Bizarre Patents
Decorative Jeweled Wheel Cover
An improved wheel is provided wherein decorative items such as gem stones are embedded in either the wheel surface, a special mounting section attached to the wheel surface, or to a spoke strap that wraps around each spoke and positions embedded gem stones on the outside surface of the spoke.
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| Number | Title | Issue Date |
| 7833403 | Plating, chemical plating technique using partial chemical oxidation for aluminum or aluminum copper radiator This invention involves the technological field of electroplating, chemical plating, specially involves a method for partially plating aluminum and aluminum copper radiators. A radiator is conducted partial chemical oxidation and enclosure before undergoing galvaniz... | 11/16/2010 |
| 7407689 | Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of t... | 08/05/2008 |
| 7384532 | Platable coating and plating process A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of ... | 06/10/2008 |
| 7319920 | Method and apparatus for self-calibration of a substrate handling robot A substrate-handling robot which serves a processing tool such as a plating tool may be automatically controlled by a controller to perform a self-calibration procedure. As part of the procedure, an end effector of the robot is moved to interact with sensors provide... | 01/15/2008 |
| 7229502 | Method of forming a silicon nitride layer A method of forming a silicon nitride layer is provided. A deposition furnace having an outer tube, a wafer boat, a gas injector and a uniform gas injection apparatus is provided. The wafer boat is positioned within the outer tube for carrying a plurality of wafers.... | 06/12/2007 |
| 7229923 | Multi-step process for forming a barrier film for use in copper layer formation Methods for forming robust copper structures include steps for providing a substrate with an insulating layer with openings formed therein. At least two barrier layers are then formed followed by the deposition of a copper seed layer which is annealed. Bulk copper d... | 06/12/2007 |
| 7226531 | Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanot... | 06/05/2007 |
| 7214305 | Method of manufacturing electronic device Disclosed is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed, and applying a... | 05/08/2007 |
| 7192654 | Multilayered construction for resistor and capacitor formation The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first el... | 03/20/2007 |
| 7186923 | Printed wiring boards and methods for making them A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conduct... | 03/06/2007 |
| 7175920 | Copper foil for high-density ultra-fine printed wiring board The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electr... | 02/13/2007 |
| 7160105 | Temperature controlled vacuum chuck A temperature controllable vacuum chuck includes a mounting bracket, a porous plate, a heating element, and a temperature sensor. The porous plate is mounted to the mounting bracket and is configured for securing a substrate to the vacuum chuck when air is suctioned... | 01/09/2007 |
| 7114251 | Method of producing of circuit board; for semiconductor device A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a substrate; forming a plating power supply layer on the one surface of t... | 10/03/2006 |
| 7049007 | Composite foil and its manufacturing process A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group includin... | 05/23/2006 |
| 7005192 | Ceramic electronic component and method of producing the same A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains... | 02/28/2006 |
| 6997787 | Process for copper free chrome plating of a vehicle wheel surface A cutting tool having a hard tip is pressed with a uniform pressure against a surface of a vehicle wheel as the wheel is rotated to smooth and seal the surface. The smoothed and sealed wheel surface is then chrome plated with a process that includes applying a nicke... | 02/14/2006 |
| 6971681 | Threaded pipe with surface treatment A threaded metallic pipe for oil extraction industry has a threaded end portion with treated surface in which the metal surface has a roughness (Ra) comprised of 2.0 μm and 6.0 μm, which is covered by a uniform layer (7) of a dry corrosion inhibiting coatin... | 12/06/2005 |
| 6972082 | Method for the selectively electroplating a strip-shaped, metal support material A method for the continuous selective electroplating of a metallic substrate material (10) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrat... | 12/06/2005 |
| 6953742 | Tantalum barrier layer for copper metallization A method of forming barrier layers in a via hole extending through an inter-level dielectric layer and including a preformed first barrier coated onto the bottom and sidewalls of the via holes. In a single plasma sputter reactor, a first step sputters the wafer rath... | 10/11/2005 |
| 6919544 | Method to improve the life span of a heating element of a molybdenium disilicide at lower temperatures A method of increasing the length of life of heating elements that consist essentially of molybdenum-silicide, and alloys thereof, when the elements are operated at a low temperature, such as at a temperature ranging from 400-600° C. The heating element material co... | 07/19/2005 |
| 6872295 | Method for preparing an electroplating bath and related copper plating process The present invention is related to a method for the preparation of a composition for electroplating a copper-containing layer on a substrate. This method makes use of an aqueous solution that has at least: a source of copper Cu(II) ions, an additive to adjust the p... | 03/29/2005 |
| 6866764 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowi... | 03/15/2005 |
| 6855376 | Process of direct growth of carbon nanotubes on a substrate at low temperature Carbon nanotubes are directly grown on a substrate surface having three metal layers thereon by a thermal chemical vapor deposition at low-temperature, which can be used as an electron emission source for field emission displays. The three layers include a layer of ... | 02/15/2005 |
| 6824666 | Electroless deposition method over sub-micron apertures An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/30/2004 |
| 6808813 | Ceramic electronic device and method of manufacturing the device A ceramic electronic device is protected at the surface from retention of water, thus having improved operation reliability, and a method of manufacturing the device is provided. A protective layer is formed on the ceramic element and external electrodes by dehydrat... | 10/26/2004 |
| 6802985 | Method for fabricating metal wirings There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film ... | 10/12/2004 |
| 6773572 | Method of metal layer formation and metal foil-based layered product A method of metal layer formation which can satisfactorily eliminate the problems caused by plating solution infiltration and is sufficiently effective in reducing the permittivity of an insulating layer; and a metal foil-based layered product obtainable by the meth... | 08/10/2004 |
| 6755958 | Barrier layer for electrical connectors and methods of applying the layer A cooper or copper alloy electrical contact member is treated by electroplating a barrier layer on a contact surface of the member, the barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, and the barrier layer is selected from the ... | 06/29/2004 |
| 6755957 | Method of plating for filling via holes A method of plating for filling via holes, in which each via hole is formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate. A copper film is formed on the top surface of the insulation l... | 06/29/2004 |
| 6740222 | Method of manufacturing a printed wiring board having a discontinuous plating layer The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may includ... | 05/25/2004 |
| 6680092 | Coating method and products obtained by same The invention concerns a method for producing high resolution patterns on a support comprising the following steps: high resolution printing of a varnish on the support; treating the support by electrolysis; washing and drying the support.... | 01/20/2004 |
| 6660154 | Seed layer Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.... | 12/09/2003 |
| 6613603 | Photovoltaic device, process for production thereof, and zinc oxide thin film A photovoltaic device is provided which comprises a back reflection layer, a zinc oxide layer and a semiconductor layer stacked in this order on a substrate, wherein the zinc oxide layer contains a carbohydrate. The content of the carbohydrate is preferab... | 09/02/2003 |
| 6555209 | Method of manufacturing multilayer wiring board A method of manufacturing a multilayer wiring board comprising a step of forming an upper wiring layer (27), a part thereof being electrically connected to a pillar-shaped metallic body (24a), after he pillar-shaped metal body (24a) is formed on a lower w... | 04/29/2003 |
| 6546751 | Articles with selectively deposited overlay A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of heat fusible material, such as glass or plastic, with a metal having a particle size l... | 04/15/2003 |
| 6530141 | Method of forming thin film magnetic recording head with narrow track width performing high density recording at high driving frequency A method of forming a thin film magnetic head, including forming a first magnetic layer, forming a second magnetic layer as a magnetic flux passage in combination with the first magnetic layer, and forming a laminate structure body between the first magne... | 03/11/2003 |
| 6517894 | Method for plating a first layer on a substrate and a second layer on the first layer A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a... | 02/11/2003 |
| 6471879 | Buffer layer in flat panel display In devices such as flat panel displays, an aluminum oxide layer is provided between an aluminum layer and an ITO layer when such materials would otherwise be in contact to protect the ITO from optical and electrical defects sustained, for instance, during... | 10/29/2002 |
| 6423200 | Copper interconnect seed layer treatment methods and apparatuses for treating the same A method for making semiconductor interconnect features in a dielectric layer is provided. The method includes depositing a copper seed layer over a barrier layer that is formed over the dielectric layer and into etched features of the dielectric layer. T... | 07/23/2002 |
| 6395161 | Gas sensor and corresponding production method A gas sensor and a method for its manufacture are described. The gas sensor has a solid electrolyte having at least one measuring electrode and one porous protective coating. The measuring electrode has an electrically conductive base layer and a further ... | 05/28/2002 |
