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| Number | Title | Issue Date |
| 6972082 | Method for the selectively electroplating a strip-shaped, metal support material A method for the continuous selective electroplating of a metallic substrate material (10) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrat... | 12/06/2005 |
| 6936349 | Method of coloring magnesium material, and housing made of colored magnesium material A housing made of a magnesium material is colored by a non-painting process. In this process, an anode oxide film is grown on the surface of the housing by subjecting the housing to anodization. The anode oxide film is colored without a paint being applied to the su... | 08/30/2005 |
| 6790336 | Method of fabricating damascene structures in mechanically weak interlayer dielectrics A copper damascene process for a mechanically weak low k dielectric layer is described. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer assures complete planarization of the copper. ... | 09/14/2004 |
| 6773570 | Integrated plating and planarization process and apparatus therefor A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical ... | 08/10/2004 |
| 6755957 | Method of plating for filling via holes A method of plating for filling via holes, in which each via hole is formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate. A copper film is formed on the top surface of the insulation l... | 06/29/2004 |
| 6638411 | Method and apparatus for plating substrate with copper The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate... | 10/28/2003 |
| 6471848 | Electrodeposition method of forming an oxide film This invention provides an electrodeposition apparatus, comprising at least one electrodeposition vessel for supplying a current between a substrate and an electrode in an electrodeposition bath to form an oxide film or the substrate and a rinsing means f... | 10/29/2002 |
| 6440288 | Method for preparing anode electrode for high voltage electrolytic capacitor Disclosed is a method for forming an aluminum oxide film of a large surface area on an electrode for a high voltage electrolytic capacitor. In accordance with the method, an oxide film of a uniform thickness is formed, prior to a process of etching the ox... | 08/27/2002 |
| 6231993 | Anodized tantalum pellet for an electrolytic capacitor An anodized pressed valve metal powder pellet is described. The anodized pellet is particularly useful as an anode in an electrolytic capacitor having an improved breakdown voltage. The anodized pellet is formed by periodically holding the pellet at a con... | 05/15/2001 |
| 6090260 | Electroplating method A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional curr... | 07/18/2000 |
| 6036835 | Method of microetching a conductive polymer on multilayer circuit boards A microetch composition for a circuit board containing sulfuric acid in combination with a carboxylic acid having 2 to 6 carbon atoms, wherein the volume of the carboxylic acid is preferably greater than the amount of sulfuric acid. The method discloses t... | 03/14/2000 |
| 5897761 | Electrodeposited copper foil for printed wiring board and method for manufacturing the same An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 μm or ... | 04/27/1999 |
| 5858557 | Nickel/gold plating of a copper-refractory metal material A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concen... | 01/12/1999 |
| 5858198 | Electroplating process A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for th... | 01/12/1999 |
| 5827573 | Method for coating metal cookware A method for coating metal cookware includes the steps of (1) cleaning a cooking surface of the metal cookware; (2) roughening the cooking surface by blasting aluminum oxide particles against the cleaned cooking surface; (3) forming a scratch-resistant la... | 10/27/1998 |
| 5780173 | Durable platinum/polyimide sensing structures The durability and reliability of a polymer layer/metal layer sensor structure is improved by the incorporation of a metal oxide, e.g., tantalum oxide (Ta2 O5), layer between the polymer, e.g., polyimide, and the metal, e.g., platinu... | 07/14/1998 |
| 5738776 | Electroplating process A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for th... | 04/14/1998 |
| 5706999 | Preparation of a coated metal-matrix composite material A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat treated at a temperature of about 450° C. to interdiffuse th... | 01/13/1998 |
| 5683567 | Electrolytic electrode and method of production thereof The present invention relates to an electrolytic electrode comprising a core material made of a valve metal, a dense electrically conductive tin oxide layer formed on the core material, an -lead dioxide layer formed on the tin oxide layer, and a &#... | 11/04/1997 |
| 5549808 | Method for forming capped copper electrical interconnects The present invention relates generally to a new structure and method for capped copper electrical interconnects. More particularly, the invention encompasses a novel structure in which one or more of the copper electrical interconnects within a semicondu... | 08/27/1996 |
| 5525205 | Process for forming circuit with laser A process for forming an electrical circuit component includes forming an initial metal layer on a surface of a synthetic plastics substrate, and irradiating the initial metal layer with laser light along a closed path so as to remove the initial metal la... | 06/11/1996 |
| 5486283 | Method for anodizing aluminum and product produced An improved method of anodizing aluminum which produces an oxide surface receptive to the formation of strong and durable bonds with epoxy adhesives and coatings with underlying bulk properties providing dissimilar metal separation and basic corrosion pro... | 01/23/1996 |
| 5480536 | Corrosion-inhibited iron-based members and method of producing the same A corrodible iron-based work such as a cylinder rod is subjected to hard chrome plating, heat-treatment by high frequency heating or baking at a temperature of not less than 150° C. (e.g. 170° to 600° C.), resin impregnation treatment and finish buffin... | 01/02/1996 |
| 5478462 | Process for forming polyimide-metal laminates Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form t... | 12/26/1995 |
| 5472788 | Colored anodized aluminum and electrolytic method for the manufacture of same A broad range of colors within the visible spectrum can be obtained by light interference and multiple refraction in an anodized aluminum product, by electrolytically depositing on an aluminum-based substrate an aluminum oxide anodic film separated from t... | 12/05/1995 |
| 5441626 | Partially plated resin products and partial plating process therefor Annular grooves having substantially V-shaped cross sections are formed on the front surface and the rear surface of a grille body. A through hole communicating to the front surface and the rear surface of the grille body is also formed so that the front ... | 08/15/1995 |
| 5427676 | Method of making a cast-to-size mold for molding finished plastic parts Method of making a cast-to-size mold for molding class A finishes on molded plastic articles including the steps of filling any pores in the molding surface with a conductive thermosetting resin and thereafter electroplating the surface.... | 06/27/1995 |
| 5421969 | Surface-treated steel sheet having improved weldability and plating properties, and method for producing the same A zinc or zinc-alloy plated steel sheet having an improved weldability and plating properties, as well as a method for making the same is provided. Even when the substrate steel sheet is the one which is difficult to deposit a zinc or zinc-alloy layer by ... | 06/06/1995 |
| 5407557 | Wiring boards and manufacturing methods thereof A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least... | 04/18/1995 |
| 5382347 | Protective coatings for metal parts to be used at high temperatures A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before or simultaneousl... | 01/17/1995 |
| 5372701 | Process and apparatus for electroplating The invention relates to an improved process and apparatus for electroplating an object and removing the excess electroplating solution from the electroplating object. The improvement comprises performing the electroplating process utilizing an apparatus ... | 12/13/1994 |
| 5342501 | Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating Novel aqueous accelerating solutions and methods for their use in connection with metal plating of dielectric materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilute concentrations of copper ions... | 08/30/1994 |
| 5246565 | High adherence copper plating process A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.... | 09/21/1993 |
| 5183553 | Method of forming a high temperature resistant copper coating on an inorganic dielectric The method of forming a high temperature resistant copper coating on a ceramic and/or enamel substrate, includes the steps of chemically depositing a copper layer having a thickness of at least 3 μm on the substrate, heating the copper layer formed there... | 02/02/1993 |
| 5158663 | Protective coatings for metal parts to be used at high temperatures A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before the last anodic ... | 10/27/1992 |
| 5154816 | Process for depositing an anti-wear coating on titanium based substrates A process for depositing an anti-wear coating on a titanium-based substrate comprises: a) roughening the substrate by sanding; b) deposition of a keying nickel sub-layer on the substrate by cathodic spraying (cathode sputtering); c) intermediate cleaning; d) a... | 10/13/1992 |
| 5120423 | Method for the formation of an electrolyte layer of solid electrolytic capacitors A method for the formation of an electrolyte layer of solid electrolytic capacitors is provided. The method comprises: (1) forming an oxide film with dielectric properties on the surface of a porous electrode made of a valve metal, the electrode being ele... | 06/09/1992 |
| 5112448 | Self-aligned process for fabrication of interconnect structures in semiconductor applications A method for fabricating conductors in dielectric trenches in a self-aligned manner. Interconnect modules with a high conductor density are achieved by using a copper-polyimide system as a versatile packaging approach. A photosensitive polyimide is applie... | 05/12/1992 |
| 5108554 | Continuous method for preparing steel parts for resin coating A method for applying a sequence of protective coatings to steel parts includes the steps of depositing a zinc coating, a chromate coating and a synthetic resin coating. The parts to be coated are supported on a hanger and carried thoughout the entire coa... | 04/28/1992 |
| 5104507 | Anodic-cathodic coating for fasteners An electrodeposition method wherein a conductive substrate such as, for example, a metal fastener is first coated by means of an anodic electrodeposition process, then subjected to thermal curing, and then subjected to a cathodic electrodeposition process... | 04/14/1992 |
