Did You Know...
...that several people are credited with the invention of the flush toilet? Most people have heard of Thomas Crapper (1837-1910), the sanitary engineer who invented the valve-and-siphon arrangement that made the modern toilet possible. Another claimant to "the throne" was British inventor Alexander Cumming who patented a toilet in 1775. Then there's a nameless Minoan (a native of ancient Crete) who lived 4,000 years ago who supposedly was ahead of his time and created the first flush toilet!
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| Number | Title | Issue Date |
| 6312580 | Method for gold plating chromium and other passive metals A method is described for plating adherent, hard decorative gold in one or two steps, eliminating multistage substrate stripping on chromium plated automobile emblems.... | 11/06/2001 |
| 6019878 | Anode for oxygen evolution in electrolytes containing fluorides or fluoride-complex anions The invention discloses a new electrode suitable for use as an anode for oxygen evolution from electrolytes containing fluorides or fluoride-complex anions even in high concentrations. The anode of the invention comprises a titanium substrate provided with a ... | 02/01/2000 |
| 5575900 | Gold plating solutions Opportunistic decorative mass production gold plating solutions are described which are capable of plating gold at concentrations as low as one-half pennyweight per gallon based on an alkaline gold cyanide complex. The low concentration enables ecological... | 11/19/1996 |
| 5085744 | Electroplated gold-copper-zinc alloys A solution for electroplating gold-copper-zinc alloys. A solution containing excess cyanide and hydroxide ions, gold and copper each in the form of a cyanide complex, and zinc at least partially in the form of a zincate complex. Additives such as conducti... | 02/04/1992 |
| 5055173 | Bath for the electrolytic deposition of fine gold coatings Bondable fine gold coatings are obtained from electrolytic baths which contain 2 to 100 g/l gold as alkali or ammonium gold (I)-cyanide, 0.1 mg to 5 g/l of a soluble bismuth compound, 0 to 250 g/l of a phosphonic acid, its salts, esters or simple substitu... | 10/08/1991 |
| 4767507 | Gold electroplating bath An acid gold electroplating bath contains gold in an electrodepositable form, (e.g. potassium gold cyanide), together with 3-(3-pyridyl) acrylic acid or 3-(3-quinolyl) acrylic acid, and optionally a metallic additive. The metallic additive is preferably a... | 08/30/1988 |
| 4717459 | Electrolytic gold plating solution An electrolytic gold plating solution including a soluble gold salt, a conductivity salt, and, in addition, a mixture of a lead compound and a complexing agent having the stability constant with lead of not less than 15 or a complex obtained from the lead... | 01/05/1988 |
| 4591415 | Plating baths and methods for electro-deposition of gold or gold alloys Aqueous acid gold or gold alloy baths containing a substituted pyridine carboxylic acid, pyridine thiol, quinoline carboxylic acid, quinoline thiol, or a derivative or mixtures thereof, as an additive and methods of using such baths.... | 05/27/1986 |
| 4422906 | Process for direct gold plating of stainless steel Stainless steel can be directly plated with gold by a process wherein stainless steel is dipped in an activating solution; the activated stainless steel is subjected to cathodic electrolysis in a cathode electrolytic activation solution and then the treat... | 12/27/1983 |
| 4411965 | Process for high speed nickel and gold electroplate system and article having improved corrosion resistance A method of electrodepositing a gold alloy layer having improved corrosion protection is disclosed. Prior to the gold layer an underlayer of ductile, low-stress nickel is electrodeposited from a solution containing ortho-formyl benzene sulfonic acid and p... | 10/25/1983 |
| 4396471 | Gold plating bath and method using maleic anhydride polymer chelate An all-purpose gold cyanide electroplating bath utilizes a cobalt, nickel, or indium hardener as a chelate with the acid form of a methyl vinyl ether/maleic anhydride interpolymer. The bath is capable of producing high levels of hardness in deposits that ... | 08/02/1983 |
| 4379738 | Electroplating zinc An electroplating process is described for plating various metals and alloys in which certain organic substances are added to the plating solution. This permits high plating rates with excellent plating results, including smooth bright finishes, freedom f... | 04/12/1983 |
| 4377449 | Electrolytic silver plating A silver electroplating bath comprising heterocyclic organic additives such as lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones, preferably phenolphthalein.... | 03/22/1983 |
| 4377448 | Electrolytic gold plating A gold electroplating bath comprising heterocyclic organic compounds such as lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones.... | 03/22/1983 |
| 4310392 | Electrolytic plating The electroplating of various metals such as zinc, copper, cadmium, chromium, nickel cobalt, gold, silver, palladium, platinum, ruthenium and alloys of such metals takes place from electrolytes comprising heterocyclic additives such as lactones, lactams, ... | 01/12/1982 |
| 4269670 | Electrode for electrochemical processes An electrochemical process is described in which a particular kind of electrode is used. The electrode surface is made up of certain types of oxides. A process for preparing the electrodes is also described. Such electrodes exhibit long life and are highl... | 05/26/1981 |
| 4253920 | Composition and method for gold plating A bath for electroplating hard gold deposits at relatively high current efficiencies comprises an aqueous solution of a phosphate electrolyte, 1-hydroxyethylidene-1,1-diphosphonic acid, metal constituent, alkali metal gold cyanide and a small amount of fr... | 03/03/1981 |
| 4238300 | Gold electroplating process Electrolytic deposition of gold results in the formation of undesirable reducible gold III species in the electroplating bath which interfere with the current efficiency and make the prediction of gold thickness based on applied current impossible. Additi... | 12/09/1980 |
| 4186064 | Method and electrolyte for electrodeposition of bright gold and gold alloys Bright gold or gold alloy electroplating employing a preformed fully neutralized salt of a cobalt or nickel metal organophosphorus chelate as the brightening agent.... | 01/29/1980 |
| 4168214 | Gold electroplating bath and method of making the same An aqueous bath for the electroplating of gold is particularly adapted for plating a gold strike on stainless steel and includes about 2 to 16.5 grams per liter of auric(III) gold in a cyanide complex. Potassium nitrate is employed as an electrolyte and e... | 09/18/1979 |
| 4167240 | Method of treating an electroplating solution comprising ions of gold and cyanide prior to electroplating and thermocompression bonding A method of treating a solution comprising ions of gold and cyanide is disclosed. The method comprises treating the solution with metallic gold to precipitate therefrom metallic silver.... | 09/11/1979 |
| 4076598 | Method, electrolyte and additive for electroplating a cobalt brightened gold alloy Disclosed are methods and electrolytes for the electrodeposition of a gold alloy containing 0.05 to 0.4 per cent by weight of cobalt. The electrolytes comprise aqueous acidic solutions containing nitrilotriacetic acid.... | 02/28/1978 |
| 4075065 | Gold plating bath and process An electrolyte for depositing gold on a surface includes an alkali gold cyanide, a weak Lewis acid, a weak polyfunctional water-soluble aliphatic acid, a non-depositing metallic compound, a metallic hardener, and water.... | 02/21/1978 |
| 4073700 | Process for producing by electrodeposition bright deposits of gold and its alloys This invention discloses a process for producing by electrodeposition bright deposits of gold and its alloys at greatly increased speeds and with an evenness of distribution significantly greater than conventional baths resulting in considerable savings i... | 02/14/1978 |
| 4067783 | Gold electroplating process Certain reducible species are found in gold electroplating solutions which interfere with efficient electroplating of gold and make uncertain gold thickness predictions based on current throughput. A gold electroplating process is described which minimize... | 01/10/1978 |
| 4062736 | Gold and gold alloy deposition Disclosed is a bath and process for obtaining deposits of gold or gold alloys of improved uniformity of deposit thickness on an irregularly shaped conductive surface. The aqueous plating bath contains gold as the aurocyanide complex, a mild reducing agent... | 12/13/1977 |
