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| Number | Title | Issue Date |
| 8048287 | Method for selectively removing conductive material from a microelectronic substrate Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair... | 11/01/2011 |
| 7691250 | Membrane-mediated electropolishing with topographically patterned membranes This invention provides membrane-mediated electropolishing (MMEP) processes for polishing and/or planarizing metal work pieces using topographically patterned membranes. The processes can be used for both pure metals and alloys, and provide advantages over conventio... | 04/06/2010 |
| 7604729 | Methods and apparatus for selectively removing conductive material from a microelectronic substrate Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair... | 10/20/2009 |
| 7527723 | Electrolytic processing apparatus and electrolytic processing method An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus in... | 05/05/2009 |
| 7513986 | Method and device for locally removing coating from parts A method and a device for locally removing coatings from components. An absorbent medium supplied with a coating removal liquid is brought into contact with one or more areas of a component from which a coating is to be removed. ... | 04/07/2009 |
| 7425250 | Electrochemical mechanical processing apparatus A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential differe... | 09/16/2008 |
| 7422677 | Membrane-mediated electropolishing This invention provides a membrane-mediated electropolishing process for polishing and/or planarizing metal work pieces. The work piece is wetted with a low-conductivity fluid. The wetted work piece is contacted with a first side of a charge-selective ion-conducting... | 09/09/2008 |
| 7332068 | Selective removal of dielectric materials and plating process using same A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, the... | 02/19/2008 |
| 7312160 | Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device The removing solution containing a cerium (IV) nitrate salt, periodic acid or a hypochlorite can be applied to metals containing copper, silver or palladium and also to metals containing other metals having a relatively large oxidation-reduction potential. ... | 12/25/2007 |
| 7311808 | Device and method for increasing mass transport at liquid-solid diffusion boundary layer A device and method for increasing the mass transport rate of a chemical or electrochemical process at the solid and fluid interface in a fluid cell. The device includes a membrane in close contact with surface of the work piece, to separate the process cell into tw... | 12/25/2007 |
| 7276002 | Surface texture configuration for CVT pulley A pulley engageable with a belt for use in a continuously variable transmission includes first and second pulley halves rotatable about an axis and relatively moveable in a direction of the axis. The pulley halves include truncated conical portions symmetrically opp... | 10/02/2007 |
| 7232514 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 06/19/2007 |
| 7208076 | Substrate processing apparatus and method A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral... | 04/24/2007 |
| 7208069 | Device for etching semiconductors with a large surface area The device etches semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. A sample head is mounted inside the etching trough, and is provided with a device for holding at least one semiconductor wafer. The device is ti... | 04/24/2007 |
| 7172497 | Fabrication of semiconductor interconnect structures A system and a method of forming copper interconnect structures in a surface of a wafer is provided. The method includes a step of performing a planar electroplating process in an electrochemical mechanical deposition station for filling copper material into a plura... | 02/06/2007 |
| 7166207 | Non-mechanical method of removing material from the surface of a golf club head A highly accurate, efficient, and non-mechanical method of removing material from the surface of a golf club head using the principles of electrolysis. The process generally includes positioning at least one electrode in close proximity to a portion of a rear surfac... | 01/23/2007 |
| 7153411 | Method for cleaning and polishing metallic alloys and articles cleaned or polished thereby A method of cleaning and polishing an alloy comprising at least one noble metal and at least one non-noble metal, the method including the steps of submerging said alloy in an electrolytic acidic bath comprising at least one chelating or complexing agent including s... | 12/26/2006 |
| 7144482 | Method and apparatus for forming grooves within journals and on flat plates An apparatus, method and means is provided for electrochemical machining of hydrodynamic bearing assemblies in spindle motors. In an aspect, a cartridge is provided that receives and accurately positions an electrode in three dimensions in a near frictionless manner... | 12/05/2006 |
| 7128825 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 10/31/2006 |
| 7125477 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 10/24/2006 |
| 7122473 | Edge and bevel cleaning process and system The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, ... | 10/17/2006 |
| 7101085 | Rotating shaft conical fluid dynamic bearing A fluid dynamic bearing design is provided featuring a rotating shaft with at least one conical bearing formed integrally thereon. The shaft is disposed through a stationary sleeve, and a fluid separates the shaft and sleeve surfaces. ... | 09/05/2006 |
| 7101471 | Method for planar material removal technique using multi-phase process environment An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes a high resistance phase and an etching solution phase. The conductiv... | 09/05/2006 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface in... | 08/29/2006 |
| 7029567 | Electrochemical edge and bevel cleaning process and system An edge cleaning system and method is disclosed in which a directed stream of a mild etching solution is supplied to an edge area of a rotating workpiece, including the front surface edge and bevel, while a potential difference between the workpiece and the directed... | 04/18/2006 |
| 7025860 | Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the workpiece support plate, has at least one opening coupled to a source of ele... | 04/11/2006 |
| 6951599 | Electropolishing of metallic interconnects Embodiments of the present invention generally relate to a method and apparatus for planarizing a substrate by electropolishing techniques. Certain embodiments of an electropolishing apparatus include a contact ring adapted to support a substrate, a cell body adapte... | 10/04/2005 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The comp... | 05/31/2005 |
| 6896143 | Electrolytic machining method, method for manufacturing dynamic pressure bearing devices, and dynamic pressure bearing devices manufactured according to the manufacturing method An electrolytic machining method for electrolytically machining a workpiece is provided. The method uses a masking member having through-hole patterns that correspond to the shapes of concave parts to be formed in the workpiece. The masking member is brought in cont... | 05/24/2005 |
| 6833063 | Electrochemical edge and bevel cleaning process and system The present invention provides an edge cleaning system and method in which a directed stream of a mild etching solution is supplied to an edge area of a rotating workpiece, including the front surface edge and bevel, while a potential difference between the workpiec... | 12/21/2004 |
| 6802955 | Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad a... | 10/12/2004 |
| 6773576 | Anode assembly for plating and planarizing a conductive layer A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within ... | 08/10/2004 |
| 6723224 | Electro-chemical polishing apparatus Generally, a method and apparatus for electro-chemical polishing a metal layer disposed on a substrate is provided. In one embodiment, the electro-chemical polishing apparatus generally includes a substrate support having a plurality of contact members, a cathode an... | 04/20/2004 |
| 6685814 | Method for enhancing the uniformity of electrodeposition or electroetching An apparatus and method for an electrodeposition or electroetching system. A thin metal film is deposited or etched by electrical current through an electrolytic bath flowing toward and in contact with a target on which the film is disposed. Uniformity of... | 02/03/2004 |
| 6663765 | Method and device for the manufacture of the medical expanding stents Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and size of the stent to be implanted, electrochemically formi... | 12/16/2003 |
| 6638414 | Electrode design for electrochemical machining of grooves Apparatus for defining patterns electrochemically on conductive materials by forming the patterns as conductive features of a tool, providing insulative properties about the conductive features so the patterns are defined; then providing an immersive medi... | 10/28/2003 |
| 6627064 | Method for removing the hard material coating applied on a hard metal workpiece and a holding device for at least one workpiece A hard material layer deposited on a hard metal work piece is removed by electrolytic passivation in which a maximum current density equal to at least 0.01 A/cm2 is generated on the work piece at the beginning of the layer removal process. The ... | 09/30/2003 |
| 6547945 | Method and apparatuses for electrochemically treating an article An electrochemical cell for use in electrochemical processes, such as plating processes, has a first electrode which extends circumferentially about at least a portion of an electrode chamber. The article being treated is the second electrode and is dispo... | 04/15/2003 |
| 6537439 | Method and apparatus for recovering a reaction product produced at a surface A method and apparatus are described for removing a chemical product species produced by electrochemical action at an electrode or by a chemical reaction which occurs at the surface of a solid catalyst. The method involves providing a flow of a host solut... | 03/25/2003 |
| 6503387 | Method and device for electro-chemical discharge processing with self-acting bubble layer The present invention relates to an electrochemical discharge method and device with self-acting bubble layers, wherein the device comprises an electrode, being the cathode, capable of supplying self-acting bubble layers, an auxiliary electrode, being the... | 01/07/2003 |
