Bizarre Patents
A kissing shield comprised of a thin, flexible membrane and a frame or holder.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7828952 | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to ... | 11/09/2010 |
| 7655127 | Method of fabricating thin film transistor Method of fabricating electronic devices is disclosed. The method includes the steps of forming an anodized layer that has a thickness greater than a desired thickness, and forming an electrically conductive layer on the anodized layer. The method further includes t... | 02/02/2010 |
| 7368045 | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow A method is provided for electroplating a gate metal or other conducting or semiconducting material directly on a dielectric such as a gate dielectric. The method involves selecting a substrate, dielectric layer, and electrolyte solution or melt, wherein the combina... | 05/06/2008 |
| 7351321 | Method for electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 04/01/2008 |
| 7303663 | Multistep release method for electrochemically fabricated structures Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surro... | 12/04/2007 |
| 7252861 | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to ... | 08/07/2007 |
| 7254503 | Light source wavelength correction A wavelength correction function provides corrected reflectance values from actual reflectance values taken in a reflectance-base instrument. The correction is provided as a function of measured reflectance values and a predefined set of high resolution reflectance ... | 08/07/2007 |
| 7250101 | Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In so... | 07/31/2007 |
| 7171267 | Reforming wet-tantalum capacitors in implantable defibrillators and other medical devices Miniature defibrillators and cardioverters detect abnormal heart rhythms and automatically apply electrical therapy to restore normal heart function. Critical components in these devices are aluminum electrolytic capacitors, which store and deliver one or more life-... | 01/30/2007 |
| 7147766 | Chip interconnect and packaging deposition methods and structures The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by select... | 12/12/2006 |
| 7146712 | Pattern forming method and method of making microdevice A metal film made of a metal material (e.g., NiFe, CoFeNi, or FeCo) including an iron atom is formed on a substrate (S101). Subsequently, the metal film formed on the substrate is plasma-processed in an environment including a gas (e.g., an oxygen gas having ... | 12/12/2006 |
| 7131988 | Reforming wet-tantalum capacitors in implantable medical devices Miniature defibrillators and cardioverters detect abnormal heart rhythms and automatically apply electrical therapy to restore normal heart function. Critical to this function, aluminum-electrolytic capacitors store and deliver life-saving bursts of electric charge ... | 11/07/2006 |
| 7074314 | Liquid repellent member, method for manufacturing liquid repellent member, ink jet head using liquid repellent member, method for manufacturing ink jet head and method for supplying ink The present invention provides a liquid repellent member applied to ink jet, comprising a carbon substrate, and a liquid repellent film formed on a surface of the carbon substrate and formed by bonding between carbon and fluorine. ... | 07/11/2006 |
| 7048841 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact a... | 05/23/2006 |
| 6986838 | Nanomachined and micromachined electrodes for electrochemical devices A nanomachined and micromachined electrode (10) is disclosed that is produced by providing a layer of aluminum (11) positioned upon a conductive substrate (12), anodizing the layer of aluminum to produce a layer of aluminum oxide (13) hav... | 01/17/2006 |
| 6967164 | Method for electroless plating a contact pad A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each ... | 11/22/2005 |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary meth... | 08/23/2005 |
| 6919013 | Apparatus and method for electrolytically depositing copper on a workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin see... | 07/19/2005 |
| 6890624 | Self-assembled structures A material includes a layer with a plurality of self-assembled structures comprising compositions. The structures are localized in separate islands covering a portion of the layer in an integrated assembly. In some embodiments, the compositions include nanoparticles... | 05/10/2005 |
| 6878260 | Process for forming a high-quality interface between a plated and a non-plated area A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. T... | 04/12/2005 |
| 6866764 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowi... | 03/15/2005 |
| 6849173 | Technique to enhance the yield of copper interconnections A method of forming an oxide free copper interconnect, comprising the following steps. A substrate is provided and a patterned dielectric layer is formed over the substrate. The patterned dielectric layer having an opening exposing a portion of the substrate. The op... | 02/01/2005 |
| 6825512 | Micromachined sensor with insulating protection of connections An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically connected to the pin ends by conductive elements. Then the wafer and the pin ... | 11/30/2004 |
| 6802952 | Method for surface treatment of metal base A method for surface treatment of a metal base includes the steps of: (a) anodizing the base to obtain a first layer of oxidation film on a surface of the base; (b) removing or covering a first area of the oxidation film; and (c) anodizing the base to obtain a secon... | 10/12/2004 |
| 6797145 | Current carrying structure using voltage switchable dielectric material An electrochemical processing method is provided for forming a current carrying device for semiconductor chip packaging and similar applications. The method comprises selecting sections of a substrate to carry current wherein a selected section is at least partly co... | 09/28/2004 |
| 6797144 | Method for reducing surface defects in an electrodeposition process A method for in-situ cleaning an electrodeposition surface following an electroplating process including providing a first electrode assembly and a second electrode assembly; applying a first current density across the first electrode assembly and the second electro... | 09/28/2004 |
| 6793795 | Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing integrated circuits. The method includes the steps of coating the surfa... | 09/21/2004 |
| 6790335 | Method of manufacturing decorative plate A method of manufacturing a decorative plate (1) includes the steps of: preparing a metal substrate and covering selected areas (11, 16) of the substrate with a protective film; anodizing the substrate; and removing the protective film to expose metall... | 09/14/2004 |
| 6755957 | Method of plating for filling via holes A method of plating for filling via holes, in which each via hole is formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate. A copper film is formed on the top surface of the insulation l... | 06/29/2004 |
| 6749737 | Method of fabricating inter-layer solid conductive rods A method of forming a solid inter-layer conductive rod. A printed circuit board comprising an insulating core layer, a first conductive layer and a second conductive layer is provided. The insulating core layer is sandwiched between the first conductive layer and th... | 06/15/2004 |
| 6740222 | Method of manufacturing a printed wiring board having a discontinuous plating layer The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may includ... | 05/25/2004 |
| 6736956 | Non-uniform etching of anode foil to produce higher capacitance gain without sacrificing foil strength The present invention is directed to a method of etching anode foil in a non-uniform manner which increases the overall capacitance gain of the foil while retaining foil strength. In particular, by using a mask to protect a mesh grid of the foil from further etching... | 05/18/2004 |
| 6726829 | Method of manufacturing a stent Disclosed herewithin is an apparatus for fabricating a stent which involves processing a tubular member whereby no connection points to join the edges of a flat pattern are necessary. The process includes the steps of: a) preparing the surface of a tubular member, b... | 04/27/2004 |
| 6706166 | Method for improving an electrodeposition process through use of a multi-electrode assembly A method for improving an electrodeposited metal film uniformity and preventing metal deposition and peeling of deposited metal from an electrode during an electrodeposition and electropolishing process including providing a first anode electrode assembly and a semi... | 03/16/2004 |
| 6652726 | Method for reducing wafer edge defects in an electrodeposition process A method for reducing or avoiding semiconductor wafer peripheral defects and contamination during and following electrodeposition including providing a wafer chuck assembly sealably attached to a back side of a semiconductor wafer leaving an exposed perip... | 11/25/2003 |
| 6638410 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ult... | 10/28/2003 |
| 6632345 | Apparatus and method for electrolytically depositing a metal on a workpiece In accordance with one embodiment of the invention, a process for applying a metal to a workpiece is set forth. The workpiece initially includes a seed layer deposited on at least a portion of a surface thereof that is generally unsuitable for bulk electr... | 10/14/2003 |
| 6630400 | Method for electroless plating a contact pad A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartm... | 10/07/2003 |
| 6607792 | Method for making safety labels The invention concerns a method for making safety labels which consists in producing a base deposit on the film (100), then in defining a label shape (101). It further consists in producing (102) a printed window preferably by photogravure with cells bord... | 08/19/2003 |
| 6589629 | Process for fabricating patterned, functionalized particles and article formed from particles A technique for forming functionalized particles, where such particles are readily formed into periodic structures. A layer of particles is formed on a substrate, a first material is deposited over at least a portion of each of the particles, and then a f... | 07/08/2003 |
