Bizarre Patents
Self Containing Enclosure for Protection from Killer Bees
A self contained protective enclosure with an opening for entry and egress and a screen for ventilation and viewing.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7384532 | Platable coating and plating process A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of ... | 06/10/2008 |
| 7255782 | Selective catalytic activation of non-conductive substrates A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided. The method comprises the steps of catalyzing the non-conductive subst... | 08/14/2007 |
| 7128820 | Process for preparing a non-conductive substrate for electroplating A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion traditional carbon black particles and highly conductive carbon black particl... | 10/31/2006 |
| 7063779 | Method for manufacturing metal-coated optical fiber The optical fiber manufacturing method according to the present invention is characterized by having the steps of forming, on the peripheral surface of a bare fiber having been exposed by removing a resin cover and on which a metallic coating has not been provided, ... | 06/20/2006 |
| 7005192 | Ceramic electronic component and method of producing the same A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains... | 02/28/2006 |
| 6908496 | Method for scalable production of nanoshells using salt assisted purification of intermediate colloid-seeded nanoparticles A method for purifying a suspension containing colloid-seeded nanoparticles and excess colloids is provided that includes adding to the suspension a filter aid comprising a salt. The method further includes filtering the suspension with a filter of a pore size inter... | 06/21/2005 |
| 6899829 | Conductive polymer colloidal compositions with selectivity for non-conductive surfaces A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain condu... | 05/31/2005 |
| 6468593 | Plated non-conductive products and plating method for the same Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to... | 10/22/2002 |
| 6432291 | Simultaneous electroplating of both sides of a dual-sided substrate A method of simultaneously electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of ele... | 08/13/2002 |
| 6426290 | Electroplating both sides of a workpiece A method of electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically condu... | 07/30/2002 |
| 6406607 | Method for forming a nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and nozzle plate An inkjet printer nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the nozzle plate. In the method a metal masking layer is deposited on a glass substrate, the masking layer having... | 06/18/2002 |
| 6358390 | Method for forming electrode A method for forming an electrode on a surface of an electronic device formed of a ceramic material is disclosed. The method comprises the steps of: adjusting a polarity of a surface charge by immersing the electronic device in a solution containing a cat... | 03/19/2002 |
| 6350365 | Method of producing multilayer circuit board A method of producing a multilayer circuit board comprising a core substrate and a plurality of layers of wiring lines on both sides of the core substrate with an insulation layer being interposed therebetween; the layers of wiring lines on both sides bei... | 02/26/2002 |
| 6348142 | Electroplating multi-trace circuit board substrates using single tie bar A method of electroplating circuit board substrate having a high density, multi-trace circuit pattern formed on at least one major surface of an insulative substrate, without requiring formation and at least partial removal of a large plurality of electri... | 02/19/2002 |
| 6344309 | Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method A metal pattern is prepared by applying a polysilane composition comprising a polysilane, a carbon functional silane, and a solvent onto a substrate to form a patterned coating of the polysilane composition, attaching catalytic metal nuclei to the pattern... | 02/05/2002 |
| 6274241 | Substrates seeded with precious metal salts, process for producing the same and their use To provide a substrate enclosed in a uniform nucleation layer, a substrate is nucleated with a noble metal salt where the noble metal salt is chemically bound to the substrate, and a method is described for binding a noble metal salt chemically to a subst... | 08/14/2001 |
| 6251252 | Metalization of non-hermetic optical fibers The present invention provides a simple, reproducible electroless process for metalizing a non-hermetic optical fiber. The process of the present invention provides the optical fiber with a metalization layer suitable for solder bonding the optical fibers... | 06/26/2001 |
| 6120670 | Method of fabricating a multi-layered printed wiring board There is provided a method of fabricating a multi-layered printed wiring board, including the steps of (a) forming a multi-layered substrate with a hole which will make a blind via-hole, (b) plating the multi-layered substrate, (c) forming an internal lay... | 09/19/2000 |
| 6113772 | Method for making lithographic printing plates based on electroplating According to the present invention there is provided a method for making lithographic printing plates or a printing cylinder including the steps of applying image-wise a solution of ions of an oleophilic metal with an ink jet on a hydrophilic metallic bas... | 09/05/2000 |
| 6039859 | Method for electroplating using stabilized dispersions of conductive particles The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrop... | 03/21/2000 |
| 6027862 | Method of applying a silver layer to a glass substrate A description is given of a method of providing an adhesive silver layer on a glass substrate, in which method the glass surface is activated, whereafter a first silver layer is provided from an electroless silver bath and reinforced by means of a second ... | 02/22/2000 |
| 5961808 | Metal film resistor having fuse function and method for producing the same The present invention relates to an alloy film resistor containing mainly nickel and phosphorus having an excellent fuse function and a method for producing the alloy film resistor. After the conductivity is given to the surface of an electrical insulatin... | 10/05/1999 |
| 5938912 | Method for producing glass articles with selectively deposited overlay A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of a heat fusible material, such as glass or plastic, with a metal having a particle size... | 08/17/1999 |
| 5863407 | Metal film resistor having fuse function and method for producing the same The present invention relates to an alloy film resistor containing mainly nickel and phosphorus having an excellent fuse function and a method for producing the alloy film resistor. After the conductivity is given to the surface of an electrical insulatin... | 01/26/1999 |
| 5858198 | Electroplating process A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for th... | 01/12/1999 |
| 5855755 | Method of manufacturing passive elements using conductive polypyrrole formulations The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include... | 01/05/1999 |
| 5849170 | Electroless/electrolytic methods for the preparation of metallized ceramic substrates An improved process for the preparation of metallized ceramic substrates having a metal layer ranging from ten to two hundred microns in thickness, and having enhanced adhesion strength is provided. The process involves, in combination, a novel method for... | 12/15/1998 |
| 5843517 | Composition and method for selective plating This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printe... | 12/01/1998 |
| 5788830 | Electroplating process A process for electroplating a surface comprising copper and an insulating material, comprising: applying specific carbon particles or a palladium compound to this surface, microetching the copper to remove the specific carbon particles or the palladium c... | 08/04/1998 |
| 5770032 | Metallizing process A process for metallizing a surface of a substrate. Preferably, the substrate is composed of a dielectric material such as a circuit board which has copper cladding on at least one face and at least one through-hole to provide a site for electrical connec... | 06/23/1998 |
| 5707503 | Oxygen sensor element According to the present invention, an oxygen sensor element includes a solid electrolyte having a side surface at one side thereof, the side surface being contactable with a gas to be measured, a skeletal electrode provided on the side surface and having... | 01/13/1998 |
| 5690805 | Direct metallization process A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate i... | 11/25/1997 |
| 5674373 | Method for metallizing non-conductive substrates A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable re... | 10/07/1997 |
| 5667662 | Electroplating process and composition A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the co... | 09/16/1997 |
| 5616230 | Method for direct-electroplating an electrically nonconductive substrate A process for plating an electrically nonconductive substrate by the following sequence of steps: (1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent; (2) a step of treating the electrically noncond... | 04/01/1997 |
| 5575898 | Process for through-hole plating of two-layer printed circuit boards and multilayers Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a m... | 11/19/1996 |
| 5560812 | Method for producing a metal film resistor A method for producing a metal film resistor including at least an insulating substrate, a resistor film of copper-nickel alloy formed on the surface of the insulating substrate, and a pair of terminals which are in contact with the resistor film is provi... | 10/01/1996 |
| 5547558 | Process for electroplating nonconductive surface The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average pa... | 08/20/1996 |
| 5536386 | Process for preparing a non-conductive substrate for electroplating The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed ... | 07/16/1996 |
| 5516418 | Patterned electroplating A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of hydroxyquinoline which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposin... | 05/14/1996 |
