Bizarre Patents
Method and apparatus for making a drink hop along a bar or counter
A method for generating a drink which appears to hop from a remote spot on the bar or counter and take one or more leaps, before landing in a patron's glass.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7368047 | Method of preparing copper plating layer having high adhesion to magnesium alloy using electroplating Disclosed is a method of preparing a copper electroplating layer having high adhesion to a magnesium alloy, which is advantageous because the usability of the magnesium alloy, having the highest specific strength among actually usable metals, can be increased throug... | 05/06/2008 |
| 7341948 | Method of making a semiconductor structure with a plating enhancement layer Disclosed is a method of making a semiconductor structure, wherein the method includes forming an interlayer dielectric (ILD) layer on a semiconductor layer, forming a conductive plating enhancement layer (PEL) on the ILD, patterning the ILD and PEL, depositing a se... | 03/11/2008 |
| 7303663 | Multistep release method for electrochemically fabricated structures Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surro... | 12/04/2007 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7276442 | Method for forming a metallization layer A method for depositing metal on a semiconductor device having a substrate, an exposed first surface, and an exposed second surface is provided. Metal ions are deposited on the exposed first surface and on the exposed second layer by applying a first voltage between... | 10/02/2007 |
| 7268075 | Method to reduce the copper line roughness for increased electrical conductivity of narrow interconnects (<100nm) Embodiments of the present invention provide methods to reduce the copper line roughness for increased electrical conductivity in narrow interconnects having a width of less than 100 nm. These methods reduce the copper line roughness by first smoothing the surface o... | 09/11/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7252861 | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to ... | 08/07/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7198705 | Plating-rinse-plating process for fabricating copper interconnects An improved copper ECD process. After the copper seed layer (116) is formed, a first portion of copper film (118) is plated onto the surface of the seed layer (116). The surface of the first portion of the copper film (118) is then rinsed... | 04/03/2007 |
| 7189317 | Semiconductor manufacturing system for forming metallization layer A method for forming a metallization layer. A first layer is formed outwardly from a semiconductor substrate. Contact vias are formed through the first layer to the semiconductor substrate. A second layer is formed outwardly from the first layer. Portions of the sec... | 03/13/2007 |
| 7135404 | Method for applying metal features onto barrier layers using electrochemical deposition The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable mean... | 11/14/2006 |
| 7127806 | Method for marking coaxial cable jumper assembly including plated outer assembly A jumper coaxial cable assembly includes a jumper coaxial cable and at least one solder-type connector secured thereto. The cable may include an outer conductor, which, in turn, includes aluminum with a tin layer thereon. The tin layer permits an aluminum outer cond... | 10/31/2006 |
| 7122387 | Deposition stop time detection apparatus and methods for fabricating copper wiring using the same A method for fabricating copper wiring of a semiconductor device comprises forming a deposition stop time detection pattern having two trench structures positioned with a predetermined distance from each other on a dielectric substrate; positioning a deposition stop... | 10/17/2006 |
| 7115196 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-th... | 10/03/2006 |
| 7049007 | Composite foil and its manufacturing process A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group includin... | 05/23/2006 |
| 7048840 | Method for metal coating the surface of high temperature superconductors The invention relates to a method for metal coating the surface of high temperature superconductors with a copper-oxygen base structure. The aim of the invention is to achieve a method as above, which requires a low production complexity, serves for the production o... | 05/23/2006 |
| 7025638 | Overmolded Electrical connector An electrical connector including an electrical contact and an overmolded housing. The electrical contact includes an electrically conductive substrate of an alloy material and at least one sealing coating on a first section of the substrate. The sealing coating inc... | 04/11/2006 |
| 6966800 | Overmolded electrical connector An electrical connector including an electrical contact and an overmolded housing. The electrical contact includes an electrically conductive substrate of an alloy material and at least one sealing coating on a first section of the substrate. The sealing coating inc... | 11/22/2005 |
| 6942781 | Method for electroplating a strip of foam A method for electroplating a strip of foam having two opposite sides and an electrically conductive surface, including: (a) continuously applying the strip of foam onto a moving cathode immersed in an electroplating bath so that the strip travels through the... | 09/13/2005 |
| 6939621 | Plated copper alloy material and process for production thereof A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness ... | 09/06/2005 |
| 6919013 | Apparatus and method for electrolytically depositing copper on a workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin see... | 07/19/2005 |
| 6913680 | Method of application of electrical biasing to enhance metal deposition A method and associated apparatus includes depositing metal on a plating surface of an object immersed in an electrolyte solution prior to bulk deposition on the plating surface. In one aspect, the method further includes applying a voltage between an anode and the ... | 07/05/2005 |
| 6872295 | Method for preparing an electroplating bath and related copper plating process The present invention is related to a method for the preparation of a composition for electroplating a copper-containing layer on a substrate. This method makes use of an aqueous solution that has at least: a source of copper Cu(II) ions, an additive to adjust the p... | 03/29/2005 |
| 6866765 | Electrolytic copper-plated R-T-B magnet and plating method thereof An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction... | 03/15/2005 |
| 6863991 | Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (... | 03/08/2005 |
| 6863795 | Multi-step method for metal deposition The invention is related to a method of plating of a metal layer on a substrate. The method is particularly preferred for the formation of metallization structures for integrated circuits. ... | 03/08/2005 |
| 6846401 | Method of plating and pretreating aluminium workpieces A method for applying a metal layer onto at least one surface of an aluminium or aluminium alloy workpiece, including the steps of pretreating the surface and applying the metal layer by plating, wherein the pretreating step includes a non-electrolytic treatment by ... | 01/25/2005 |
| 6811670 | Method for forming cathode contact areas for an electroplating process A method for forming electroplating cathode contacts around the periphery of a semiconductor wafer including forming an insulating layer over a conductive layer extending at least around the periphery of a semiconductor wafer substrate; etching a plurality of openin... | 11/02/2004 |
| 6797405 | Method for uniform electrochemical reduction of apertures to micron and submicron dimensions using commercial biperiodic metallic mesh arrays and devices derived therefrom A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting... | 09/28/2004 |
| 6777108 | Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface la... | 08/17/2004 |
| 6759142 | Plated copper alloy material and process for production thereof A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness ... | 07/06/2004 |
| 6755957 | Method of plating for filling via holes A method of plating for filling via holes, in which each via hole is formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate. A copper film is formed on the top surface of the insulation l... | 06/29/2004 |
| 6753254 | Method for forming a metallization layer A method for forming a metallization layer. A first layer is formed outwardly from a semiconductor substrate. Contact vias are formed through the first layer to the semiconductor substrate. A second layer is formed outwardly from the first layer. Portions of the sec... | 06/22/2004 |
| 6746589 | Plating method and plating apparatus The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with use of a plating liquid having high throwing power and leveling properties, and which can make film thickness of a ... | 06/08/2004 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer A flip-chip bumping method is proposed for the fabrication of solder bumps on a semiconductor wafer for flip-chip application. The proposed flip-chip bumping method is intended for use on a semiconductor wafer predefined with a plurality of chip regions w... | 02/17/2004 |
| 6689268 | Copper foil composite including a release layer A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel ... | 02/10/2004 |
