Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 8147671 | Electroplating method and electroplated product A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a secon... | 04/03/2012 |
| 7985329 | Technique for electrochemically depositing an alloy having a chemical order By providing two or more consumable electrodes within a single reactor vessel, an alloy having a high degree of chemical ordering may be deposited in situ in that the current flows of the individual consumable electrodes are controlled to obtain a substantially laye... | 07/26/2011 |
| 7425255 | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition Bipolar wave current, with both positive and negative current portions, is used to electrodeposit a nanocrystalline grain size deposit. Polarity Ratio is the ratio of the absolute value of the time integrated amplitude of negative polarity current and positive polar... | 09/16/2008 |
| 7368046 | Layered composite material for plain bearings, production and use thereof The invention is a method for the production of a composite multilayer material having a backing layer, a bearing metal layer of a copper alloy or an aluminum alloy, a nickel intermediate layer and an overlay consisting of about 0-20 wt. % copper and about 0-20 wt. ... | 05/06/2008 |
| 7309412 | Compositions and coatings including quasicrystals Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the compositions and coatings comprise particles of at least one quasicrys... | 12/18/2007 |
| 7253106 | Manufacturable CoWP metal cap process for copper interconnects A method to electrolessly plate a CoWP alloy on copper in a reproducible manner that is effective for a manufacturable process. In the method, a seed layer of palladium (Pd) is deposited on the copper by an aqueous seeding solution of palladium acetate, acetic acid ... | 08/07/2007 |
| 7222425 | Method of forming engine bearing A journal bearing has a lining of bearing metal applied to a steel backing. The surface of the lining is laser peen hardened to locally increase the hardness and the seizure resistance of the lining. The underlying core of the lining is unaffected and maintains good... | 05/29/2007 |
| 7172818 | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having de... | 02/06/2007 |
| 7115197 | Coating process This invention relates to a process for electroplating a selected surface area of a component with a crushable zinc alloy, the method comprising utilizing a relatively low current density in an alkaline solution during the electroplating process to provide a crushab... | 10/03/2006 |
| 7049007 | Composite foil and its manufacturing process A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group includin... | 05/23/2006 |
| 7045039 | Process for applying protective and decorative coating on an article A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to puls... | 05/16/2006 |
| 7037421 | Thin-film magnetic head having magnetic gap formed of NiP A gap layer of a thin-film magnetic head is formed of NiP. The P content of the NiP gap layer is controlled to be within the range of 11 mass percent to 14 mass percent so that the gap layer is nonmagnetic. ... | 05/02/2006 |
| 6998151 | Method for applying a NiAl based coating by an electroplating technique The present invention provides a method to coat an article using a plating process, either electroless or electrolytic, whereby nickel is plated on the article using a solution that includes a suspension of powders or containing one or more of the following elements... | 02/14/2006 |
| 6992389 | Barrier for interconnect and method A method of creating a multi-layered barrier for use in an interconnect, a barrier for an interconnect, and an interconnect including the barrier are disclosed. The method includes creating the multi-layered barrier in a recess of the device terminal by use of a sin... | 01/31/2006 |
| 6974767 | Chemical solution for electroplating a copper-zinc alloy thin film A method of fabricating a semiconductor device, having a Cu—Zn alloy thin film (30) formed on a Cu surface (20) by electroplating the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing... | 12/13/2005 |
| 6942781 | Method for electroplating a strip of foam A method for electroplating a strip of foam having two opposite sides and an electrically conductive surface, including: (a) continuously applying the strip of foam onto a moving cathode immersed in an electroplating bath so that the strip travels through the... | 09/13/2005 |
| 6939621 | Plated copper alloy material and process for production thereof A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness ... | 09/06/2005 |
| 6903005 | Method for the formation of RuSixOy-containing barrier layers for high-k dielectrics A method for use in the fabrication of integrated circuits is provided, which includes providing a substrate assembly having a surface. A diffusion barrier layer is formed over at least a portion of the surface. The diffusion barrier layer is formed of RuSix | 06/07/2005 |
| 6902827 | Process for the electrodeposition of low stress nickel-manganese alloys A process for electrodepositing a low stress nickel-manganese multilayer alloy on an electrically conductive substrate is provided. The process includes the steps of immersing the substrate in an electrodeposition solution containing a nickel salt and a manganese sa... | 06/07/2005 |
| 6867149 | Growth of multi-component alloy films with controlled graded chemical composition on sub-nanometer scale The chemical composition of thin films is modulated during their growth. A computer code has been developed to design specific processes for producing a desired chemical composition for various deposition geometries. Good agreement between theoretical and experiment... | 03/15/2005 |
| 6863795 | Multi-step method for metal deposition The invention is related to a method of plating of a metal layer on a substrate. The method is particularly preferred for the formation of metallization structures for integrated circuits. ... | 03/08/2005 |
| 6846401 | Method of plating and pretreating aluminium workpieces A method for applying a metal layer onto at least one surface of an aluminium or aluminium alloy workpiece, including the steps of pretreating the surface and applying the metal layer by plating, wherein the pretreating step includes a non-electrolytic treatment by ... | 01/25/2005 |
| 6814848 | Method for determining alloy phase in plating layer and method for evaluating sliding property of alloy galvanized steel plate A method for determining a quantity of each of alloy phases in the plating layer includes subjecting each alloy phase in the plating layer to constant potential electrolysis in each of a plurality of ranges of potentials obtained on the basis of the immersion potent... | 11/09/2004 |
| 6811672 | Method for forming plating film and electronic component having plating film formed theron by same method A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 11/02/2004 |
| 6797142 | Tin plating Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating. ... | 09/28/2004 |
| 6773828 | Surface preparation to eliminate whisker growth caused by plating process interruptions An electroplating process reduces the whisker formation rate that results from an interruption of the electroplating process for an alloy. The process forms a tin strike or a thin layer of a pure(>99.9%) metal on the alloy during an activation operation, so that an ... | 08/10/2004 |
| 6759142 | Plated copper alloy material and process for production thereof A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness ... | 07/06/2004 |
| 6755958 | Barrier layer for electrical connectors and methods of applying the layer A cooper or copper alloy electrical contact member is treated by electroplating a barrier layer on a contact surface of the member, the barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, and the barrier layer is selected from the ... | 06/29/2004 |
| 6695960 | Method for producing a metal alloy powder such as MCRALY and coatings obtained with same The invention concerns a method comprising a step which consists in producing, on a precursor alloy powder containing at least the elements Cr, Al and Y, using a chemical or electrolytic deposition bath, a deposition containing at least a modifying elemen... | 02/24/2004 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer A flip-chip bumping method is proposed for the fabrication of solder bumps on a semiconductor wafer for flip-chip application. The proposed flip-chip bumping method is intended for use on a semiconductor wafer predefined with a plurality of chip regions w... | 02/17/2004 |
| 6605369 | Surface-treated copper foil and method for producing the same The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substr... | 08/12/2003 |
| 6579568 | Copper foil for printed wiring board having excellent chemical resistance and heat resistance This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a sub... | 06/17/2003 |
| 6537438 | Method for protecting electrodes during electrolysis cell start-up The present invention is directed to methods for applying a protective layer (42) to the cathode (40) of an electrolysis cell (10), where the cell also contains inert anodes (50) and the protective layer (42) can comprise a plurality of layers (70, 72, 74... | 03/25/2003 |
| 6533915 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary a... | 03/18/2003 |
| 6531045 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatments, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternar... | 03/11/2003 |
| 6528185 | Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewelry, spectacle fra... | 03/04/2003 |
| 6528184 | Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings Techniques are provided for electrolessly depositing and electrodepositing a CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming gold layers on articles such as watch bracelets, watch cases, imitation jewellery, spe... | 03/04/2003 |
| 6503640 | Method of manufacturing an assembly of brazed dissimilar metal components Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of: (i) forming the components of which at least one is made from a multi-layered brazing sheet product, the multi-layered brazing sheet product compr... | 01/07/2003 |
| 6497806 | Method of producing a roughening-treated copper foil A method of producing a roughening-treated copper foil, comprising (A) a copper foil, (B) a composite metal layer, which is formed on a bonding surface of the copper foil and comprises (I) copper, (II) at least one metal selected from the group consisting... | 12/24/2002 |
| 6495022 | Method of producing copper foil for fine wiring A copper foil for fine wiring is produced by forming on a bonding surface of a copper foil a composite metal layer comprising (I) copper, (II) at least one of tungsten and molybdenum and (III) at least one of nickel, cobalt, iron and zinc by carrying out ... | 12/17/2002 |
