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| Number | Title | Issue Date |
| 8110084 | Electrode characterized by highly adhering superficial catalytic layer The invention is relative to an electrode for gas evolution in electrolytic and electrometallurgical industrial applications, made of a metal substrate having a surface morphology characterized by a combination of micro-roughness and macro-roughness which favors hig... | 02/07/2012 |
| 8070929 | Catalyst particles on a tip Techniques for forming metal catalyst particles on a metal tip, and nanostructures on a metal tip are provided. ... | 12/06/2011 |
| 7883614 | Method of manufacturing electronic part and electronic part The method for manufacturing an electronic part includes a step of forming an opening hole onto an insulating member sandwiched between a conductor film and a lower conductor layer, from the conductor film, a step of making a surface of the lower conductor layer adh... | 02/08/2011 |
| 7824533 | Tempered plated wire and methods of manufacture The present invention is a method of manufacturing plated wire. The method includes drawing a feed stock to form drawn wire, tempering the drawn wire to form tempered wire and plating the tempered wire to form the plated wire. The plated wire exhibits a tensile stre... | 11/02/2010 |
| 7820025 | Methods of synthesizing an oxidant and applications thereof Novel devices for synthesizing ferrate and uses thereof are described. One aspect of the invention relates to devices and systems for synthesizing ferrate at a site proximal to the site of use. ... | 10/26/2010 |
| 7422629 | Nonsludging zinc phosphating composition and process Electrolysis using a suitable electrolyte provides a completely nonsludging zinc phosphate conversion coating process that produces a high quality conversion coating in a very short time. The suitable electrolyte contains at least water, dissolved nitric acid, and d... | 09/09/2008 |
| 7407689 | Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of t... | 08/05/2008 |
| 7404885 | Plating method and electronic device A plating method includes the steps of (a) forming a roughened area in a predetermined area of a substrate, (b) forming a surface-active agent layer above at least the roughened area, (c) forming, above the roughened area, a catalyst layer above the surface-active a... | 07/29/2008 |
| 7405155 | Circuit package and method of plating the same A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate... | 07/29/2008 |
| 7399423 | Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 07/15/2008 |
| 7385290 | Electrochemical reaction cell for a combined barrier layer and seed layer Methods and apparatus for forming conductive interconnect layers useful in articles such as semiconductor chips, memory devices, semiconductor dies, circuit modules, and electronic systems. An electrochemical cell may be used in the reduction of oxides on a dual-pur... | 06/10/2008 |
| 7374651 | Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it The present invention pertains to an electrolytic copper plating method characterized in employing a phosphorous copper anode having a crystal grain size of 1500 μm (or more) to 20000 μm in an electrolytic copper plating method employing a phosphorous copper anode... | 05/20/2008 |
| 7364664 | Foreign matter removing mechanism, fluid flow processing equipment, and foreign matter removing method The present processing apparatus blocks off such a portion of a flow of a plating solution (17) that is other than a vicinity of a liquid surface, by using a first partition plate (15) whose lower end is in close contact with a bottom of a plating tank... | 04/29/2008 |
| 7351321 | Method for electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 04/01/2008 |
| 7323095 | Integrated multi-step gap fill and all feature planarization for conductive materials A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is posi... | 01/29/2008 |
| 7323699 | Apparatus and method for modifying an object A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material. ... | 01/29/2008 |
| 7323094 | Process for depositing a layer of material on a substrate An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical curr... | 01/29/2008 |
| 7316783 | Method of wiring formation and method for manufacturing electronic components A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the platin... | 01/08/2008 |
| 7267731 | Method and system for fabricating three-dimensional microstructure A method of fabricating a three-dimensional microstructure provides data corresponding to information relating to the structure of a three-dimensional microstructure design. A sample is processed in accordance with the provided data by irradiating the sample with a ... | 09/11/2007 |
| 7267686 | Implantable prosthetic valve A prosthetic valve for implantation within a fluid conducting lumen within a body includes an elongate generally cylindrical radially collapsible valve body scaffold defining a fluid passageway therethrough for retentive positioning within the lumen. A radially coll... | 09/11/2007 |
| 7252750 | Dual contact ring and method for metal ECP process A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge region of the wafer. The dual contact ring has an outer voltage ring in ... | 08/07/2007 |
| 7244242 | Valve treatment catheter and methods The invention provides a catheter for insertion into a biological passage which contains a first flowing fluid, the catheter including a tubular member having a proximal end and a distal end; a fluid delivery lumen contained within the tubular member; an inflatable ... | 07/17/2007 |
| 7241396 | Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 07/10/2007 |
| 7241372 | Plating apparatus and plating liquid removing method A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The plating apparatus comprises a head having a rotatable housing provided with... | 07/10/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7236847 | Systems and methods for closed loop defect reduction Systems and methods for repairing defects on a specimen are provided. A method may include processing a specimen, detecting defects on the specimen, and repairing one or more of the defects. An additional method may include detecting defects on a specimen, repairing... | 06/26/2007 |
| 7223328 | Sensors for reducing gas molecules Provided is a gas molecule sensor, characterized in that the sensing element is a polycrystalline tin oxide film having a thickness less than 1 μm. The sensing element is produced by electrolytic deposit of a tin film on an insulating support in an electromechanica... | 05/29/2007 |
| 7221495 | Thin film precursor stack for MEMS manufacturing This invention provides a precursor film stack for use in the production of MEMS devices. The precursor film stack comprises a carrier substrate, a first layer formed on the carrier substrate, a second layer of an insulator material formed on the first layer, and a ... | 05/22/2007 |
| 7211145 | Substrate processing apparatus and substrate processing method A substrate processing apparatus include a spin chuck capable of holding a semiconductor wafer in a horizontal position, a drive motor for driving the spin chuck for rotation, and a processing vessel accommodating the spin chuck and the drive motor 50 therein... | 05/01/2007 |
| 7208074 | Substrate processing apparatus and substrate plating apparatus A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a s... | 04/24/2007 |
| 7204926 | Tandem blisk electrochemical machining A tandem blisk is mounted in a multiaxis electrochemical machine. A first row of blades is electrochemically machined in sequence. A second row of blades is then electrochemically machined in sequence while the blisk is still mounted in the machine. The machine is i... | 04/17/2007 |
| 7192494 | Method and apparatus for annealing copper films A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system. ... | 03/20/2007 |
| 7189647 | Sequential station tool for wet processing of semiconductor wafers Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are divided into sub-processes, each optimized for increasing wafer to wa... | 03/13/2007 |
| 7189317 | Semiconductor manufacturing system for forming metallization layer A method for forming a metallization layer. A first layer is formed outwardly from a semiconductor substrate. Contact vias are formed through the first layer to the semiconductor substrate. A second layer is formed outwardly from the first layer. Portions of the sec... | 03/13/2007 |
| 7189318 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 03/13/2007 |
| 7166204 | Plating apparatus and method A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid ... | 01/23/2007 |
| 7128821 | Electropolishing method for removing particles from wafer surface An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction ... | 10/31/2006 |
| 7123216 | Photonic MEMS and structures An interference modulator (Imod) incorporates anti-reflection coatings and/or micro-fabricated supplemental lighting sources. An efficient drive scheme is provided for matrix addressed arrays of IMods or other micromechanical devices. An improved color scheme provid... | 10/17/2006 |
| 7097776 | Method of fabricating microneedles A low cost method for fabricating microneedles is provided. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern o... | 08/29/2006 |
| 7097410 | Methods and apparatus for controlled-angle wafer positioning The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is an... | 08/29/2006 |
