Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7967969 | Method of electroplating using a high resistance ionic current source A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. This is accomplished by employing a “high resistance ionic current source,” which solves the terminal problem by placing a highly resistive membrane (e.g., a... | 06/28/2011 |
| 7943032 | Anode used for electroplating The present invention relates to an anode for electroplating, which has an anode base and a shield and is characterized in that additive degradation is reduced when it is used in electroplating. ... | 05/17/2011 |
| 7438795 | Electrochemical-mechanical polishing system Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided h... | 10/21/2008 |
| 7332062 | Electroplating tool for semiconductor manufacture having electric field control An electroplating tool for providing a metal or metal film on a semiconductor wafer during processing thereof has a wafer chucking mechanism with a conductor or conductors associated therewith. The conductor(s) are electrically connected to a controller that applies... | 02/19/2008 |
| 7300575 | Portable filter system A filter system for receiving an aqueous-based fluid contaminated with particles and emulsified contaminant oil, removing the particles, and separating the emulsified contaminant oil from the aqueous-based fluid includes a filter media for receiving the aqueous-base... | 11/27/2007 |
| 7273535 | Insoluble anode with an auxiliary electrode A method and apparatus for plating a metal onto a substrate. The apparatus includes a fluid basin configured to contain a plating solution, an anode fluid volume positioned in a lower portion of the fluid basin, a cathode fluid volume positioned in an upper portion ... | 09/25/2007 |
| 7247557 | Method and composition to minimize dishing Processes are disclosed for producing electronic interconnect devices, particularly semi-conductor wafers, with metal interconnect traces thereon wherein the surface of said device has improved planarity. Said planarity is achieved initially through the use of pulse... | 07/24/2007 |
| 7163613 | Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plat... | 01/16/2007 |
| 7160421 | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 01/09/2007 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
| 7025861 | Contact plating apparatus Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid b... | 04/11/2006 |
| 6925811 | High temperature combustor wall for temperature reduction by optical reflection and process for manufacturing A high temperature gas turbine component for use in the gas flow path that also is a specular optical reflector. A thin layer of a high temperature reflector is applied to the flow path surface of the component, that is, the surface of the component that forms a bou... | 08/09/2005 |
| 6919010 | Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. The current of a plating cell is provided from an azimuthally asymmetric anode, which is rotated with respect to the work piece (i.e., either or both of the work... | 07/19/2005 |
| 6916412 | Adaptable electrochemical processing chamber An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of wal... | 07/12/2005 |
| 6916413 | Electro-plating apparatus and method Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the a... | 07/12/2005 |
| 6890413 | Method and apparatus for controlling local current to achieve uniform plating thickness A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathod... | 05/10/2005 |
| 6852207 | Method for producing prosthetic moulded parts for dental use In a method for manufacture of prosthetic moulded parts for the dental sector with the aid of galvanic metal deposition, deposition at least partly takes place by pulse current. Deposition is preferably ended in a period of less than 5 hours, particularly within 1 t... | 02/08/2005 |
| 6790332 | Method for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses A method for galvanically depositing nickel, cobalt, nickel alloys or cobalt alloys in a galvanic bath includes using electrolytes containing nickel compounds or cobalt compounds. At least one anode and at least one cathode of the bath are subject to periodic curren... | 09/14/2004 |
| 6660137 | System for electrochemically processing a workpiece A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact ... | 12/09/2003 |
| 6565729 | Method for electrochemically depositing metal on a semiconductor workpiece A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance ... | 05/20/2003 |
| 6542784 | Plating analysis method A plating analysis method is disclosed for electroplating in a system in which resistance of an anode and/or a cathode cannot be neglected. This method comprises giving a three-dimensional Laplace's equation, as a dominant equation, to a region containing... | 04/01/2003 |
| 6500325 | Method of plating semiconductor wafer and plated semiconductor wafer A method of plating which improves the uniformity of a plated coating thickness without changing the flow velocity of a feed plating solution. An aperture at a center of a mesh anode electrode of a plating apparatus produces an electric field density dist... | 12/31/2002 |
| 6495018 | Electro-plating apparatus and method A single delivery channel is formed by, and between, inner wall 2 and baffle 3. Electrolyte 5 is pumped up the interior of channel 1 and is directed onto substrate 4 being a cathode maintained at -10 volts. The upper part of the inner wall 2 of channel 1 ... | 12/17/2002 |
| 6428672 | Apparatus and method for manufacturing Ni--Fe alloy thin foil Disclosed is a technique for manufacturing a Ni--Fe alloy thin foil using a single-step electrodeposition-based plating process without requiring processes such as melting, casting, forging, and rolling. A manufacturing apparatus is provided which include... | 08/06/2002 |
| 6413403 | Method and apparatus employing pad designs and structures with improved fluid distribution An apparatus capable of assisting in controlling an electrolyte flow and distribution of an electric field, a magnetic field, or an electromagnetic field in order to process a substrate is provided with improved fluid distribution. A support member having... | 07/02/2002 |
| 6344124 | Method and apparatus for electroplating alloy films A compositionally modulated material electroplated film is deposited by using at least two source metal anodes in an electroplating apparatus, and changing at least one contact area between an anode an electrolyte. In order to obtain sharp boundaries betw... | 02/05/2002 |
| 6344123 | Method and apparatus for electroplating alloy films A compositionally modulated material electroplated film is deposited by using at least two source metal anodes in an electroplating apparatus, and changing at least one power setting of an electroplating power supply. In order to obtain sharp boundaries b... | 02/05/2002 |
| 6296753 | Apparatus and method for plating wafers, substrates and other articles A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to th... | 10/02/2001 |
| 6291080 | Thin copper foil, and process and apparatus for the manufacture thereof Copper foil produced on a rotating drum cathode machine, wherein each of the outer edge portions of a web of the foil has a thickness greater than the thickness of the central portion of the web. In the process and apparatus used to electrodeposit the foi... | 09/18/2001 |
| 6287443 | Apparatus and method for electroplating wafers, substrates and other articles A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to th... | 09/11/2001 |
| 6277260 | Apparatus and method for plating wafers, substrates and other articles A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to th... | 08/21/2001 |
| 6274024 | Apparatus and method for plating wafers, substrates and other articles A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to th... | 08/14/2001 |
| 6274023 | Apparatus and method for electroplating wafers, substrates and other articles A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformnity of the plating deposition across the surface of the wafer, and minimizing damage to t... | 08/14/2001 |
| 6254756 | Preparation of components having a partial platinum coating thereon A curved component such as a turbine airfoil, shroud, or combustor centerbody is prepared with a platinum or a platinum-aluminide protective coating over only a portion of the surface thereof. The coating may serve as an environmental coating, or as a bon... | 07/03/2001 |
| 6251251 | Anode design for semiconductor deposition An anode assembly including a perforated anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in th... | 06/26/2001 |
| 6224736 | Apparatus and method for forming thin film of zinc oxide The present invention provides an apparatus or a method for forming a thin zinc oxide film on a conductive base member by immersing the conductive base member and a counter electrode in an aqueous solution and supplying a current between the conductive ba... | 05/01/2001 |
| 6210554 | Method of plating semiconductor wafer and plated semiconductor wafer A method of plating which improves the uniformity of a plated coating thickness without changing the flow velocity of a feed plating solution. An aperture at a center of a mesh anode electrode of a plating apparatus produces an electric field density dist... | 04/03/2001 |
| 6203685 | Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head A transport system for the implementation of electrolytic deposition, coating or etching; and more particularly, an apparatus for selective electrolytic metallization and deposition utilizing a fluid head arrangement. A method is provided for making and m... | 03/20/2001 |
| 6099709 | Method of producing an electrode foil for use in aluminum electrolytic capacitors This invention provides an apparatus for producing an electrode foil for use in aluminum electrolytic capacitors with which a high capacitance is obtained while the distortion of the foil and the leakage current can be controlled. At least two electrode p... | 08/08/2000 |
