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| Number | Title | Issue Date |
| 8187446 | Method of manufacturing a disposable electrochemical sensor strip A disposable electrochemical sensor strip is provided. The sensor strip includes an isolating sheet having at least a through hole, at least a conductive raw material mounted in the through hole, a metal film covered on the conductive raw material to form an electro... | 05/29/2012 |
| 7815785 | Direct metallization of electrically non-conductive polyimide substrate surfaces The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that ... | 10/19/2010 |
| 7442284 | Coated carbon nanotube array electrodes The present invention provides conductive carbon nanotube (CNT) electrode materials comprising aligned CNT substrates coated with an electrically conducting polymer, and the fabrication of electrodes for use in high performance electrical energy storage devices. In ... | 10/28/2008 |
| 7384532 | Platable coating and plating process A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of ... | 06/10/2008 |
| 7354354 | Article comprising a fine-grained metallic material and a polymeric material Lightweight articles comprising a polymeric material at least partially coated with a fine-grained metallic material are disclosed. The fine-grained metallic material has an average grain size of 2 nm to 5,000 nm, a thickness between 25 micron and 5 cm, and a hardne... | 04/08/2008 |
| 7354532 | Compositions of electrically conductive polymers and non-polymeric fluorinated organic acids Compositions are provided comprising at least one conductive polymer and at least one non-polymeric fluorinated organic acid, wherein the conductive polymer is selected from a polythiophene, a polypyrrole, a polyaniline, and combinations thereof. Electronic devices ... | 04/08/2008 |
| 7247222 | Electrochemical processing cell Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell furth... | 07/24/2007 |
| 7244688 | Method for in situ immobilization of water-soluble nanodispersed metal oxide colloids The invention relates to heterogeneous catalysts which are particularly easy to produce. Said heterogeneous catalysts are generated by immobilizing preformed monometallic or multimetallic metal oxide particles in situ on an oxidic or non-oxidic carrier, wherefore me... | 07/17/2007 |
| 7244034 | Low CTE metal-ceramic composite articles, and methods for making same A mirror having low density, low CTE, high thermal conductivity, high elastic modulus, and a reflective, polishable surface. The instant mirror features a silicon-based metal coating as the reflective surface, and a composite body as a support or substrate for the r... | 07/17/2007 |
| 7223328 | Sensors for reducing gas molecules Provided is a gas molecule sensor, characterized in that the sensing element is a polycrystalline tin oxide film having a thickness less than 1 μm. The sensing element is produced by electrolytic deposit of a tin film on an insulating support in an electromechanica... | 05/29/2007 |
| 7211504 | Process and arrangement for the selective metallization of 3D structures A process is provided for the selective metallization of 3D structures, particularly for the selective gold-plating of 3D contact structures on wafers, such as contact bumps, which are electrically connected to a bond pad on the wafer via a three-dimensional, mechan... | 05/01/2007 |
| 7195701 | Electrochemical depositions applied to nanotechnology composites A method of improving the material properties of a composite by electrodepositing various polymers, organic compounds or inorganic compounds onto each individual carbon (graphite) fiber strand, whether individual fiber or as a fabric to form an homogeneous chemicall... | 03/27/2007 |
| 7156973 | Process for preparing a conducting polymer electrode useful for electrocatalytic oxidation of alcohols This invention relates to increasing the electrocatalytic activity of conducting polymers so that the same may be useful for electro-oxidation of methanol which is important for fuel-cell technology. Conventional catalysts used for this process are based on Pt, Ru o... | 01/02/2007 |
| 7128820 | Process for preparing a non-conductive substrate for electroplating A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion traditional carbon black particles and highly conductive carbon black particl... | 10/31/2006 |
| 7105242 | Control of polymer surface distribution on diffusion media improved fuel cell performance Favorable performance of diffusion media in fuel cells has found to be correlated to a parameter (the C/F ratio) that relates to a spatial and thickness distribution of the hydrophobic fluoropolymer on the carbon fiber substrate structure of the medium. Suitable dif... | 09/12/2006 |
| 7100707 | Stabilized soil core samples and method for preparing same An intact core sample from a soil area, such as a golf green or a ball field, is embedded in molded plastic. The core sample first is obtained, and then adhesively bonded together prior to molding it in clear plastic to preserve the soil core sample in an intact and... | 09/05/2006 |
| 7063779 | Method for manufacturing metal-coated optical fiber The optical fiber manufacturing method according to the present invention is characterized by having the steps of forming, on the peripheral surface of a bare fiber having been exposed by removing a resin cover and on which a metallic coating has not been provided, ... | 06/20/2006 |
| 7040966 | Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid b... | 05/09/2006 |
| 7025867 | Direct electrolytic metallization on non-conducting substrates The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate so... | 04/11/2006 |
| 6974547 | Flexible thin film capacitor and method for producing the same According to a flexible thin film capacitor of the present invention, an adhesive film is formed on a substrate composed of at least one selected from the group consisting of an organic polymer and a metal foil, and an inorganic high dielectric film and metal electr... | 12/13/2005 |
| 6958114 | Method and apparatus for forming an electrical contact with a semiconductor substrate The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stor... | 10/25/2005 |
| 6932892 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece A process for applying a metallization interconnect as to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer... | 08/23/2005 |
| 6927472 | Fuse structure and method to form the same A method and structure for a fuse structure comprises an insulator layer, a plurality of fuse electrodes extending through the insulator layer to an underlying wiring layer, an electroplated fuse element connected to the electrodes, and an interface wall. The fuse e... | 08/09/2005 |
| 6923919 | Liquid crystal polymers for flexible circuits A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the ... | 08/02/2005 |
| 6919013 | Apparatus and method for electrolytically depositing copper on a workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin see... | 07/19/2005 |
| 6913680 | Method of application of electrical biasing to enhance metal deposition A method and associated apparatus includes depositing metal on a plating surface of an object immersed in an electrolyte solution prior to bulk deposition on the plating surface. In one aspect, the method further includes applying a voltage between an anode and the ... | 07/05/2005 |
| 6907917 | Graphite-based heat sinks and method and apparatus for the manufacture thereof One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the g... | 06/21/2005 |
| 6905589 | Circuitized substrate and method of making same A method of making a circuitized substrate in which a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like.... | 06/14/2005 |
| 6899829 | Conductive polymer colloidal compositions with selectivity for non-conductive surfaces A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain condu... | 05/31/2005 |
| 6878260 | Process for forming a high-quality interface between a plated and a non-plated area A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. T... | 04/12/2005 |
| 6790334 | Combined adhesion promotion and direct metallization process A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the text... | 09/14/2004 |
| 6767589 | Method for metal coating a flywheel rim A composite flywheel rotor includes an annular rim mounted on a hub for high speed rotation in an evacuated flywheel enclosure. A smooth epoxy layer is applied to the rim and is cleaned or maintained clean in preparation for a metal coating on the rim. The rim may b... | 07/27/2004 |
| 6764586 | Method for electrochemically metallizing an insulating substrate Provided is a process for metallizing an insulating substrate by depositing a uniform thin film of a metal on the insulating substrate. The process comprises placing the insulating substrate in an electrochemical cell which contains as the electrolyte a solution of ... | 07/20/2004 |
| 6755955 | Catalytic converter and method for producing a catalytic converter A method for producing a catalytic converter includes depositing a layer of catalytically active metallic material by electrochemical deposition on a planar substrate by immersing the substrate in an electrolyte that contains the catalytically active metallic materi... | 06/29/2004 |
| 6753251 | Method for filling recessed micro-structures with metallization in the production of a microelectronic device A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generate... | 06/22/2004 |
| 6740220 | Electrocatalytic cathode device of palladium and iridium on a high density or porous carbon support and a method for making such a cathode The present invention relates to a method of producing an electrocatalytic cathode for use in an electrochemical cell system comprising the steps of providing a carbon substrate and simultaneously depositing palladium and iridium on the carbon substrate by cyclic vo... | 05/25/2004 |
| 6712948 | Process for metallizing a plastic surface A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treat... | 03/30/2004 |
| 6695976 | Water-continuous systems and polymerization method In a water-continuous system and a polymerization method, the water-continuous system comprises a polymerizable aromatic compound as an oil, water and a non-ionic surfactant, wherein the polymerizable aromatic compound is a component from the group consis... | 02/24/2004 |
| 6656339 | Method of forming a nano-supported catalyst on a substrate for nanotube growth Methods of forming a nano-supported catalyst on a substrate and at least one carbon nanotube on the substrate are comprised of configuring a substrate with an electrode (102), immersing the substrate with the electrode into a solvent containing a first me... | 12/02/2003 |
| 6632344 | Conductive oxide coating process The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion... | 10/14/2003 |
