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| Number | Title | Issue Date |
| 7431816 | Method of manufacturing heat resistant resin film with metal thin film A method for manufacturing a heat resistant resin film with a metal thin film is configured to include the steps of: biasing a conductive material to one surface of the heat resistant resin film; and applying electrolytic plating to the heat resistant resin film whi... | 10/07/2008 |
| 7365007 | Interconnects with direct metalization and conductive polymer Embodiments include an interconnect or trace of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a via formed on the dielectric layer and to the contact surface. The via sidewalls and perimeter are la... | 04/29/2008 |
| 7309411 | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic ac... | 12/18/2007 |
| 7136008 | Low cost electromagnetic energy absorbers manufactured from conductive loaded resin-based materials Electromagnetic energy absorbing devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a b... | 11/14/2006 |
| 7098463 | Three-dimensional dosimeter for penetrating radiation and method of use This invention relates to a method of forming a three-dimensional (3D) dosimetric map in a solid translucent or transparent polymer and to an article of manufacture comprising a polymer formulated to capture data imparted by incident penetrating radiation. The prese... | 08/29/2006 |
| 6866764 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowi... | 03/15/2005 |
| 6803228 | Method for making a biochip and biochip The present invention relates to a method to produce a biochip and to a biochip, said biochip being composed particularly of biological probes grafted onto a conductive polymer. The method according to the invention comprises the following steps: | 10/12/2004 |
| 6680092 | Coating method and products obtained by same The invention concerns a method for producing high resolution patterns on a support comprising the following steps: high resolution printing of a varnish on the support; treating the support by electrolysis; washing and drying the support.... | 01/20/2004 |
| 6582581 | Sequential build circuit board plating process A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.... | 06/24/2003 |
| 6546751 | Articles with selectively deposited overlay A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of heat fusible material, such as glass or plastic, with a metal having a particle size l... | 04/15/2003 |
| 6350609 | Electrospraying for mass fabrication of chips and libraries A method of fabricating deposits of non-volatile substances, including biomacromolecules, in the form of spots and filing on a substrate surface by electrospray, where the deposits are used to determine the interaction of the deposited non-volatile substa... | 02/26/2002 |
| 6294111 | Electrochromic inks Apparatus and methods for manufacturing electrochromic cells. Layers of various inks are printed on substrates by high speed printing means. The electrochromic cells comprise layers of electrode, electrolyte, and counter electrode ink materials which are ... | 09/25/2001 |
| 6258241 | Process for electroplating metals A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter .xi. less ... | 07/10/2001 |
| 6256883 | Method of producing nozzle plate for use in ink jet printer A method of producing a nozzle plate for use in an ink jet head includes the steps of (a) stretching a predetermined number of resin lines, each having a cross section corresponding in shape to each nozzle hole to be formed in an ink jet head, in the same... | 07/10/2001 |
| 6197949 | Electronically conductive polymer/nucleotide copolymer. preparation method therefor and use thereof A copolymer of general formula (I), wherein unit A is a monomer of an electronically conductive polymer, unit B is a nucleotide, an oligonucleotide or an analogue thereof, x, y, z are integers of 1 or higher or y is 0, and 1 is a covalent bond, or a space... | 03/06/2001 |
| 6174427 | Process for the preparation of electromotively coated filled thermoset articles A process comprising electromotively coating an article molded from a sheet molding compound comprising a mixture of: (a) 10-40 percent by weight of a thermosetting resin, (b) 20-60 percent by weight of calcium carbonate particles, (c) 10-40 percent by we... | 01/16/2001 |
| 6110347 | Method for the formation of an indium oxide film by electrodeposition process or electroless deposition process, a substrate provided with the indium oxide film for a semiconductor element, and a semiconductor element provided with the substrate A method for forming an indium oxide film on an electrically conductive substrate by immersing the substrate and a counter electrode in an aqueous solution containing at least nitrate and indium ions and flowing an electric current between the substrate a... | 08/29/2000 |
| 5976343 | Multi-coat painting process Process for multi-coat lacquering of a substrate with a stoved first electrodeposition layer by applying a second surface coating layer of 10 to 30 μm dry layer thickness consisting of a base lacquering agent containing a first, water-based, polyurethane... | 11/02/1999 |
| 5882822 | Battery electrode and method for the preparation thereof Proposed is an improvement in the method for the preparation of a battery electrode consisting of a spongy metal sheet to serve as a substrate having a three-dimensional skeletal structure with intercommunicating open pores and an active material filling ... | 03/16/1999 |
| 5837859 | Preparation of a electronically conductive polymer/nucleotide copolymer A copolymer of general formula (I), ##STR1## wherein unit A is a monomer of an electronically conductive polymer, unit B is a nucleotide, an oligonucleotide or an analogue thereof, x, y, z are integers of 1 or higher or y is 0, and l is a covalent bo... | 11/17/1998 |
| 5762777 | Process of directly electroplating onto a nonconductive substrate A process of directly plating onto a nonconductive substrate is disclosed. The process comprises the steps of: 1) conditioning: modifying a surface of the nonconductive substrate with selected organic hydrocarbons or polymers to enhance its property of ad... | 06/09/1998 |
| 5702584 | Enhanced plating adhesion through the use of metallized fillers in plastic substrate A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metall... | 12/30/1997 |
| 5667851 | Process for preparing a metallized polymide film containing a hydrocarbyl tin compound A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion throug... | 09/16/1997 |
| 5567296 | Process for producing vehicular fuel tanks A hollow container for storage and transport of fluid hydrocarbon vehicular fuels is composed of a laminated structure of polymeric resin body component and electrodeposited metal. An interior stratum of polymer chemically resistant to the fuel is joined ... | 10/22/1996 |
| 5418073 | Method of forming noise-damping composite with externally galvanized surfaces and composite formed thereby A noise-damping composite is formed by providing a sandwich of a viscoelastic layer between two metal skins, the viscoelastic layer including electrically conductive particles distributed therein. The sandwich is passed through a series of cells of an ele... | 05/23/1995 |
| 5413694 | Method for improving electromagnetic shielding performance of composite materials by electroplating A method of improving the electromagnetic (EM) shielding performance of a mposite material is provided. The composite material has conductive and semi-conductive filler particles suspended in a non-conductive resin. The filler particles can be up to 40 we... | 05/09/1995 |
| 5205921 | Method for depositing bioactive coatings on conductive substrates A process for electro depositing bioactive coatings, such as calcium phosphate or aluminum oxide, onto conductive substrates, such as prosthetic implant devices, is described. An electrolyte bath containing an aqueous solution of the desired oxide or phos... | 04/27/1993 |
| 5190796 | Method of applying metal coatings on diamond and articles made therefrom A method of improving adhesion of a nickel alloy to the surfaces of diamond particles and articles made therefrom. Diamond particles are electrolessly nickel plating with the nickel alloy formed with a transitional metal, such as molybdenum. Electrolessly... | 03/02/1993 |
| 5183552 | Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aque... | 02/02/1993 |
| 5071517 | Method for directly electroplating a dielectric substrate and plated substrate so produced A method for the direct electroplating of a non-conducting substrate and plated substrates so produced are disclosed wherein the non-conducting substrate is first treated with a non-acidic aqueous salt solution containing a micro-fine colloidal distributi... | 12/10/1991 |
| 5015339 | Process for preparing nonconductive substrates The process of electroplating a metal layer to the surface of a nonconductive material which comprised the steps: (a) contacting said substrate surface with an alkaline permanganate solution for an effective time and at an effective concentration and at an ... | 05/14/1991 |
| 4978431 | Continuous electroplating of conductive foams The present invention resides in the discovery that a strip of reticulated foam which is semi-conductive can be continuously electroplated, utilizing a cathode roll which is positioned, in a first electroplating zone, outside of the electroplating bath. A... | 12/18/1990 |
| 4815940 | Fatigue strengthened composite article A composite article includes a compressively stressed plating which provides increased static strength and fatigue life. In particular, a fan exit guide vane (1), made of a graphite fiber reinforced composite material and including a conductive plating (7... | 03/28/1989 |
| 4783243 | Articles comprising metal-coated polymeric substrates and process Improved articles are disclosed having a polymeric substrate containing a polymer, such as polyamide, and a metallic sulfide, such as copper sulfide, and a thin, uniform, and firmly adherent overlayer of an eletrodepositable metal, such as nickel. The met... | 11/08/1988 |
| 4780332 | Process for producing adherent, electrochemically reinforcible and solderable metal layers on an aluminum-oxide containing ceramic substrate A screen-printing paste containing Cu2 O or NiO and preferably aluminum oxide or, more preferably, an aluminum compound such as aluminum acetylacetonate which forms aluminum oxide under calcination heat, is printed over an entire surface of a s... | 10/25/1988 |
| 4752365 | Methods of application for conductive primers The present invention is directed to improved methods for increasing the effective contact area of electrodes during the electrocoating process. One preferred embodiment of such methods comprises the first step of coating a non-conductive workpiece with a... | 06/21/1988 |
| 4704196 | Process for surface treatment of carbon fiber A process for the surface treatment of carbon fiber tows each consisting of a multiplicity of filaments, comprises treating the tows by electrolytic oxidation, using each tow as a positive electrode and applying an electric current in the form of pulses. ... | 11/03/1987 |
| 4687553 | Unitized electrode-intercell connector module A unitized electrode-intercell connector module is prepared for use in a bipolar electrode, especially for use in such electrode of the M-alkaline electrolyte-AgO types. In such special electrode, an imperforate foil, contacted with a conductive foam, is ... | 08/18/1987 |
| 4683037 | Dimensionally stable anode for molten salt electrowinning and method of electrolysis The morphology of a coating of Ce oxyfluoride on a conductive substrate is improved by addition of yttrium, lanthanum, praseodymium and/or other rare earth metals. Whereas the pure Ce-oxycompound coating shows cracks which frequently extend throughout the... | 07/28/1987 |
| 4613388 | Superplastic alloys formed by electrodeposition There are provided superplastic alloys formed by electrodeposition of the alloy onto a cathode from an electrolyte containing a first metal ion, which is iron, nickel or cobalt, and a second constituent different from the first, which is iron, nickel, cob... | 09/23/1986 |
