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| Number | Title | Issue Date |
| 8187451 | Method and device for manufacturing integrally bladed rotors A method for manufacturing integrally bladed rotors (preferably gas turbine rotors) is provided. The method includes the steps of a) providing a basic rotor body; b) placing the basic rotor body into an electrolyte; c) electrochemically machining the basic rotor bod... | 05/29/2012 |
| 8110088 | Implant and method for manufacturing same The present invention relates to a method for manufacturing an implant, in particular an intraluminal endoprosthesis, with a body containing metallic material, preferably iron. To control the degradation of the implant, the method comprises the following steps: a) p... | 02/07/2012 |
| 8101060 | Methods and apparatuses for electrochemical-mechanical polishing Methods and apparatuses for removing material from a microfeature workpiece are disclosed. In one embodiment, the microfeature workpiece is contacted with a polishing surface of a polishing medium, and is placed in electrical communication with first and second elec... | 01/24/2012 |
| 7964085 | Electrochemical removal of tantalum-containing materials A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clea... | 06/21/2011 |
| 7951284 | Electrolysis apparatus, electrochemical reaction membrane apparatus, porous electrical conductor, and production method thereof A water electrolysis apparatus includes a plurality of unit cells. A membrane electrode assembly of the unit cell includes an anode side power feeding element and a cathode side power feeding element stacked on an anode catalyst layer and a cathode catalyst layer on... | 05/31/2011 |
| 7833405 | Micromechanical component and corresponding production method A micromechanical component is described which includes a substrate; a monocrystalline layer, which is provided above the substrate and which has a membrane area; a cavity that is provided underneath the membrane area; and one or more porous areas, which are provide... | 11/16/2010 |
| 7807036 | Method and system for pad conditioning in an ECMP process A method and system for pad conditioning in an electrochemical mechanical planarization (eCMP) tool is disclosed. A polishing pad having a pad electrode is placed onto a platen of the eCMP tool. A conditioning disk, having a second electrode is placed on the polishi... | 10/05/2010 |
| 7799200 | Selective electrochemical accelerator removal Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and expose... | 09/21/2010 |
| 7799199 | Process and plant for descaling, pickling and finishing passivating stainless steel strips, and strips so obtainable Environment-friendly process for descaling, pickling and finishing/passivating in a continuous, integrated and flexible manner, applicable to any type of stainless steel, regardless of its physical structure, chemical composition and nature of surface oxides to be r... | 09/21/2010 |
| 7790014 | Removal of substances from metal and semi-metal compounds The present invention pertains to a method for removing a substance (X) from a solid metal or semi-metal compound (M1X) by electrolysis in a melt of M2Y, which comprises conducting the electrolysis under conditions such that reaction of X rathe... | 09/07/2010 |
| 7771581 | Apparatus and process for electrolytic removal of material from a medical device An apparatus and process is disclosed for the electrolytic removal of metal from a device, such as a medical device. More particularly, the apparatus of the invention includes a mandrel having slots or openings therein to expose portions of a metallic device, such a... | 08/10/2010 |
| 7682498 | Rotationally asymmetric variable electrode correction A work piece is electroplated or electroplanarized using an azimuthally asymmetric electrode. The azimuthally asymmetric electrode is rotated with respect to the work piece (i.e., either or both of the work piece and the electrode may be rotating). The azimuthal asy... | 03/23/2010 |
| 7632390 | Apparatus and method for enhancing electropolishing utilizing magnetic fields A process for electropolishing metals and metalloids and their alloys, intermetallic compounds, metal-matrix composites, carbides and nitrides in an electrolytic cell utilizing an externally applied magnetic force to enhance the dissolution process. The electropolis... | 12/15/2009 |
| 7611619 | Electrochemical miniaturization of organic micro-and nanostructures The invention provides a simple and convenient strategy for reducing the dimensions of organic micro- and nanostructures on metal surfaces. By varying electrochemical desorption conditions, organic structures patterned by Dip-Pen Nanolithography or any of the micro-... | 11/03/2009 |
| 7510641 | High current density electropolishing in the preparation of highly smooth substrate tapes for coated conductors A continuous process of forming a highly smooth surface on a metallic tape by passing a metallic tape having an initial roughness through an acid bath contained within a polishing section of an electropolishing unit over a pre-selected period of time, and, passing a... | 03/31/2009 |
| 7473344 | Segmented counterelectrode for an electrolytic treatment system In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatme... | 01/06/2009 |
| 7434719 | Addition of Dto Hto detect and calibrate atomic hydrogen formed by dissociative electron attachment A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be... | 10/14/2008 |
| 7425250 | Electrochemical mechanical processing apparatus A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential differe... | 09/16/2008 |
| 7419581 | Method for producing optically transparent regions in a silicon substrate A simple and cost-effective possibility is proposed for producing optically transparent regions (5, 6) in a silicon substrate (1), by the use of which both optically transparent regions of any thickness and optically transparent regions over a cavity i... | 09/02/2008 |
| 7416652 | Method for manufacturing an electrode for the electrochemical machining of a workpiece and an electrode manufactured according to this method The invention relates to a method for manufacturing a tool electrode for the electrochemical machining of workpieces, particularly for components for fluid bearings with the following processing steps: (a) Providing an electrode body made of a conductive base materi... | 08/26/2008 |
| 7394040 | Electromachining process and apparatus An electromachining process and apparatus includes providing both high-speed electroerosion functions for rapidly rough finishing a workpiece and electrodischarge machining functions for fine finishing by first using a rotary electrode to implement the high-speed el... | 07/01/2008 |
| 7387738 | Removal of surface oxides by electron attachment for wafer bumping applications The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprisin... | 06/17/2008 |
| 7377836 | Versatile wafer refining Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Met... | 05/27/2008 |
| 7374654 | Method of making an organic memory cell A method of making an organic memory cell which comprises two electrodes with a controllably conductive media between the two electrodes is disclosed. The present invention involves providing a dielectric layer having formed therein one or more first electrode pads;... | 05/20/2008 |
| 7357854 | Process for electropolishing a device made from cobalt-chromium The invention is directed to an electropolishing solution for products or devices made from at least in part a cobalt-chromium alloy. The invention is particularly suitable for medical devices or intravascular stents made at least in part of cobalt-chromium. More pa... | 04/15/2008 |
| 7355186 | Charged particle beam device with cleaning unit and method of operation thereof The invention provides a charged particle beam device, an emitter module for emitting charged particle beams and a method of operation thereof. Thereby, a charged particle beam emitter (15) emitting charged particles along an optical axis (1) is realiz... | 04/08/2008 |
| 7344623 | System and method for radially positioning a workpiece for electrochemical machining A system and method are described for radially positioning a workpiece for electrochemical machining. In one embodiment, a pressurized air chamber is configured to contain pressurized air. In addition, an expandable diaphragm is configured to position the workpiece ... | 03/18/2008 |
| 7338588 | Intermetallic compounds A method for the production of an intermetallic compound (M1Z) involves treating a solid precursor material comprising three or more species, including first and second metal or metalloid species (M1, Z) and a non-metal species (X), by electro-... | 03/04/2008 |
| 7329335 | Device providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 02/12/2008 |
| 7323416 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at... | 01/29/2008 |
| 7318278 | Method of manufacture of a heart valve support frame Methods for forming a support frame for flexible leaflet heart valves from a starting blank include converting a two-dimensional starting blank into the three-dimensional support frame. The material may be superelastic, such as NITINOL, and the method may include be... | 01/15/2008 |
| 7316067 | Forming a perforate membrane by laser drilling and a subsequent electro-polishing step A method of forming a perforate membrane (1) is disclosed for use in a liquid transport device. The membrane has at least plural nozzles (10) formed therethrough. Each of those nozzles has a throat portion (12) opening at opposite end through op... | 01/08/2008 |
| 7303462 | Edge bead removal by an electro polishing process A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electroche... | 12/04/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7300480 | High-rate barrier polishing composition The solution is useful for removing a barrier material from a semiconductor substrate. The solution comprises, by weight percent, 0.01 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal, 0 to 15 abrasive, 0 to 20 complexing agent for the nonferrous metal, 0.01... | 11/27/2007 |
| 7294244 | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing... | 11/13/2007 |
| 7271071 | Method of forming a catalytic surface comprising at least one of Pt, Pd, Co and Au in at least one of elemental and alloy forms The invention includes methods of forming a substrate having a surface comprising at least one of Pt, Pd, Co and Au in at least one of elemental and alloy forms. In one implementation, a substrate is provided which has a first substrate surface comprising at least o... | 09/18/2007 |
| 7262382 | Process of forming conical holes with an electrical discharge machining system An electrical discharge machine is configured to (i) machine at least a portion of a workpiece through electrical discharge between the workpiece and a first machining electrode aligned by the electrode guide; (ii) generate a dressed machining electrode by engaging ... | 08/28/2007 |
| 7259061 | Method for forming a capacitor for an integrated circuit and integrated circuit Integrated circuits can include an integrated capacitor with a metal alloy layer. Methods for forming such integrated circuits can include providing a substrate, forming a first electrode including depositing a metal alloy layer having a first surface and an exposed... | 08/21/2007 |
| 7255758 | Steel wire and method of manufacturing the same A steel wire of pearlite structure containing 0.8-1.0 mass % of C and 0.8-1.5 mass % of Si is disclosed. In the cross section of the steel wire the difference in average hardness between a region up to 100 μm from the surface thereof and a deeper region is within 5... | 08/14/2007 |
