Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 7935240 | Electroplating apparatus and method based on an array of anodes The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin co... | 05/03/2011 |
| 7892410 | Discharge surface treatment method and discharge surface treatment apparatus To form a thick coating by a discharge surface treatment, a voltage between an electrode and a workpiece during a discharge is detected, and it is determined that a discharge surface treatment state is abnormal if it is detected that the voltage is reduced. With thi... | 02/22/2011 |
| 7837851 | In-situ profile measurement in an electroplating process A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness pr... | 11/23/2010 |
| 7427344 | Methods for determining organic component concentrations in an electrolytic solution The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample ... | 09/23/2008 |
| 7371312 | Using cell voltage as a monitor for deposition coverage A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage. In one embodiment, the voltage of a plating ... | 05/13/2008 |
| 7364979 | Capcitor with single crystal tantalum oxide layer and method for fabricating the same A capacitor and a method for fabricating the same are provided. The capacitor includes: a substrate; an inter-layer insulation layer formed over the substrate and including a contact hole; a storage node formed over the inter-layer insulation layer and filled into t... | 04/29/2008 |
| 7329334 | Controlling the hardness of electrodeposited copper coatings by variation of current profile Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varyi... | 02/12/2008 |
| 7311615 | Golf club head with ceramic layer A hollow club head having an aluminum alloy base material covered with another material layer of Ni or Ni/P with ceramic granules. The thickness of the material layer on the striking face is thicker than on the rest of the club head. The material layer has a hardnes... | 12/25/2007 |
| 7279084 | Apparatus having plating solution container with current applying anodes A method for an electroplating cell which includes providing an anode chamber with at least two concentric anodes including an inner anode and an outer anode; generating a computer generated model with a simulation computer program; and selecting at least one curren... | 10/09/2007 |
| 7253084 | Deposition from liquid sources A liquid injector is used to vaporize and inject a silicon precursor into a process chamber to form silicon-containing layers during a semiconductor fabrication process. The injector is connected to a source of silicon precursor, which preferably comprises liquid tr... | 08/07/2007 |
| 7229543 | Apparatus for controlling and/or measuring additive concentration in an electroplating bath A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy inpu... | 06/12/2007 |
| 7211175 | Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features du... | 05/01/2007 |
| 7189318 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 03/13/2007 |
| 7138345 | Carbon fiber reinforced base material, preform and composite material comprising the same A carbon fiber reinforced substrate comprising a fabric composed of carbon fiber bundles and a first resin adhering to the fabric. Each of the carbon fiber bundles comprises numerous continuous carbon filaments, has the tensile modulus of 210 GPa or more, and has th... | 11/21/2006 |
| 7078894 | Polishing device using eddy current sensor An eddy current sensor and a method for detecting the thickness of a film formed on a substrate. The eddy current sensor, which is capable of stable operation, is operable to accurately detect a polishing endpoint. The eddy current sensor detects the thickness of a ... | 07/18/2006 |
| 7074626 | Method and apparatus for providing intra-tool monitoring and control A method and apparatus for performing intra-tool monitoring and control within a multi-step processing system. The method monitors the processing of a workpiece as the workpiece is processed by independently operating processing tools and produces control parameters... | 07/11/2006 |
| 7020537 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a numerical of the processing chamber o... | 03/28/2006 |
| 6998982 | Anti-thief security sensor assembly with variable amount of emitted infrared beam To provide an anti-thief security sensor assembly capable of automatically setting a projecting power in such a manner that a received beam amount of the anti-thief security sensor assembly for detecting an infrared beam interrupted to sense an intruder attains a pr... | 02/14/2006 |
| 6984299 | Methods for determining organic component concentrations in an electrolytic solution The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample ... | 01/10/2006 |
| 6974533 | Platinum electrode and method for manufacturing the same An improved electrode and method for manufacturing the improved electrode wherein the electrode having a fractal surface coating of platinum [which the present inventor refers to as “platinum gray”] with a increase in surface area of at least 5 times when compar... | 12/13/2005 |
| 6969672 | Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the conductive layer deposited on the semiconductor wafer, determining whether th... | 11/29/2005 |
| 6939447 | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method A method of electro-plating comprises providing an anode current for a target, applying an electron beam to the surface of a target and passing electrolyte between said target and anode, thereby to deposit material on said target. An electron beam gun directs an ele... | 09/06/2005 |
| 6919012 | Method of making a composite article comprising a ceramic coating A ceramic coating is formed on a conductive article by immersing a first anodic electrode, including the conductive article, in an electrolyte comprising an aqueous solution of alkali metal hydroxide and an alkali metal silicate, providing a second cathodic electrod... | 07/19/2005 |
| 6916414 | Light metal anodization Using pulsed current and relatively low average voltages, articles containing light metals such as magnesium may be rapidly anodized to form protective surface coatings. The anodizing solutions employed may contain phosphate, permanganate, silicate, zirconate, vanad... | 07/12/2005 |
| 6916413 | Electro-plating apparatus and method Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the a... | 07/12/2005 |
| 6893551 | Process for forming coatings on metallic bodies and an apparatus for carrying out the process A process for forming oxide based dense ceramic composite coatings on reactive metal and allow bodies involves suspension of at least two reactive metal or alloy bodies in a non-metallic, non-conducting, non-reactive chamber in such a way that it causes either parti... | 05/17/2005 |
| 6884333 | Electrochemical system for analyzing performance and properties of electrolytic solutions The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a device and a method for obtaining qualitative and quantitative inform... | 04/26/2005 |
| 6830673 | Anode assembly and method of reducing sludge formation during electroplating A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte so... | 12/14/2004 |
| 6827838 | Method of separating and collecting 18F in 18O water A method of separating and recovering 18F from 18O water at high purity and efficiency while maintaining the purity of the 18O water. By using a solid electrode (1) as an anode and a container (electrodeposition vessel) (2 | 12/07/2004 |
| 6802950 | Apparatus and method for controlling plating uniformity The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experi... | 10/12/2004 |
| 6793792 | Electroplating methods including maintaining a determined electroplating voltage and related systems Methods for electroplating metal can include passing an electrical current through a conductive surface and an electroplating solution adjacent the conductive surface. An electroplating voltage for the conductive surface and the electroplating solution can be determ... | 09/21/2004 |
| 6761812 | Apparatus and method for electrochemical metal deposition In an electroplating apparatus for semiconductor wafers, the currents to each of a plurality of contact portions contacting the wafer edge are individually adjustable and/or a parameter indicative of the current flow in each contact portion may be determined. Moreov... | 07/13/2004 |
| 6752916 | Electrochemical planarization end point detection A method for determining an end point of a planarization process for removing metal from a surface of a substrate submerged in an electrolytic solution or slurry. A first electrode is provided which is operable to contact the surface of the substrate, such as a work... | 06/22/2004 |
| 6740221 | Method of forming copper interconnects A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating. ... | 05/25/2004 |
| 6726825 | Method and apparatus for manufacturing positive electrode foil of aluminum electrolytic capacitor A method of manufacturing a positive electrode foil of an aluminum electrolytic capacitor is provided in which anodizing conditions are optimally determined and automatically set to minimize the loss of production and to produce a constant quality of the positive el... | 04/27/2004 |
| 6709568 | Method for determining concentrations of additives in acid copper electrochemical deposition baths The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, by firstly determining the concentration of the brightener at a first set of measurement conditions, and sec... | 03/23/2004 |
| 6683446 | Electrode array for development and testing of materials Methods and apparatus employ the use of arrays of two or more electronically discrete electrodes to facilitate high-throughput preparation and testing of materials with two or more elements. High rates of deposition, synthesis and/or analysis of materials... | 01/27/2004 |
| 6607650 | Method of forming a plated layer to a predetermined thickness The object of the present invention is to provide a plating method capable of planarization process of high quality in comparison with the conventional plating method and also provide a plating device and a plating system adopting the plating method of th... | 08/19/2003 |
| 6592737 | Method and apparatus for determination of additives in metal plating baths An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. Plating potentials between the reference... | 07/15/2003 |
| 6569307 | Object plating method and system A method and system are disclosed for plating objects. At least one aspect associated with the object plating is monitored to determine the amount of at least one byproduct created during the plating and/or the reduction in the amount of at least one plat... | 05/27/2003 |
