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| Number | Title | Issue Date |
| 8092667 | Electroplating method for depositing continuous thin layers of indium or gallium rich materials An electrochemical deposition method to form uniform and continuous Group IIIA material rich thin films with repeatability is provided. Such thin films are used in fabrication of semiconductor and electronic devices such as thin film solar cells. In one embodiment, ... | 01/10/2012 |
| 7449100 | Method for forming electroplating film on surfaces of articles An object of the present invention is to provide a method for forming a uniform and dense electroplating film with high adhesion strength on the surface of an article, yet irrespective of the surface material and the surface properties of the article. A means for a ... | 11/11/2008 |
| 7425257 | Method for the formation of a good contact surface on a cathode support bar and support bar The disclosure relates to a method of obtaining a good current contact on the support bar of a cathode used in electrolysis. In this method a highly electroconductive layer is formed on the contact piece on the end of the support bar of the cathode, especially at th... | 09/16/2008 |
| 7393473 | Method for producing a composite plated product There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a large content of carbon and a large quantity of carbon particles on t... | 07/01/2008 |
| 7303989 | Using zeolites to improve the mechanical strength of low-k interlayer dielectrics A method for impregnating the pores of a zeolite low-k dielectric layer with a polymer, and forming an interconnect structure therein, thus mechanically strengthening the dielectric layer and preventing metal deposits within the pores. ... | 12/04/2007 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7294574 | Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement An integrated sputtering method and reactor for copper or aluminum seed layers in which a plasma sputter reactor initially deposits a thin conformal layer onto a substrate including a high-aspect ratio hole subject to the formation of overhangs. After the seed depos... | 11/13/2007 |
| 7288309 | Microstructured substrates with profile-preserving organometallic coatings A method of making a polymer coating on a microstructured substrate. The method may be performed by vaporizing a liquid monomer or other pre-polymer composition and condensing the vaporized material onto a microstructured substrate, followed by curing. The resulting... | 10/30/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7270732 | Method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the ster... | 09/18/2007 |
| 7267757 | Magnetic head utilizing a CoNiFe alloy with 60-80 weight percent Fe and method for production therefor At least one of lower and upper magnetic cores is composed of magnetic films each of which contains two or more elements of Co, Ni, and Fe, which are formed by electroplating in a plating bath with pH 2 or less, and which have a saturation magnetic flux density of 2... | 09/11/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7217353 | Method and apparatus for plating substrate After bubbles adsorbed to a substrate are removed by rotating the substrate in a plating solution at a higher speed or after the wettability of the surface of the substrate to be plated is improved before the substrate is immersed in the plating solution, the substr... | 05/15/2007 |
| 7208197 | Method of depositing copper on a support A process for the deposition of copper on a support. The process includes bringing a copper precursor, in the vapor phase, into contact with a heated support, optionally in the presence of hydrogen. The copper precursor is in the form of a CuCl or CuBr composition i... | 04/24/2007 |
| 7195854 | Photoresist composition The present invention provides a photoresist composition and more particularly, a photoresist composition comprising a) a novolak resin, b) a diazide compound, and c) a solvent containing propylene glycol methyl ether acetate (PGMEA) and 2,2,4-triemthyl-1,3-penthane... | 03/27/2007 |
| 7179360 | Soft magnetic film having improved saturated magnetic flux density, magnetic head using the same, and manufacturing method therefore A lower magnetic pole layer and/or an upper magnetic pole layer are formed of a CoFeα alloy in which the component ratio X of Co is 8 to 48 mass %, the component ratio Y of Fe is 50 to 90 mass %, the component ratio Z of the element α (the element α is at least o... | 02/20/2007 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface in... | 08/29/2006 |
| 7091611 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 08/15/2006 |
| 7061115 | Interconnect line selectively isolated from an underlying contact plug The present invention relates to selectively electrically connecting an electrical interconnect line, such as a bit line of a memory cell, with an associated contact stud and electrically isolating the interconnect line from other partially underlying contact studs ... | 06/13/2006 |
| 7008522 | Method of locally repairing parts covered with a thermal barrier A method of locally repairing parts coated with a thermal barrier including a ceramic outer layer and a metal underlayer of alumina-forming alloy for protecting the substrate against oxidation and for bonding with the ceramic outer layer, includes: defining the zone... | 03/07/2006 |
| 6997787 | Process for copper free chrome plating of a vehicle wheel surface A cutting tool having a hard tip is pressed with a uniform pressure against a surface of a vehicle wheel as the wheel is rotated to smooth and seal the surface. The smoothed and sealed wheel surface is then chrome plated with a process that includes applying a nicke... | 02/14/2006 |
| 6998222 | Producing an electrically-conductive structure on a non-planar surface A method for producing an electrically conductive structure on a non-planar surface includes depositing a photosensitive resist coating onto the non-planar surface, exposing the photosensitive resist coating, removing a portion of the photosensitive resist coating, ... | 02/14/2006 |
| 6995470 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 02/07/2006 |
| 6974531 | Method for electroplating on resistive substrates A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the current or voltage as a function of the area of plated metal. A stru... | 12/13/2005 |
| 6949832 | Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereof An interconnect trench is formed on a dielectric layer 12 and a first HSQ layer 14 formed on a semiconductor substrate, and a tantalum family barrier metal layer 24a is formed all over the substrate. Then a seed copper-containing metal la... | 09/27/2005 |
| 6863795 | Multi-step method for metal deposition The invention is related to a method of plating of a metal layer on a substrate. The method is particularly preferred for the formation of metallization structures for integrated circuits. ... | 03/08/2005 |
| 6846401 | Method of plating and pretreating aluminium workpieces A method for applying a metal layer onto at least one surface of an aluminium or aluminium alloy workpiece, including the steps of pretreating the surface and applying the metal layer by plating, wherein the pretreating step includes a non-electrolytic treatment by ... | 01/25/2005 |
| 6827834 | Non-cyanide copper plating process for zinc and zinc alloys The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article is first immersed in an aqueous nickel pyrophosphate solution and is ... | 12/07/2004 |
| 6824666 | Electroless deposition method over sub-micron apertures An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/30/2004 |
| 6802985 | Method for fabricating metal wirings There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film ... | 10/12/2004 |
| 6797142 | Tin plating Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating. ... | 09/28/2004 |
| 6755958 | Barrier layer for electrical connectors and methods of applying the layer A cooper or copper alloy electrical contact member is treated by electroplating a barrier layer on a contact surface of the member, the barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, and the barrier layer is selected from the ... | 06/29/2004 |
| 6695960 | Method for producing a metal alloy powder such as MCRALY and coatings obtained with same The invention concerns a method comprising a step which consists in producing, on a precursor alloy powder containing at least the elements Cr, Al and Y, using a chemical or electrolytic deposition bath, a deposition containing at least a modifying elemen... | 02/24/2004 |
| 6664633 | Alkaline copper plating A method for depositing a metal conduction layer in a feature of a substrate is provided. The method includes forming the feature in the substrate, the feature having a width dimension of less than about a tenth of a micron. A barrier layer is deposited o... | 12/16/2003 |
| 6660154 | Seed layer Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.... | 12/09/2003 |
| 6652914 | Method for selective surface protection of a gas turbine blade which has previously been in service A gas turbine blade which has previously been in service is protected by cleaning the gas turbine blade, and then first depositing a platinum first layer on the airfoil and the platform of the gas turbine blade. Thereafter, a platinum second layer is depo... | 11/25/2003 |
| 6613603 | Photovoltaic device, process for production thereof, and zinc oxide thin film A photovoltaic device is provided which comprises a back reflection layer, a zinc oxide layer and a semiconductor layer stacked in this order on a substrate, wherein the zinc oxide layer contains a carbohydrate. The content of the carbohydrate is preferab... | 09/02/2003 |
| 6610419 | Product with an anticorrosion protective layer and a method for producing an anticorrosion protective Product having a layer which protects against corrosion, and process for producing a layer which protects against corrosion. The invention relates to a product (1), in particular a gas-turbine blade (1), having a metallic basic body (2) to which a protect... | 08/26/2003 |
| 6607787 | Process for producing a coating on a refractory structural member A process for producing a coating on a refractory structural member, in which a noble metal alloy is applied as a coating material to the refractory structural member. The noble metal alloy contains, among other constituents, an oxidizable substance, whic... | 08/19/2003 |
