Bizarre Patents
Behavior Modification Wristwatch
A wristwatch including a watch band and a watch body having an octagon shaped perimeter and being red in color and having the word STOP thereon to resemble a stop sign.
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| Number | Title | Issue Date |
| 8038866 | Process for producing high etch gains for electrolytic capacitor manufacturing Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge... | 10/18/2011 |
| 8012338 | Method for preparing biomedical surfaces A method for selectively dissolving the beta (β) phase of a titanium alloy out of the surface of the alloy, thereby leaving behind a nano-scale porous surface having enhanced bonding properties with either a biological tissue, such as bone, or an adhesive material,... | 09/06/2011 |
| 7998335 | Controlled electrochemical polishing method The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizi... | 08/16/2011 |
| 7767074 | Method of etching copper on cards Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte compris... | 08/03/2010 |
| 7578924 | Process for producing high etch gains for electrolytic capacitor manufacturing Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge... | 08/25/2009 |
| 7531079 | Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respec... | 05/12/2009 |
| 7422700 | Compositions and methods of electrochemical removal of material from a barrier layer of a wafer Methods and compositions have been provided for removing barrier layer material from a work piece during an electrochemical mechanical polishing process while protecting a metallization layer of the work piece. The electrochemical planarization composition includes ... | 09/09/2008 |
| 7374654 | Method of making an organic memory cell A method of making an organic memory cell which comprises two electrodes with a controllably conductive media between the two electrodes is disclosed. The present invention involves providing a dielectric layer having formed therein one or more first electrode pads;... | 05/20/2008 |
| 7364647 | Laminated flow device A laminated flow device comprises a porous material encapsulated within bonding material. The porous material forms a flow path and the bonding material forms an enclosure surrounding the flow path. Micro-components, such as capillaries, electrodes, reservoirs, brid... | 04/29/2008 |
| 7357854 | Process for electropolishing a device made from cobalt-chromium The invention is directed to an electropolishing solution for products or devices made from at least in part a cobalt-chromium alloy. The invention is particularly suitable for medical devices or intravascular stents made at least in part of cobalt-chromium. More pa... | 04/15/2008 |
| 7332068 | Selective removal of dielectric materials and plating process using same A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, the... | 02/19/2008 |
| 7259101 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 08/21/2007 |
| 7259100 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 08/21/2007 |
| 7239121 | Quantative extraction of micro particles from metallic disk spacer rings Embodiments of the present invention include a method for quantitatively detecting embedded particles of a disk spacer ring comprising. The method includes dissolving a layer of a disk spacer ring into a liquid solution, the disk spacer ring layer comprising embedde... | 07/03/2007 |
| 7232514 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 06/19/2007 |
| 7229506 | Process for pickling martensitic or ferritic stainless steel A process for pickling martensitic or ferritic stainless steel, preferably in the form of wires, tubes or rods, wherein the stainless steel is placed in contact with a pickling solution which has a temperature in the range 15 to 29° C. and contains 50 to 120 g/l of... | 06/12/2007 |
| 7160432 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at... | 01/09/2007 |
| 7150820 | Thiourea- and cyanide-free bath and process for electrolytic etching of gold An aqueous thiourea-free gold etching bath for electrolytically etching gold from a microelectronic workpiece. One embodiment of the aqueous thiourea-free bath contains: (a) about 0.5–1.5 M iodide; (b) about 0.1–0.3 M sulfite; and (c) about 1.0–3.0 g/L wetting... | 12/19/2006 |
| 7128825 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 10/31/2006 |
| 7101471 | Method for planar material removal technique using multi-phase process environment An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes a high resistance phase and an etching solution phase. The conductiv... | 09/05/2006 |
| 7094131 | Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a conductive or semiconductive material with a recess having an initially sharp corner at the surface ... | 08/22/2006 |
| 7090763 | Process for the production of shaped articles of niobium or tantalum by electrochemical etching Process for the production of shaped articles of niobium or tantalum by electrochemical etching of a niobium or tantalum sheet covered by a structured photoresist mask in an aqueous solution containing hydrofluoric acid, the etching being effected under electrochemi... | 08/15/2006 |
| 7077721 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 07/18/2006 |
| 7045052 | Method of manufacturing a spectral filter for green and longer wavelengths A method of manufacture for optical spectral filters with omnidirectional properties in the visible, near IR, mid IR and/or far IR (infrared) spectral ranges is based on the formation of large arrays of coherently modulated waveguides by electrochemical etching of a... | 05/16/2006 |
| 7029365 | Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 04/18/2006 |
| 7026255 | Method and device for photo-electrochemically etching a semiconductor sample, especially gallium nitride In a method for photo-electrochemical etching of a semiconductor sample, the semiconductor sample is brought in contact with an electrolyte liquid. The contact area formed thereby is illuminated through the electrolyte liquid with UV light. The photo-current created... | 04/11/2006 |
| 6969457 | Method for partially stripping a coating from the surface of a substrate, and related articles and compositions An electrochemical process for selectively stripping at least one coating from the surface of a substrate is disclosed. The substrate (often a turbine engine component) is immersed in a composition through which electrical current flows. The composition includes a h... | 11/29/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6923900 | Alloy pipes and methods of making same A profiled tube (50b) comprising a high carbon content alloy (greater than 0.3%), superalloy or other high creep strength material, has a fluted bore with internal fins (52b) and intervening valleys or troughs (56b). Such a ... | 08/02/2005 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The comp... | 05/31/2005 |
| 6884338 | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions. ... | 04/26/2005 |
| 6866769 | Drive head and ECM method and tool for making same A drive head for a bolt, fastener, coupling, nut or other driveable head made from a less malleable metal such as a powder metal nickel alloy. The drive head has an upper drive portion having at least six convex corners spaced around the outer periphery thereof, eac... | 03/15/2005 |
| 6858126 | High capacitance anode and system and method for making same A method of producing electrodes for electrolytic capacitors by etching metal foil in a low pH etching electrolyte is disclosed. The low pH electrolyte is an aqueous solution, which comprises hydrochloric acid, glycerol, sodium perchlorate or perchloric acid, sodium... | 02/22/2005 |
| 6858124 | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor The present invention provides methods of polishing and/or cleaning copper interconnects using sulfonic acid compositions. ... | 02/22/2005 |
| 6843929 | Accelerated etching of chromium A method and associated structure for increasing the rate at which a chromium volume is etched when the chromium body is contacted by an acid solution such as hydrochloric acid. The etch rate is increased by a metallic or steel body in continuous electrical contact ... | 01/18/2005 |
| 6835299 | Electrochemical machining method and apparatus An electrochemical machining technique involves moving a cathode (2) towards an anodic workpiece (1). A current is passed through an electrolyte which flows between the cathode (2) and workpiece (1) so as to cause material to be removed e... | 12/28/2004 |
| 6802954 | Creation of porous anode foil by means of an electrochemical drilling process The present invention is directed to a method of creating porous anode foil for use in multiple anode stack configuration electrolytic capacitors, producing a pore structure that is microscopic in pore diameter and spacing, allowing for increased energy density with... | 10/12/2004 |
| 6790785 | Metal-assisted chemical etch porous silicon formation method A thin discontinuous layer of metal such as Au, Pt, or Au/Pd is deposited on a silicon surface. The surface is then etched in a solution including HF and an oxidant for a brief period, as little as a couple seconds to one hour. A preferred oxidant is H2O | 09/14/2004 |
| 6790336 | Method of fabricating damascene structures in mechanically weak interlayer dielectrics A copper damascene process for a mechanically weak low k dielectric layer is described. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer assures complete planarization of the copper. ... | 09/14/2004 |
| 6783657 | Systems and methods for the electrolytic removal of metals from substrates The present invention provides methods and systems for the electrolytic removal of platinum and/or other of the Group 8-11 metals from substrates. ... | 08/31/2004 |
