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| Number | Title | Issue Date |
| 7922887 | Metal structure and method of its production The present invention provides a method for producing a metal structure comprising a substrate and a metal film formed on the substrate; comprising the steps of providing surface having irregularities made of a electrical conductor in the area of the substrate where... | 04/12/2011 |
| 7309411 | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic ac... | 12/18/2007 |
| 7294244 | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing... | 11/13/2007 |
| 7229699 | Bearing having embedded hard particle layer and overlay and method of manufacture A multilayer sliding bearing includes a rigid metal backing having a metal bearing liner attached thereto. The metal bearing liner includes a metal bearing liner layer which is attached to the bearing surface of the metal backing layer and at least one metal overpla... | 06/12/2007 |
| 7223328 | Sensors for reducing gas molecules Provided is a gas molecule sensor, characterized in that the sensing element is a polycrystalline tin oxide film having a thickness less than 1 μm. The sensing element is produced by electrolytic deposit of a tin film on an insulating support in an electromechanica... | 05/29/2007 |
| 7189318 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 03/13/2007 |
| 7163613 | Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plat... | 01/16/2007 |
| 7128823 | Anolyte for copper plating Embodiments of the invention provide a method for plating copper into features formed on a semiconductor substrate. The method includes positioning the substrate in a plating cell, wherein the plating cell includes a catholyte volume containing a catholyte solution,... | 10/31/2006 |
| 7078999 | Inductor and method for producing the same A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a c... | 07/18/2006 |
| 7018720 | Layer sequence built on a substrate in thin-film technology The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a me... | 03/28/2006 |
| 6949296 | Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto The substrates of the present invention comprise a polyimide base polymer derived at least in part from non-rigid rod monomers together with optionally rigid rod monomers where the substrates are cured under low tension. The resulting polyimide materials have been f... | 09/27/2005 |
| 6914510 | Inductor and method for producing the same A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a c... | 07/05/2005 |
| 6911887 | Inductor and method for producing the same A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a c... | 06/28/2005 |
| 6911888 | Inductor and method for producing the same A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a c... | 06/28/2005 |
| 6909350 | Inductor and method for producing the same A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a c... | 06/21/2005 |
| 6875330 | Process for coating workpieces with bearing metal A process is provided for coating metallic workpieces with a bearing material, wherein the workpiece first receives a hard chromium plating having a pearl or columnar structure type surface. A predominantly silver layer is then galvanically deposited, which fills in... | 04/05/2005 |
| 6875519 | Two-layer copper polyimide substrate A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 Å, and preferably not less than 50 Å, as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous s... | 04/05/2005 |
| 6495018 | Electro-plating apparatus and method A single delivery channel is formed by, and between, inner wall 2 and baffle 3. Electrolyte 5 is pumped up the interior of channel 1 and is directed onto substrate 4 being a cathode maintained at -10 volts. The upper part of the inner wall 2 of channel 1 ... | 12/17/2002 |
| 6110346 | Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer In electroplating a metal layer on a semiconductor wafer, the resistive voltage drop between the edge of the wafer, where the electrical terminal is located, and center of the wafer causes the plating rate to be greater at the edge than at the center. As ... | 08/29/2000 |
| 6107186 | High planarity high-density in-laid metallization patterns by damascene-CMP processing Erosion of high density metallization areas associated with conventional damascene-CMP processing is avoided and greater planarity achieved by selectively increasing the metal overburden layer thickness at high density metallization regions. Embodiments i... | 08/22/2000 |
| 5958604 | Electrolytic process for cleaning and coating electrically conducting surfaces and product thereof An electrolytic process for metal-coating the pre-cleaned surface of a workpiece of an electrically conducting material, which process comprises: i) providing an electrolytic cell with a cathode comprising the workpiece and an anode comprising the metal for me... | 09/28/1999 |
| 5939172 | Metallic screen material having a strand or fibre structure, and method for manufacturing such a material A screen material is described which is formed by cladding, using electroplating, a structure composed of strands or fibers. The structure may incorporate a knit, woven or nonwoven material or, alternatively, of strands or fibres welded together, wound st... | 08/17/1999 |
| 5670265 | Steel component with an electroplated anti-corrosive coating and process for producing same A steel component is provided on its surface with an electroplated anti-corrosive coating of a metallic material and has a hardness of at least 650 HV, the anti-corrosive coating being thinner than the surface roughness which the hardened component had be... | 09/23/1997 |
| 5667851 | Process for preparing a metallized polymide film containing a hydrocarbyl tin compound A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion throug... | 09/16/1997 |
| 5643432 | Selective anodization of capacitor anode body A method for forming solid electrolytic capacitors provides for anode lead and body surface with increased dielectric thickness as distinguished from a dielectric thickness formed within the inner anode body such that a capacitance value associated therew... | 07/01/1997 |
| 5585195 | Metal insert and rough-surface treatment method thereof A metal insert at least partially embedded in a molded resin mass comprises a metal insert blank, and a substantial amount of nickel or nickel alloy granulations produced over a surface of the metal insert blank, and the size of the granulations is at mos... | 12/17/1996 |
| 5398791 | Method for crown plating a camplate and a metal-plated camplate formed thereby A method is provided for improving the load distribution on a ramp-surface of a clutch mechanism, such as the camplate of an overrunning clutch for the turbocharger of a locomotive diesel engine. In addition, an improved camplate produced by such a method... | 03/21/1995 |
| 5254631 | Cationically electrodepositable finely divided gelled polymers having a core-sheath structure obtained by emulsion polymerization A cationically electrodepositable finely divided gelled polymer obtained by emulsion-polymerizing, in the presence of a water-soluble or water-dispersible cationic resin, a monomer component (A) comprising (a) a polymerizable unsaturated vinylsilane monomer ha... | 10/19/1993 |
| 5242569 | Thermocompression bonding in integrated circuit packaging A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough ... | 09/07/1993 |
| 5080763 | Method of forming conductor lines of a semiconductor device A method of forming conductor lines of a semiconductor device comprises a step of depositing (electroplating) a gold (Au) layer on an underlying barrier conductive layer in a gold plating bath. According to the present invention, the plating bath is suppl... | 01/14/1992 |
| 4999094 | Method for manufacturing a color member A method for manufacturing a color member, e.g., a color filter for a display device. A conductive thin film layer having given plural patterns is formed on an electrically insulative substrate. On the conductive thin film layer, a colored layer is formed... | 03/12/1991 |
| 4827287 | Continuous ink jet printer having improved stimulation waveguide construction An orifice plate assembly for use in continuous ink jet printers includes a linear orifice plate having formed therein at least one linear array of orifices extending from a first end region to a second end region. The orifice plate has a main body portio... | 05/02/1989 |
| 4675786 | Flexible circuit board and method of making the same A flexible circuit board and method of making the same is presented wherein the circuit board includes conductive through-holes for installation of components and includes a sloping electrolytic plating portion between the through-hole portions and remain... | 06/23/1987 |
| 4657833 | Photosensitive cathode for deposition of metal structures within organic polymeric films A photosensitive cathode is used to vary in three dimensions, the position, shape and density of a metallic interlayer formed in a preformed polymer film using an electrochemical deposition process.... | 04/14/1987 |
| 4551184 | Process for obtaining a composite material and composite material obtained by said process A process for producing a composite material comprising a base having a nickel surface and a gold layer metallurgically bonded to the nickel of the base and having sufficient nickel to increase the hardness of the gold layer but insufficient to significan... | 11/05/1985 |
| 4545864 | Selective plating A method of selective plating a component, which method comprises contacting a lower face of the component with a contoured lower mask having a plating aperture so as to expose an area of the component to be plated, positioning the component over a platin... | 10/08/1985 |
| 4514266 | Method and apparatus for electroplating A method and apparatus for quality high speed electrical plating of one or both sides of a metallic workpiece 12 wherein a combined consumable-non-consumable anode system so provides a uniformity of metallic deposition at relatively high speeds irrespecti... | 04/30/1985 |
| 4464232 | Production of one-side electroplated steel sheet A process for producing one-side electroplated steel sheet with the non-electroplating side having a high affinity for chemical conversion treatment is disclosed. The process comprises preparing a one-side electroplated steel sheet by applying a cathodic ... | 08/07/1984 |
| 4436591 | Process of electroforming screen material A screen skeleton as a cathode is subjected to a pulsed current for depositing metal from an electrolytic bath onto the metal regions of the screen skeleton, said electrolytic bath containing a brightener of the second class. This process involves growth ... | 03/13/1984 |
| 4329402 | Micro-throwing alloy undercoatings and method for improving corrosion resistance Novel micro-throwing alloy undercoatings, multi-layer coatings containing a novel micro-throwing alloy undercoating and method of improving the corrosion resistance of ferrous metal articles are provided in accordance with the invention. The novel micro-t... | 05/11/1982 |
