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| Number | Title | Issue Date |
| 7351315 | Chambers, systems, and methods for electrochemically processing microfeature workpieces Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first proces... | 04/01/2008 |
| 7351314 | Chambers, systems, and methods for electrochemically processing microfeature workpieces Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first proces... | 04/01/2008 |
| 7341946 | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate d... | 03/11/2008 |
| 7341945 | Method of fabricating semiconductor device A method of fabricating a semiconductor device prevents agglomeration of a seed metal layer in a recess. A recess is formed in a dielectric layer formed on or over a wafer. A seed metal layer (e.g., Cu or Cu alloy) is then formed on a bottom face and an inner side f... | 03/11/2008 |
| 7319920 | Method and apparatus for self-calibration of a substrate handling robot A substrate-handling robot which serves a processing tool such as a plating tool may be automatically controlled by a controller to perform a self-calibration procedure. As part of the procedure, an end effector of the robot is moved to interact with sensors provide... | 01/15/2008 |
| 7316783 | Method of wiring formation and method for manufacturing electronic components A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the platin... | 01/08/2008 |
| 7253108 | Process for forming a thin film of TiSiN, in particular for phase change memory devices The process for forming a film of TiSiN includes the following sequence of steps: deposition of a TiN film at medium temperature, for example, 300-450° C., by thermal decomposition of a metallorganic precursor, for example TDMAT (Tetrakis Dimethylamino Titanium); e... | 08/07/2007 |
| 7235487 | Metal seed layer deposition A method and structure for reducing the corrosion of the copper seed layer during the fabrication process of a semiconductor structure. Before the structure (or the wafer containing the structure) exits the vacuum environment of the sputter tool, the structure is wa... | 06/26/2007 |
| 7214305 | Method of manufacturing electronic device Disclosed is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed, and applying a... | 05/08/2007 |
| 7211333 | Resin forming mold and production method for the resin forming mold The present invention is to provide a resin-forming mold having high releasability and permitting a production without increasing production costs. The resin-forming mold can be used to produce a resin-molded product having minute uneven portions on a front face the... | 05/01/2007 |
| 7189146 | Method for reduction of defects in wet processed layers The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition ... | 03/13/2007 |
| 7150819 | Structure and plating method of thin film magnetic head and magnetic storage apparatus A material for magnetic pole for attaining a writing head generating an intense recording magnetic field, and a structure and a manufacturing method therefor. The thin film magnetic head includes a magnetic pole layer having a plated magnetic layer containing Co, Ni... | 12/19/2006 |
| 7137596 | Aircraft surface ice inhibitor A surface treatment 10 for application to an aircraft wing surface 12 is provided, including at least one reflective metallic film 22 bonded at least one hollow cell structure 24 to provide a thermal barrier that inhibits non-environmenta... | 11/21/2006 |
| 7102235 | Conformal lining layers for damascene metallization Method and structures are provided for conformal lining of dual damascene structures in integrated circuits. Trenches and contact vias are formed in insulating layers. The trenches and vias are exposed to alternating chemistries to form monolayers of a desired linin... | 09/05/2006 |
| 7014887 | Sequential sputter and reactive precleans of vias and contacts The present invention generally provides a method for improving fill and electrical performance of metals deposited on patterned dielectric layers. Apertures such as vias and trenches in the patterned dielectric layer are etched to enhance filling and then cleaned i... | 03/21/2006 |
| 6974771 | Methods and apparatus for forming barrier layers in high aspect ratio vias In a first aspect, a method is provided that includes (1) forming a first barrier layer over the sidewalls and bottom of a via using atomic layer deposition within an atomic layer deposition (ALD) chamber; (2) removing at least a portion of the first barrier layer f... | 12/13/2005 |
| 6946065 | Process for electroplating metal into microscopic recessed features Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plat... | 09/20/2005 |
| 6903013 | Method to fill a trench and tunnel by using ALD seed layer and electroless plating An improved method to deposit, by atomic layer deposition, ALD, a copper barrier and seed layer for electroless copper plating, filling trench and channel or tunnel openings in a damascene process, for the fabrication of interconnects and inductors, has been develop... | 06/07/2005 |
| 6899796 | Partially filling copper seed layer A two-step method of filling copper into a high-aspect ratio via or dual-damascene structure. The first step sputters at a low temperature of no more than 100° C. and with at least portions of high wafer bias, thereby filling a lower half of the hole. The initial c... | 05/31/2005 |
| 6893550 | Electroplating bath composition and method of using The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconduc... | 05/17/2005 |
| 6893541 | Multi-step process for depositing copper seed layer in a via A DC magnetron sputter reactor for sputtering copper, its method of use, and shields and other parts promoting self-ionized plasma (SIP) sputtering, preferably at pressures below 5 milliTorr, preferably below 1 milliTorr. Also, a method of coating copper into a narr... | 05/17/2005 |
| 6872295 | Method for preparing an electroplating bath and related copper plating process The present invention is related to a method for the preparation of a composition for electroplating a copper-containing layer on a substrate. This method makes use of an aqueous solution that has at least: a source of copper Cu(II) ions, an additive to adjust the p... | 03/29/2005 |
| 6855376 | Process of direct growth of carbon nanotubes on a substrate at low temperature Carbon nanotubes are directly grown on a substrate surface having three metal layers thereon by a thermal chemical vapor deposition at low-temperature, which can be used as an electron emission source for field emission displays. The three layers include a layer of ... | 02/15/2005 |
| 6811670 | Method for forming cathode contact areas for an electroplating process A method for forming electroplating cathode contacts around the periphery of a semiconductor wafer including forming an insulating layer over a conductive layer extending at least around the periphery of a semiconductor wafer substrate; etching a plurality of openin... | 11/02/2004 |
| 6808641 | Method of wiring formation and method for manufacturing electronic components A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the platin... | 10/26/2004 |
| 6793796 | Electroplating process for avoiding defects in metal features of integrated circuit devices Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density applied to a substrate, avoid defects in plated films on substrates ha... | 09/21/2004 |
| 6773572 | Method of metal layer formation and metal foil-based layered product A method of metal layer formation which can satisfactorily eliminate the problems caused by plating solution infiltration and is sufficiently effective in reducing the permittivity of an insulating layer; and a metal foil-based layered product obtainable by the meth... | 08/10/2004 |
| 6767589 | Method for metal coating a flywheel rim A composite flywheel rotor includes an annular rim mounted on a hub for high speed rotation in an evacuated flywheel enclosure. A smooth epoxy layer is applied to the rim and is cleaned or maintained clean in preparation for a metal coating on the rim. The rim may b... | 07/27/2004 |
| 6689413 | Using plated surface for recording media without polishing Ultra smooth as-deposited composite nickel coatings for use in an information storage system are provided. The composite nickel coatings include an electrolessly deposited nickel layer formed on a sputter deposited nickel layer. The composite nickel coati... | 02/10/2004 |
| 6613603 | Photovoltaic device, process for production thereof, and zinc oxide thin film A photovoltaic device is provided which comprises a back reflection layer, a zinc oxide layer and a semiconductor layer stacked in this order on a substrate, wherein the zinc oxide layer contains a carbohydrate. The content of the carbohydrate is preferab... | 09/02/2003 |
| 6610191 | Electro deposition chemistry The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed ... | 08/26/2003 |
| 6562715 | Barrier layer structure for copper metallization and method of forming the structure A barrier layer structure and a method of forming the structure. The barrier layer structure comprises a bilayer, with a first layer formed by chemical vapor deposition and a second layer formed by physical vapor deposition. The first barrier layer compri... | 05/13/2003 |
| 6562219 | Method for the formation of copper wiring films A method for the formation of copper wiring films includes the steps of forming a first copper film by a CVD method on a diffusion barrier film, which diffusion barrier film has been formed on a semiconductor substrate and in which a concavity has been es... | 05/13/2003 |
| 6506293 | Process for the application of a metal film on a polymer surface of a subject A process for the application of a metal film on a polymer surface of a subject, to which, after nucleation with a catalytically active platinum metal and/or a platinum metal compound, a coating metal is precipitated autocatalytically from an aqueous solu... | 01/14/2003 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features One aspect of the invention provides a consistent metal electroplating technique to form void-less metal interconnects in sub-micron high aspect ratio features on semiconductor substrates. One embodiment of the invention provides a method for filling sub-... | 08/20/2002 |
| 6428673 | Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpie... | 08/06/2002 |
| 6423201 | Method of improving the adhesion of copper The present invention provides a method of improving the adhesion of a copper layer to a barrier layer on a substrate. After deposition of a barrier layer, such as TiN, an amorphous silicon layer is deposited by striking a plasma over the substrate using ... | 07/23/2002 |
| 6395164 | Copper seed layer repair technique using electroless touch-up An electroless touch-up process for repairing copper metallization deposited in dual damascene structures with high aspect ratios. An initial copper strike layer is produced by directional deposition techniques such that discontinuous sidewall coverage oc... | 05/28/2002 |
| 6387305 | Forming mold cavities A method for producing a multiplicity of miniature cavities extending from a mold surface for molding a plastic product having features integrally molded with and extending from a product base, and a mold so produced. The mold cavities are formed by depos... | 05/14/2002 |
| 6365029 | Manufacturing method for a thin film magnetic head having fine crystal grain coil A thin film magnetic head comprising a lower magnetic core, an upper magnetic core, and a thin film copper coil wound between magnetic poles of the lower and upper magnetic cores, the time constant of which can be reduced by reducing the specific resistan... | 04/02/2002 |
