Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 8066863 | Electrodeposition technique and apparatus to form selenium containing layers A multi step process, which forms a Group VIA material layer, such as a selenium (Se) layer, having a thickness greater than 500 nanometers. The process includes electroplating a Se material layer, which has an amorphous micro-structure and which exhibits high elect... | 11/29/2011 |
| 7846317 | Processing a printed wiring board by single bath electrodeposition A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath conta... | 12/07/2010 |
| 7833401 | Electroplating an yttrium-containing coating on a chamber component A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can b... | 11/16/2010 |
| 7527721 | Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric Multi-layer structures are electrochemically formed on porous dielectric substrates. In some embodiments, the substrates have at least one surface which is infiltrated with a sacrificial conductive material, all pores (e.g. openings in between dielectric regions of ... | 05/05/2009 |
| 7479213 | Plating method and plating apparatus A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected b... | 01/20/2009 |
| 7422696 | Multicomponent nanorods Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of... | 09/09/2008 |
| RE40386 | Chrome plated parts and chrome plating method Using a chrome plating bath containing organic sulfonic acid, plating is conducted by application of a pulse current to thereby form a crack-free lower chrome layer on a steel substrate. The lower chrome layer has a compressive residual stress of 100 MPa or more and... | 06/17/2008 |
| 7374654 | Method of making an organic memory cell A method of making an organic memory cell which comprises two electrodes with a controllably conductive media between the two electrodes is disclosed. The present invention involves providing a dielectric layer having formed therein one or more first electrode pads;... | 05/20/2008 |
| 7351321 | Method for electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 04/01/2008 |
| 7341806 | Battery having carbon foam current collector A battery cell includes a negative current collector and at least one carbon foam positive current collector disposed within the cell such that the negative current collector at least partially surrounds the at least one carbon foam positive current collector. An in... | 03/11/2008 |
| 7339127 | Contact piece made of tungsten provided with a corrosion-resistant layer made of a base metal A contact piece is formed by a tungsten overlay soldered onto a support, wherein at least portions of the solder layer and optionally of the support are covered by a layer of a less noble metal than tungsten. The corrosion resistance of the tungsten overlay is consi... | 03/04/2008 |
| 7323148 | Hydrogen generator A hydrogen generator capable of operating in any orientation and having no moving parts includes a catalyst retaining structure. The catalyst retaining structure is disposed in a housing and serves to separate the housing into a fuel holding portion and a hydrogen c... | 01/29/2008 |
| 7318278 | Method of manufacture of a heart valve support frame Methods for forming a support frame for flexible leaflet heart valves from a starting blank include converting a two-dimensional starting blank into the three-dimensional support frame. The material may be superelastic, such as NITINOL, and the method may include be... | 01/15/2008 |
| 7312174 | Method for preparing highly loaded, highly dispersed platinum metal on a carbon substrate The invention is directed to a simple method for preparing highly dispersed, highly loaded platinum metal elements on various carbon substrates, including conductive carbon black, which is utilized in fuel cell electrodes. Utilizing carbon with a controlled point of... | 12/25/2007 |
| 7309412 | Compositions and coatings including quasicrystals Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the compositions and coatings comprise particles of at least one quasicrys... | 12/18/2007 |
| 7303663 | Multistep release method for electrochemically fabricated structures Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surro... | 12/04/2007 |
| 7297247 | Electroformed sputtering target A method of fabricating a sputtering target for sputter depositing material onto a substrate in a sputtering chamber is described. In one embodiment of the method, a preform having a surface is formed and a layer of sputtering material is electroplated onto the surf... | 11/20/2007 |
| 7291254 | Method for electrochemically forming structures including non-parallel mating of contact masks and substrates Treatment of substrates, formation of structures, and formation of multilayer structures using contact masks are disclosed where a non-parallel or non-simultaneous mating of various mask contact surfaces to a substrate surface occurs. Some embodiments involve bringi... | 11/06/2007 |
| 7270732 | Method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the ster... | 09/18/2007 |
| 7259640 | Miniature RF and microwave components and methods for fabricating such components RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, ant... | 08/21/2007 |
| 7252861 | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to ... | 08/07/2007 |
| 7229544 | Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obta... | 06/12/2007 |
| 7229545 | Process for the coating for metallic implant materials A biomimetically produced bone-analogous coating, comprising organic and inorganic main constituents, is suitable for coating metallic implant materials of any desired surfaces. The coating comprises a collagen matrix mineralized with calcium phosphate. ... | 06/12/2007 |
| 7227066 | Polycrystalline optoelectronic devices based on templating technique Methods for passivating crystalline grains in an active layer for an optoelectronic device and optoelectronic devices having active layers with passivated crystalline grains are disclosed. Crystalline grains of an active layer material and/or window layer material a... | 06/05/2007 |
| 7208074 | Substrate processing apparatus and substrate plating apparatus A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a s... | 04/24/2007 |
| 7198704 | Methods of reducing interlayer discontinuities in electrochemically fabricated three-dimensional structures Disclosed methods reduce the discontinuities between individual layers of a structure that are formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regio... | 04/03/2007 |
| 7179736 | Method for fabricating planar semiconductor wafers The present invention relates to a method of fabricating planar semiconductor wafers. The method comprises forming a dielectric layer on a semiconductor wafer surface, the semiconductor wafer surface having vias, trenches and planar regions. A barrier and seed metal... | 02/20/2007 |
| 7179361 | Method of forming a mass over a semiconductor substrate The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a si... | 02/20/2007 |
| 7179716 | Method of forming a metal-containing layer over selected regions of a semiconductor substrate The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a si... | 02/20/2007 |
| 7160429 | Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered struct... | 01/09/2007 |
| 7132158 | Support layer for thin copper foil A composite material useful for the manufacture of a circuit has a support layer, a metal foil layer having opposing first and second sides and a thickness of 15 microns or less and a release layer effective to facilitate separation of the metal foil layer from the ... | 11/07/2006 |
| 7115196 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-th... | 10/03/2006 |
| 7109118 | Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first mat... | 09/19/2006 |
| 7090939 | Forming a layer on a flow plate of a fuel cell stack A technique includes applying a charge to a flow plate of a fuel cell stack and depositing a material on at least a portion of the flow plate in response to the charge. In some embodiments of the invention, the technique may be applied to a fuel cell stack that incl... | 08/15/2006 |
| 7083827 | Nickel-base superalloy having an optimized platinum-aluminide coating A nickel-base superalloy substrate includes a surface region having an integrated aluminum content of from about 18 to about 24 percent by weight and an integrated platinum content of from about 18 to about 45 percent by weight, with the balance components of the su... | 08/01/2006 |
| 7049007 | Composite foil and its manufacturing process A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group includin... | 05/23/2006 |
| 7033703 | Composite material and current collector for battery A composite material including a first carbon foam structure including a network of pores and a second carbon foam structure including a network of pores. An intermediate bonding structure is disposed at least in part between the first and second carbon foam structu... | 04/25/2006 |
| 7030431 | Metal gate with composite film stack A novel metal gate structure includes a gate oxide layer formed on a surface of a silicon substrate, a doped silicon layer stacked on the gate oxide layer, a CVD ultra-thin titanium nitride film deposited on the doped silicon layer, a tungsten nitride layer stacked ... | 04/18/2006 |
| 7029566 | Process of forming HA/ZrOcomplex coating on Co—Cr—Mo alloy In a process of forming a HA/ZrO2 complex coating on a Co—Cr—Mo alloy substrate, the substrate is subjected to electrolytic deposition respectively in a ZrO(NO3)2 bath and a mixed solution of Ca(NO3)2.4H | 04/18/2006 |
| 7018548 | Conductive thin film pattern and method of forming the same, method of manufacturing thin film magnetic head, method of manufacturing thin film inductor, and method of manufacturing micro device A high-precision conductive thin film pattern having a high aspect ratio and a method of forming the same are provided. Further, a method of manufacturing a thin film magnetic head, a thin film inductor, and a micro device each including such a conductive thin film ... | 03/28/2006 |
