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| Number | Title | Issue Date |
| 8052858 | Pretreatment method for electroless plating material and method for producing member having plated coating A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistic... | 11/08/2011 |
| 7645370 | Plating resin molded article and process for producing the same The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below i... | 01/12/2010 |
| 7384532 | Platable coating and plating process A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of ... | 06/10/2008 |
| 7305761 | Method for manufacturing wiring substrate A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the gr... | 12/11/2007 |
| 7033641 | Gas separating unit and method for manufacturing the same A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable of separating a hydrogen gas (palladium alloy foil) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, ... | 04/25/2006 |
| 7001471 | Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 02/21/2006 |
| 6996425 | Cellular phone housing There is provided a cellular phone housing formed with a base made of a resin material by molding, wherein the base is coated with a metal multilayer including a lower metal layer formed on a surface of the base with metal plating and an upper metal layer formed on ... | 02/07/2006 |
| 6878260 | Process for forming a high-quality interface between a plated and a non-plated area A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. T... | 04/12/2005 |
| 6875471 | Metallization of polymer parts for painting The quality of painted surfaces of polymeric articles is improved by depositing a coating of a metal such as zinc or zinc alloy on the surface of the article to be painted. For example, zinc is electrodeposited on a conductive surface of the article. The metal coate... | 04/05/2005 |
| 6872294 | Metallization of polymer composite parts for painting The quality of painted surfaces of polymer composites is improved by first forming an electroless metal coating on the molded surface of the composite and then electroplating a coating of zinc or zinc alloy on the metallized composite surface. The “galvanized” c... | 03/29/2005 |
| 6802985 | Method for fabricating metal wirings There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film ... | 10/12/2004 |
| 6689281 | Shield-plated corrugated tube A metal layer uniform in thickness is formed by electroless plating on both inner and outer surfaces of a corrugated tube to thereby produce a shield-plated corrugated tube which has a satisfactory flexibility as well as a superior electromagnetically shi... | 02/10/2004 |
| 6518182 | Via-filling process A process of performing via-filling efficiently and by a simple procedure is disclosed. The via-filling process comprises providing a substrate having blind via-holes, making the substrate electrically conductive, and plating the substrate in an acid copp... | 02/11/2003 |
| 6468593 | Plated non-conductive products and plating method for the same Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to... | 10/22/2002 |
| 6432291 | Simultaneous electroplating of both sides of a dual-sided substrate A method of simultaneously electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of ele... | 08/13/2002 |
| 6426290 | Electroplating both sides of a workpiece A method of electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically condu... | 07/30/2002 |
| 6406607 | Method for forming a nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and nozzle plate An inkjet printer nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the nozzle plate. In the method a metal masking layer is deposited on a glass substrate, the masking layer having... | 06/18/2002 |
| 6350365 | Method of producing multilayer circuit board A method of producing a multilayer circuit board comprising a core substrate and a plurality of layers of wiring lines on both sides of the core substrate with an insulation layer being interposed therebetween; the layers of wiring lines on both sides bei... | 02/26/2002 |
| 6348142 | Electroplating multi-trace circuit board substrates using single tie bar A method of electroplating circuit board substrate having a high density, multi-trace circuit pattern formed on at least one major surface of an insulative substrate, without requiring formation and at least partial removal of a large plurality of electri... | 02/19/2002 |
| 6344309 | Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method A metal pattern is prepared by applying a polysilane composition comprising a polysilane, a carbon functional silane, and a solvent onto a substrate to form a patterned coating of the polysilane composition, attaching catalytic metal nuclei to the pattern... | 02/05/2002 |
| 6331239 | Method of electroplating non-conductive plastic molded products A method of electroplating non-conductive plastic moldings, the method comprising the steps of: applying a catalyst useful for electroless plating to non-conductive plastic moldings using a colloidal solution containing a precious metal compound and a sta... | 12/18/2001 |
| 6274241 | Substrates seeded with precious metal salts, process for producing the same and their use To provide a substrate enclosed in a uniform nucleation layer, a substrate is nucleated with a noble metal salt where the noble metal salt is chemically bound to the substrate, and a method is described for binding a noble metal salt chemically to a subst... | 08/14/2001 |
| 6258311 | Forming mold cavities A method for producing a multiplicity of fastener element molding cavities extending from a mold surface, for molding a plastic product having fastener elements integrally molded with and extending from a product base, and a mold so produced. The mold cav... | 07/10/2001 |
| 6136513 | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of... | 10/24/2000 |
| 6114051 | Method for electroplating high-impact plastics A method for plating a high impact resistant plastic, particularly a polycarbonate substrate which has been modified with up to about 50 percent by weight of acrylonitrile-butadiene-styrene. The surface of the plastic is first conditioned with a halogenat... | 09/05/2000 |
| 6110347 | Method for the formation of an indium oxide film by electrodeposition process or electroless deposition process, a substrate provided with the indium oxide film for a semiconductor element, and a semiconductor element provided with the substrate A method for forming an indium oxide film on an electrically conductive substrate by immersing the substrate and a counter electrode in an aqueous solution containing at least nitrate and indium ions and flowing an electric current between the substrate a... | 08/29/2000 |
| 6106689 | Process for forming zinc oxide film and processes for producing semiconductor device substrate and photo-electricity generating device using the film A process for forming a zinc oxide film including immersing an electroconductive substrate having a surface including a plurality of linear projections in an aqueous solution containing at least nitrate ions and zinc ions to form a zinc oxide film on the ... | 08/22/2000 |
| 6045680 | Process for making thermally stable metal coated polymeric monofilament or yarn A polymeric yarn to be coated with electroless nickel is pretreated with an acid and a surfactant to render the yarn surfaces water wettable and not substantially mechanically degraded. All surfaces of yarn formed of polymeric monofilament fibers are coat... | 04/04/2000 |
| 5961808 | Metal film resistor having fuse function and method for producing the same The present invention relates to an alloy film resistor containing mainly nickel and phosphorus having an excellent fuse function and a method for producing the alloy film resistor. After the conductivity is given to the surface of an electrical insulatin... | 10/05/1999 |
| 5962073 | Method for electroplating elastomer-modified polyphthalamide articles A process for metal plating a high impact, high temperature plastic suitable for forming trim elements of an automobile. The process is particularly directed to plating an elastomer-modified PPA resin, and entails closely controlled process steps that inc... | 10/05/1999 |
| 5928727 | Method for electroplating elastomer-modified polyphthalamide articles A process for metal plating a high impact, high temperature plastic suitable for forming trim elements of an automobile. The process is particularly directed to plating an elastomer-modified PPA resin, and entails closely controlled process steps that inc... | 07/27/1999 |
| 5888372 | Process for producing metal-coated films in web form A metal-coated film can be produced continuously from a non-conducting film by successive electroless and galvanic metallization in such a way that a film of this kind is subjected, in a continuous "roll-to-roll" process, to the following operations: a) a... | 03/30/1999 |
| 5846665 | Method for electroplating high-impact plastics A method for plating a high impact resistant plastic, particularly a polycarbonate substrate which has been modified with up to about 50 percent by weight of acrylonitrile-butadiene-styrene. The surface of the plastic is first conditioned with a halogenat... | 12/08/1998 |
| 5770032 | Metallizing process A process for metallizing a surface of a substrate. Preferably, the substrate is composed of a dielectric material such as a circuit board which has copper cladding on at least one face and at least one through-hole to provide a site for electrical connec... | 06/23/1998 |
| 5759378 | Process for preparing a non-conductive substrate for electroplating The modification of carbon particles is proposed to achieve enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circ... | 06/02/1998 |
| 5707503 | Oxygen sensor element According to the present invention, an oxygen sensor element includes a solid electrolyte having a side surface at one side thereof, the side surface being contactable with a gas to be measured, a skeletal electrode provided on the side surface and having... | 01/13/1998 |
| 5681442 | Method of producing an organic device A process for producing an organic device includes forming a first electrode and a second electrode on a substrate having an insulating film formed on a surface thereof, etching out the insulating film with the first electrode and the second electrode bei... | 10/28/1997 |
| 5679234 | Process of forming miniature pattern well controlled in thickness on semiconductor wafer through selective electroplating A mask layer is formed on a conductive layer covering not only a central area assigned to integrated circuits but also a vacant peripheral area of a semiconductor wafer, and an electroplating system allows metallic miniature patterns to grow on the conduc... | 10/21/1997 |
| 5674373 | Method for metallizing non-conductive substrates A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable re... | 10/07/1997 |
| 5569493 | Preparation of cured cyanate ester resins and composites for metal plating A method is provided for preparing the surface of a cured cyanate ester resin or composite for metal plating. The composite may comprise graphite fibers embedded in a cured cyanate ester resin matrix The surface is treated with a preheated solution contai... | 10/29/1996 |
