Bizarre Patents
Mouse device with a built-in printer
A mouse device for use as an input device of a computer is provided that includes a housing in which recording paper is loadable, and a printer unit provided within the housing for printing on the recording paper print information received from the computer.
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| Number | Title | Issue Date |
| 8114262 | Thickness distribution control for electroplating The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resista... | 02/14/2012 |
| 7914657 | Controlling the thickness of wafers during the electroplating process Embodiments of the present invention pertain to controlling thickness of wafers during electroplating process. Information pertaining to an old current used during an electroplating process of a previous wafer is received. Information pertaining to the thickness of ... | 03/29/2011 |
| 7850836 | Method of electro-depositing a conductive material in at least one through-hole via of a semiconductor substrate An initial pulse current cycle is supplied to at least one through-hole via. The pulse current cycle includes a forward pulse current. The magnitude of the forward pulse current is lower than the magnitude of the reverse pulse current. A corresponding forward and re... | 12/14/2010 |
| 7366582 | Method for defining status index in copper electrolysis The invention is a method for controlling an electrolytic process and plant, utilizing history data collected in the process as well as mathematical and heuristic models created on the basis of empirical knowledge, and by means of said models, there are defined inde... | 04/29/2008 |
| 7357850 | Electroplating apparatus with segmented anode array An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are ... | 04/15/2008 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7244347 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 07/17/2007 |
| 7223328 | Sensors for reducing gas molecules Provided is a gas molecule sensor, characterized in that the sensing element is a polycrystalline tin oxide film having a thickness less than 1 μm. The sensing element is produced by electrolytic deposit of a tin film on an insulating support in an electromechanica... | 05/29/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7211186 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7189318 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 03/13/2007 |
| 7166203 | Controlled concentration electrolysis system A system for maintaining a concentration range of an electroreducible metal species undergoing electrolysis within a predetermined concentration range comprises a first container containing a body of an electrolyte solution in which a metal is partially dissolved, a... | 01/23/2007 |
| 7161689 | Apparatus and method for processing a microelectronic workpiece using metrology A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a process sequence of the processing apparatus based on a feed forward or a ... | 01/09/2007 |
| 7128803 | Integration of sensor based metrology into semiconductor processing tools A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded i... | 10/31/2006 |
| 7043325 | Method and apparatus for determining product-specific error and tool drift The present invention provides a method and apparatus for determining product-specific model errors. The method includes determining a plurality of product model errors associated with a corresponding one of a plurality of products. The method also includes determin... | 05/09/2006 |
| 7041510 | System and method for programmable illumination pattern generation A method and apparatus for the manipulation of colloidal particulates and biomolecules at the interface between an insulating electrode such as silicon oxide and an electrolyte solution. Light-controlled electrokinetic assembly of particles near surfaces relies on t... | 05/09/2006 |
| 7020537 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a numerical of the processing chamber o... | 03/28/2006 |
| 7005046 | Apparatus for electro chemical deposition A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The d... | 02/28/2006 |
| 7005306 | Accurate thickness measurement of thin conductive film The thickness of a thin conductive film is accurately measured without direct knowledge of the temperature of the sample. A coulometer measurement during deposition of the conductive film on a substrate, along with other data such as the plated surface area, the ele... | 02/28/2006 |
| 6998337 | Thermal annealing for Cu seed layer enhancement Semiconductor devices with highly reliable Cu interconnects exhibiting reduced resistance are formed by sequentially depositing a seed layer by PVD, depositing a conformal seed layer enhancement film by electroplating, and then thermal annealing the seed layer enhan... | 02/14/2006 |
| 6991941 | Light-controlled electrokinetic assembly of particles near surfaces A method and apparatus for the manipulation of colloidal particulates and biomolecules at the interface between an insulating electrode such as silicon oxide and an electrolyte solution. Light-controlled electrokinetic assembly of particles near surfaces relies on t... | 01/31/2006 |
| 6974533 | Platinum electrode and method for manufacturing the same An improved electrode and method for manufacturing the improved electrode wherein the electrode having a fractal surface coating of platinum [which the present inventor refers to as “platinum gray”] with a increase in surface area of at least 5 times when compar... | 12/13/2005 |
| 6969672 | Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the conductive layer deposited on the semiconductor wafer, determining whether th... | 11/29/2005 |
| 6949172 | Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement The invention relates to an arrangement enabling a liquid (2) to flow evenly around a surface of a sample (3); said arrangement has a flow chamber (1) through which a liquid (2) flows via inflow and outflow pipes (7, 8). The sample... | 09/27/2005 |
| 6933165 | Method of making an electrostatic actuator A method of fabricating an electrostatic actuator with an intrinsic stress gradient is provided. An electrode is formed on a substrate and a support layer is formed over the electrode. A metal layer is deposited onto the support layer via a deposition process. Depos... | 08/23/2005 |
| 6926816 | Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes The object of the present invention is to provide a film thickness distribution analysis method that ensures quick and effective prediction of film thickness distribution by computer simulation in the pattern plating process. On the circuit pattern of a print... | 08/09/2005 |
| 6916413 | Electro-plating apparatus and method Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the a... | 07/12/2005 |
| 6913681 | Plating method and plating apparatus A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plati... | 07/05/2005 |
| 6893548 | Method of conditioning electrochemical baths in plating technology An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a first electrochemical bath h... | 05/17/2005 |
| 6884333 | Electrochemical system for analyzing performance and properties of electrolytic solutions The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a device and a method for obtaining qualitative and quantitative inform... | 04/26/2005 |
| 6866763 | Method and system monitoring and controlling film thickness profile during plating and electroetching The present invention provides method of adjusting a thickness profile of a top metal layer of a workpiece using a processing solution. A thickness profile control member is included that has at least first and second regions that will allow for processing at respec... | 03/15/2005 |
| 6837978 | Deposition uniformity control for electroplating apparatus, and associated method A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The ... | 01/04/2005 |
| 6814848 | Method for determining alloy phase in plating layer and method for evaluating sliding property of alloy galvanized steel plate A method for determining a quantity of each of alloy phases in the plating layer includes subjecting each alloy phase in the plating layer to constant potential electrolysis in each of a plurality of ranges of potentials obtained on the basis of the immersion potent... | 11/09/2004 |
| 6802950 | Apparatus and method for controlling plating uniformity The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experi... | 10/12/2004 |
| 6790331 | ELECTRODEPOSITION COATING FILM THICKNESS CALCULATING METHOD, RECORDING MEDIUM STORED WITH FILM THICKNESS CALCULATING PROGRAM AND READABLE BY MEANS OF COMPUTER, AND ELECTRODEPOSITION COATING FILM THICKNESS SIMULATION APPARATUS A finite element model of the environment of electrodeposit coating is prepared by a simulation method, change of an electric field in an electrolytic cell for the case of electrodeposit coating is simulated, the distribution of currents then flowing through individ... | 09/14/2004 |
| 6773569 | Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives A cyclic voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, having an unknown concentration of an additive to be measured therein and cycling the potential of an inert... | 08/10/2004 |
| 6752916 | Electrochemical planarization end point detection A method for determining an end point of a planarization process for removing metal from a surface of a substrate submerged in an electrolytic solution or slurry. A first electrode is provided which is operable to contact the surface of the substrate, such as a work... | 06/22/2004 |
