, for chemical, biochemical and biological assays and the like An active matrix microfluidic platform employs thin film transistor active (“TFT”) matrix liquid crystal display technology to manipulate small samples of fluid for chemical, biochemical, or biological assays without moving parts, for example, using a two-dimens... | 01/16/2007 |
| 7156972 | Method for controlling the ferric ion content of a plating bath containing iron A system and method for reducing ferric ion content in a plating solution by exposing hydrogen to an electrode in a plating solution for reducing a ferric ion content in the plating solution. ... | 01/02/2007 |
| 7144489 | Photochemical reduction of Fe(III) for electroless or electrodeposition of iron alloys A method of photochemically reducing iron(III) species in an iron or iron alloy plating solution by adding an additive to the electroplating solution; contacting the additive with iron(III) species to form an iron(III)-additive species; and irradiating the electropl... | 12/05/2006 |
| 7122105 | Use of siderophores to increase the current efficiency of iron plating solutions A method of electroplating iron or an iron alloy with a solution containing an iron-chelating agent to catalytically cycle the undesirable Fe(III) species back to Fe(II) for electroplating. The iron-chelating agents may be siderophores, specifically, for example, de... | 10/17/2006 |
| 7118664 | Plating method and apparatus The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a hig... | 10/10/2006 |
| 7045040 | Process and system for eliminating gas bubbles during electrochemical processing A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is provided. The present invention employs the process solution to prevent or ... | 05/16/2006 |
| 6995432 | Semiconductor device having a gate oxide film with some NTFTS with LDD regions and no PTFTS with LDD regions A MIS type semiconductor device and a method for fabricating the same characterized in that impurity regions are selectively formed on a semiconductor substrate or semiconductor thin film and are activated by radiating laser beams or a strong light equivalent theret... | 02/07/2006 |
| 6977035 | Method for electrolytic copper plating A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen at... | 12/20/2005 |
| 6974530 | Method and system for controlling ion distribution during plating of a metal on a workpiece surface The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. I... | 12/13/2005 |
| 6962642 | Treating copper surfaces for electronic applications A process by which high frequency printed wiring board construction can be fabricated using smooth copper surfaces. A conductive, thin film polymer is plated on smooth copper surfaces of a core lamination. The polymer can be selected from a group of materials consis... | 11/08/2005 |
| 6963084 | Semiconductor device having a storage capacitor In a semiconductor device having a substrate which has a metal surface, an insulating film which is formed on the substrate having the metal surface, and a pixel unit which is formed on the insulating film; the pixel unit includes a TFT, and wiring lines connected w... | 11/08/2005 |
| 6942779 | Method and system for regenerating of plating baths The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy i... | 09/13/2005 |
| 6913681 | Plating method and plating apparatus A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plati... | 07/05/2005 |
| 6899802 | Method for recycling of plating solutions In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and th... | 05/31/2005 |
| 6896783 | Method for producing material libraries by means of electrochemical deposition The invention relates to a method for combinatorially producing a library of materials by means of an electrochemical deposition in an array. The inventive library is made from an array of containers that consist of an electroconductive material, are open to the top... | 05/24/2005 |
| 6893548 | Method of conditioning electrochemical baths in plating technology An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a first electrochemical bath h... | 05/17/2005 |
| 6890414 | Purification system and method A system for use with a plating cell configured to plate objects in a plating process. At least one byproduct is created in a plating substance used in the plating cell. The system includes a purification system configured to remove at least a portion of the at leas... | 05/10/2005 |
| 6884332 | Method and apparatus for treating an aqueous electroplating bath solution A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient ... | 04/26/2005 |
| 6835294 | Electrolytic copper plating method Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The m... | 12/28/2004 |
| 6797141 | Removal of coagulates from a non-glare electroplating bath The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production interruptions for regeneration. Especially, it is envisaged to conduct t... | 09/28/2004 |
| 6746589 | Plating method and plating apparatus The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with use of a plating liquid having high throwing power and leveling properties, and which can make film thickness of a ... | 06/08/2004 |
| 6716332 | Plating method and apparatus The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a hig... | 04/06/2004 |
| 6685815 | Electroplating of semiconductor wafers An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One ... | 02/03/2004 |
| 6616828 | Recovery method for platinum plating bath A recovery system for platinum electrolytic baths operating at low current densities is disclosed. An oxidizing system is provided in a closed-loop recirculation system for platinum plating at low current densities. The oxidizing system reoxidizes Pt... | 09/09/2003 |
| 6610189 | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature A method and associated apparatus of electroplating an object and filling small features. The method comprises immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solutio... | 08/26/2003 |
| 6607649 | Process of preventing stray currents in peripheral parts of a plant in an electrolysis An electrolyte line extends from the outlet of an electrolysis device to a collecting tank and from the same back to the inlet of the electrolysis device. The electrolyte is passed from the outlet of the electrolysis device to a first container which is d... | 08/19/2003 |
| 6585875 | Process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) i... | 07/01/2003 |
| 6551486 | Process for galvanic depositing of a dispersion layer on a work piece surface A process for galvanic depositing of a dispersion layer on a surface of a work piece, in particular a contact layer on a plain bearing half liner, is described, where an electrolyte with the dispersed phase finely distributed therein is moved opposite the... | 04/22/2003 |
| 6391179 | Plating apparatus and method of preventing substitute deposition The present invention provides a plating apparatus comprising: a plating bath filled with a plating solution; at least an anode in the plating solution; at least a plating object which serves as a cathode in the plating solution, so that the at least plat... | 05/21/2002 |
| 6379521 | Method of producing zinc oxide film, method of producing photovoltaic element, and method of producing semiconductor element substrate The present invention provides a method of producing a zinc oxide film, which comprises applying current between a conductive base member immersed in an electrodepositing bath and a counter electrode immersed in the electrodepositing bath to form a zinc o... | 04/30/2002 |
