Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 7156973 | Process for preparing a conducting polymer electrode useful for electrocatalytic oxidation of alcohols This invention relates to increasing the electrocatalytic activity of conducting polymers so that the same may be useful for electro-oxidation of methanol which is important for fuel-cell technology. Conventional catalysts used for this process are based on Pt, Ru o... | 01/02/2007 |
| 7128820 | Process for preparing a non-conductive substrate for electroplating A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion traditional carbon black particles and highly conductive carbon black particl... | 10/31/2006 |
| 7082655 | Process for plating a piezoelectric composite A transducer having a ceramic element in which the ceramic is elevated above a polymer and a method of manufacturing the transducer. The transducer comprises a piezo-composite element comprising a ceramic element embedded in epoxy. In an array, the ceramic elements ... | 08/01/2006 |
| 7038238 | Semiconductor device having a non-single crystalline semiconductor layer A semiconductor device including a conductive substrate or a first conductive layer formed on the substrate, a non-single-crystal semiconductor layer member is disposed on the conductive substrate or the conductive layer, the non-single-crystal semiconductor layer m... | 05/02/2006 |
| 7025867 | Direct electrolytic metallization on non-conducting substrates The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate so... | 04/11/2006 |
| 7005054 | Method for manufacturing probes of a probe card A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Cont... | 02/28/2006 |
| 7005192 | Ceramic electronic component and method of producing the same A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains... | 02/28/2006 |
| 6994918 | Selective application of conductive material to circuit boards by pick and place A component for use in manufacturing circuit boards, such as printed circuit boards, or flex substrates is adapted for use with pick-and-place equipment to provide a first material overlay disposed over a second material base layer. Such a component may include a fi... | 02/07/2006 |
| 6972081 | Fabrication of embedded vertical spiral inductor for multichip module (MCM) package A process for fabricating a vertical spiral inductor within a multichip module package is disclosed. The process consists of depositing a pattern of bottom lines by electroplating copper on a substrate and then depositing an insulation pattern. Next, depositing a pa... | 12/06/2005 |
| 6787047 | Methods for manufacturing a microstructured sensor A method for manufacturing a sensor, the sensor including a three-dimensional interdigital electrode arrangement positioned on a substrate, comprising applying a temperature sensing resistor onto the substrate by sputtering a first adhesion layer and a first metalli... | 09/07/2004 |
| 6764586 | Method for electrochemically metallizing an insulating substrate Provided is a process for metallizing an insulating substrate by depositing a uniform thin film of a metal on the insulating substrate. The process comprises placing the insulating substrate in an electrochemical cell which contains as the electrolyte a solution of ... | 07/20/2004 |
| 6656339 | Method of forming a nano-supported catalyst on a substrate for nanotube growth Methods of forming a nano-supported catalyst on a substrate and at least one carbon nanotube on the substrate are comprised of configuring a substrate with an electrode (102), immersing the substrate with the electrode into a solvent containing a first me... | 12/02/2003 |
| 6546751 | Articles with selectively deposited overlay A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of heat fusible material, such as glass or plastic, with a metal having a particle size l... | 04/15/2003 |
| 6426290 | Electroplating both sides of a workpiece A method of electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically condu... | 07/30/2002 |
| 6378338 | Method for producing magnetic disk substrates Magnetic disk substrates are produced by subjecting glass substrates to at least steps of degreasing, etching, sensitization with tin chloride, activation and sensitivity-enhancing treatment in that order, then plating the pretreated substrates with a nic... | 04/30/2002 |
| 6379524 | Method for preparing composite membrane for separation of hydrogen gas A process for manufacturing a composite membrane for separation of hydrogen gas using palladium, which employs the step of electroplating under vacuum an alloy of a palladium compound and a transition metal.... | 04/30/2002 |
| 6350365 | Method of producing multilayer circuit board A method of producing a multilayer circuit board comprising a core substrate and a plurality of layers of wiring lines on both sides of the core substrate with an insulation layer being interposed therebetween; the layers of wiring lines on both sides bei... | 02/26/2002 |
| 6235182 | Solution for pretreatment of electrically non-conductive surfaces, and method of coating the surfaces with solid material particles A solution for the pretreatment of electrically non-conductive surfaces and a method for coating surfaces with solid matter particles, for example carbon black, graphite, silicon dioxide, aluminum oxides, transition metal chalcogenides and titanium dioxid... | 05/22/2001 |
| 6228243 | Electrochemical synthesis of crystalline compound or alloy films A new method to synthesize crystalline films, superlattices and multilayered devices based on metallic or semiconductor compounds or alloys in electrolyte media on non-crystalline substrates. An automated sequence of flow, equilibration and underpotential... | 05/08/2001 |
| 6224735 | Process for recording image A transparent support having formed thereon a transparent conductive film and an organic or inorganic semiconductor thin film that generates an electromotive force by irradiation of light formed on the transparent conductive film, and an aqueous electroly... | 05/01/2001 |
| 6171468 | Direct metallization process A method of applying a conductive carbon coating to a non-conductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclo... | 01/09/2001 |
| 6110347 | Method for the formation of an indium oxide film by electrodeposition process or electroless deposition process, a substrate provided with the indium oxide film for a semiconductor element, and a semiconductor element provided with the substrate A method for forming an indium oxide film on an electrically conductive substrate by immersing the substrate and a counter electrode in an aqueous solution containing at least nitrate and indium ions and flowing an electric current between the substrate a... | 08/29/2000 |
| 6017628 | Metal-coated substrate articles responsive to electromagnetic radiation, and method of making and using the same An article (130) comprising a non-conductive substrate (136), preferably of an environmentally degradeable character, having a thickness of an oxidizable metal coating (138) thereon, and optionally an oxidation enhancingly effective amount of a salt (140)... | 01/25/2000 |
| 5948232 | Method of manufacturing passive elements using conductive polypyrrole formulations The present invention provides electronically conducting polymer films formed from formulations of pyrrole and an electron acceptor. The formulations may include photoinitiators, flexibilizers, solvents and the like. These formulations can be used to manu... | 09/07/1999 |
| 5938912 | Method for producing glass articles with selectively deposited overlay A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of a heat fusible material, such as glass or plastic, with a metal having a particle size... | 08/17/1999 |
| 5895562 | Gas shielding during plating Gas shielding is employed to prevent metal plating on contacts during electroplating to reduce particulate contamination and increase thickness uniformity. In another embodiment, gas shielding is employed to prevent deposition on the backside and edges of... | 04/20/1999 |
| 5855755 | Method of manufacturing passive elements using conductive polypyrrole formulations The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include... | 01/05/1999 |
| 5820742 | Electrodeposition coating method and electrodeposition coating agent An electrodeposition coating method characterized in that in electrodeposition coating of a water soluble composition of a polyimide precursor which is prepared by using 1,2,3,4-butanetetracarboxylic acid or its imide-forming derivative and a diamine and ... | 10/13/1998 |
| 5788830 | Electroplating process A process for electroplating a surface comprising copper and an insulating material, comprising: applying specific carbon particles or a palladium compound to this surface, microetching the copper to remove the specific carbon particles or the palladium c... | 08/04/1998 |
| 5725807 | Carbon containing composition for electroplating A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate i... | 03/10/1998 |
| 5690805 | Direct metallization process A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate i... | 11/25/1997 |
| 5685968 | Ceramic substrate with thin-film capacitor and method of producing the same In a ceramic substrate with a thin-film capacitor, having a ceramic substrate a lower electrode layer formed on the ceramic substrate, a dielectric layer formed on the lower electrode layer and made of an oxide of a material constituting the lower electro... | 11/11/1997 |
| 5674369 | Method for manufacturing color filter by electrodeposition and electrode used therefor A color filter having an improved uniformity of color layer thickness is industrially advantageously, manufactured by an electrodeposition method using as a counter electrode a wire netting-form electrode.... | 10/07/1997 |
| 5674373 | Method for metallizing non-conductive substrates A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable re... | 10/07/1997 |
| 5667662 | Electroplating process and composition A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the co... | 09/16/1997 |
| 5653834 | Process for making electrical feedthroughs for ceramic circuit board support substrates Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass... | 08/05/1997 |
| 5616230 | Method for direct-electroplating an electrically nonconductive substrate A process for plating an electrically nonconductive substrate by the following sequence of steps: (1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent; (2) a step of treating the electrically noncond... | 04/01/1997 |
| 5607569 | Method of fabricating ceramic package body for holding semiconductor devices A method of fabricating a ceramic package body for holding semiconductor devices which include external terminals arranged on an outer surface of the ceramic package body, a first conductive pattern having first conductors connected respectively to the ex... | 03/04/1997 |
| 5597471 | Solution for coating non-conductors with conductive polymers and their metallization process A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at leas... | 01/28/1997 |
| 5575898 | Process for through-hole plating of two-layer printed circuit boards and multilayers Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a m... | 11/19/1996 |
