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| Number | Title | Issue Date |
| 7354354 | Article comprising a fine-grained metallic material and a polymeric material Lightweight articles comprising a polymeric material at least partially coated with a fine-grained metallic material are disclosed. The fine-grained metallic material has an average grain size of 2 nm to 5,000 nm, a thickness between 25 micron and 5 cm, and a hardne... | 04/08/2008 |
| 7226531 | Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanot... | 06/05/2007 |
| 7186923 | Printed wiring boards and methods for making them A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conduct... | 03/06/2007 |
| 7139031 | Automated language filter for TV receiver A method and apparatus for use in connection with home television receivers involving processing an electronic signal, including audio and video processors; the audio information, including digital representations thereof, is analyzed and modified to compare words a... | 11/21/2006 |
| 7128820 | Process for preparing a non-conductive substrate for electroplating A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion traditional carbon black particles and highly conductive carbon black particl... | 10/31/2006 |
| 7025867 | Direct electrolytic metallization on non-conducting substrates The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate so... | 04/11/2006 |
| 6972802 | Language filter for home TV A method and an apparatus for use in connection with home television video recording, playback, and viewing involving processing an electronic signal, including audio and video information, whereby the audio information, including digital representations thereof, is... | 12/06/2005 |
| 6875471 | Metallization of polymer parts for painting The quality of painted surfaces of polymeric articles is improved by depositing a coating of a metal such as zinc or zinc alloy on the surface of the article to be painted. For example, zinc is electrodeposited on a conductive surface of the article. The metal coate... | 04/05/2005 |
| 6872294 | Metallization of polymer composite parts for painting The quality of painted surfaces of polymer composites is improved by first forming an electroless metal coating on the molded surface of the composite and then electroplating a coating of zinc or zinc alloy on the metallized composite surface. The “galvanized” c... | 03/29/2005 |
| 6802985 | Method for fabricating metal wirings There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film ... | 10/12/2004 |
| 6790334 | Combined adhesion promotion and direct metallization process A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the text... | 09/14/2004 |
| 6712948 | Process for metallizing a plastic surface A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treat... | 03/30/2004 |
| 6623614 | Cover structure for electronic device and method of manufacturing same A cover structure for an electronic device includes a plastic cover, an aluminum or aluminum alloy layer on the plastic cover, and an oxide layer of aluminum or aluminum alloy on the aluminum or aluminum alloy layer. A method of manufacturing the cover st... | 09/23/2003 |
| 6468593 | Plated non-conductive products and plating method for the same Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to... | 10/22/2002 |
| 6426290 | Electroplating both sides of a workpiece A method of electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically condu... | 07/30/2002 |
| 6303181 | Direct metallization process employing a cationic conditioner and a binder A method of applying a conductive carbon coating to a nonconductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclos... | 10/16/2001 |
| 6246586 | Method and apparatus for manufacturing a thin film, thin-film laminate, and electronic parts In a method wherein, before forming a thin film of, for example, metal on a supporting base in a vacuum, a vapor stream of patterning material for forming a pattern in the thin film is applied from nozzle holes, and the thin film is formed after this liqu... | 06/12/2001 |
| 6171468 | Direct metallization process A method of applying a conductive carbon coating to a non-conductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclo... | 01/09/2001 |
| 6123995 | Method of manufacture of multilayer circuit boards A method of providing an electrically conductive polymer coating on a copper clad circuit board prior to electroplating is disclosed. The method teaches the application of certain organic solvents to a conductive polymer composition already applied to the... | 09/26/2000 |
| 6120670 | Method of fabricating a multi-layered printed wiring board There is provided a method of fabricating a multi-layered printed wiring board, including the steps of (a) forming a multi-layered substrate with a hole which will make a blind via-hole, (b) plating the multi-layered substrate, (c) forming an internal lay... | 09/19/2000 |
| 6039859 | Method for electroplating using stabilized dispersions of conductive particles The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrop... | 03/21/2000 |
| 5948232 | Method of manufacturing passive elements using conductive polypyrrole formulations The present invention provides electronically conducting polymer films formed from formulations of pyrrole and an electron acceptor. The formulations may include photoinitiators, flexibilizers, solvents and the like. These formulations can be used to manu... | 09/07/1999 |
| 5858198 | Electroplating process A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for th... | 01/12/1999 |
| 5855755 | Method of manufacturing passive elements using conductive polypyrrole formulations The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include... | 01/05/1999 |
| 5788830 | Electroplating process A process for electroplating a surface comprising copper and an insulating material, comprising: applying specific carbon particles or a palladium compound to this surface, microetching the copper to remove the specific carbon particles or the palladium c... | 08/04/1998 |
| 5759378 | Process for preparing a non-conductive substrate for electroplating The modification of carbon particles is proposed to achieve enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circ... | 06/02/1998 |
| 5738776 | Electroplating process A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for th... | 04/14/1998 |
| 5725807 | Carbon containing composition for electroplating A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate i... | 03/10/1998 |
| 5693209 | Process for metallization of a nonconductor surface The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aque... | 12/02/1997 |
| 5690805 | Direct metallization process A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate i... | 11/25/1997 |
| 5685970 | Method and apparatus for sequentially metalized polymeric films and products made thereby An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about t... | 11/11/1997 |
| 5679234 | Process of forming miniature pattern well controlled in thickness on semiconductor wafer through selective electroplating A mask layer is formed on a conductive layer covering not only a central area assigned to integrated circuits but also a vacant peripheral area of a semiconductor wafer, and an electroplating system allows metallic miniature patterns to grow on the conduc... | 10/21/1997 |
| 5674373 | Method for metallizing non-conductive substrates A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable re... | 10/07/1997 |
| 5667662 | Electroplating process and composition A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the co... | 09/16/1997 |
| 5632927 | Process for preparing a non-conductive substrate for electroplating The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed ... | 05/27/1997 |
| 5616230 | Method for direct-electroplating an electrically nonconductive substrate A process for plating an electrically nonconductive substrate by the following sequence of steps: (1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent; (2) a step of treating the electrically noncond... | 04/01/1997 |
| 5597471 | Solution for coating non-conductors with conductive polymers and their metallization process A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at leas... | 01/28/1997 |
| 5575898 | Process for through-hole plating of two-layer printed circuit boards and multilayers Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a m... | 11/19/1996 |
| 5547558 | Process for electroplating nonconductive surface The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average pa... | 08/20/1996 |
| 5536386 | Process for preparing a non-conductive substrate for electroplating The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed ... | 07/16/1996 |
