Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 7404885 | Plating method and electronic device A plating method includes the steps of (a) forming a roughened area in a predetermined area of a substrate, (b) forming a surface-active agent layer above at least the roughened area, (c) forming, above the roughened area, a catalyst layer above the surface-active a... | 07/29/2008 |
| 7347880 | Flat capacitor having staked foils and edge-connected connection members A method of joining a connection member to a capacitor foil using a staking tool having a tip of less than 0.030″ (0.762 mm) in diameter. Another embodiment couples multiple connection members of a capacitor together by edge-connecting each connection member to it... | 03/25/2008 |
| 7276442 | Method for forming a metallization layer A method for depositing metal on a semiconductor device having a substrate, an exposed first surface, and an exposed second surface is provided. Metal ions are deposited on the exposed first surface and on the exposed second layer by applying a first voltage between... | 10/02/2007 |
| 7252891 | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 08/07/2007 |
| 7223481 | Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a ... | 05/29/2007 |
| 7214440 | Metallic separator for fuel cell and production method for the same A metallic separator for a fuel cell has excellent corrosion resistance and contact resistance, even when a gold coating is applied directly without a surface treatment by a nickel coating. The metallic separator for a fuel cell, comprising stainless steel having a ... | 05/08/2007 |
| 7200927 | Method for producing a wiring transfer sheet A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 04/10/2007 |
| 7192654 | Multilayered construction for resistor and capacitor formation The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first el... | 03/20/2007 |
| 7189317 | Semiconductor manufacturing system for forming metallization layer A method for forming a metallization layer. A first layer is formed outwardly from a semiconductor substrate. Contact vias are formed through the first layer to the semiconductor substrate. A second layer is formed outwardly from the first layer. Portions of the sec... | 03/13/2007 |
| 7190569 | Implantable heart monitors having capacitors with endcap headers Implantable heart-monitoring devices, such as defibrillators, pacemakers, and cardioverters, detect abnormal heart rhythms and automatically apply corrective electrical therapy, specifically one or more bursts of electric charge, to abnormally beating hearts. Critic... | 03/13/2007 |
| 7177692 | Capacitor having a feedthrough assembly with a coupling member A flat capacitor includes a case having a feedthrough hole, a capacitor stack located within the case, a coupling member having a base surface directly attached to the capacitor stack and having a portion extending through the feedthrough hole, the coupling member h... | 02/13/2007 |
| 7175920 | Copper foil for high-density ultra-fine printed wiring board The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electr... | 02/13/2007 |
| 7157671 | Flat capacitor for an implantable medical device One aspect provides a capacitor having a first stack of capacitive elements a second stack of capacitive elements, wherein the first and second stacks are enclosed in separate compartments of a capacitor case that electrically isolate the electrolytes of each stack ... | 01/02/2007 |
| 7153590 | Composite copper foil and manufacturing method thereof A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer ( | 12/26/2006 |
| 7154739 | Flat capacitor having an active case A capacitor comprising an aluminum case; a capacitor stack mounted within the aluminum case, the capacitor stack comprising one or more anodes and one or more cathodes, one of the one or more anodes and one or more anodes attached to the aluminum case; wherein the c... | 12/26/2006 |
| 7144637 | Multilayer, corrosion-resistant finish and method The present invention provides a black, chrome-free, multilayer corrosion protection finish designed to meet extended corrosion properties. This corrosion-resistant finish is engineered to meet a minimum of 500 salt spray testing hours to white corrosion, and 1500 s... | 12/05/2006 |
| 7126195 | Method for forming a metallization layer A method for forming a metallization layer (30). A first layer (14) is formed outwardly from a semiconductor substrate (10). Contact vias (16) are formed through the first layer (14) to the semiconductor substrate (10). A se... | 10/24/2006 |
| 7107099 | Capacitor having a feedthrough assembly with a coupling member A flat capacitor includes a case having a feedthrough hole, a capacitor stack located within the case, a coupling member having a base surface directly attached to the capacitor stack and having a portion extending through the feedthrough hole, the coupling member h... | 09/12/2006 |
| 7072713 | Flat capacitor for an implantable medical device One aspect provides a capacitor feedthrough assembly having an electrically conductive member dimensioned to extend at least partially through a feedthrough hole of a case of the capacitor, the conductive member having a passage therethrough. ... | 07/04/2006 |
| 7045043 | Method of reducing a band mark of an electroplating steel sheet The present invention relates to a method of reducing a band mark on an electroplating steel sheet, which can also reduce plating defects and damages to the materials caused by the differences in the physical characteristics of composition materials of a conductor r... | 05/16/2006 |
| 7026059 | Copper foil for high-density ultrafine printed wiring boad The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electr... | 04/11/2006 |
| 6999304 | Foil structures for use in a capacitor with an anode foil and a cathode foil stacked together In one aspect, a method of interconnecting two or more foils of a capacitor, the method comprising connecting together one or more anode connection members of one or more anode foils and one or more cathode connection members of one or more cathode foils and electri... | 02/14/2006 |
| 6957103 | Configurations and methods for making capacitor connections An exemplary capacitor has a capacitor stack positioned in a case with a conductor positioned between the case and a lid. In one embodiment the conductor is positioned between the lid and an upper rim of the case and is welded to the lid and case. In one aspect, a c... | 10/18/2005 |
| 6946205 | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 09/20/2005 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion An apparatus for processing a material on a wafer surface includes a cavity defined by a peripheral wall and configured to direct a process solution and direct it to the surface to to a first wafer surface region without being directed to a second wafer surface regi... | 09/13/2005 |
| 6937379 | Molecular architecture for molecular electro-optical transistor and switch Observable changes in electrical and optical characteristics of individual molecules adsorbed on a conductor or semi-conductor caused by electrical and/or optical excitation or de-excitation of electrons within such molecules can be used as signals which in turn can... | 08/30/2005 |
| 6926789 | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 08/09/2005 |
| 6893738 | Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited cop... | 05/17/2005 |
| 6799832 | Alloy and orifice plate for an ink-jet pen using the same An alloy that is suitable for coating a nickel orifice plate of an ink-jet printhead so as to allow the orifice plate to adhere to an intermediate layer of the ink-jet printhead and to improve the non-wetting characteristics of the nickel orifice plate is disclosed.... | 10/05/2004 |
| 6780302 | Process for electrochemical treatment of a continuous web A process for use in a continuous electrochemical treating line for electrochemically treating at least one surface of a continuous web moving through an electrolyte solution contained within a tank. The process includes the steps of providing at least one electrode... | 08/24/2004 |
| 6752915 | Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the ... | 06/22/2004 |
| 6720084 | Process for producing heat-resistant resin film having metallic thin film, process for producing endless belt, endless belt, and apparatus for forming image A heat-resistant resin film having a metallic thin film accumulated thereon or an endless belt having a metallic thin film accumulated thereon having good mechanical characteristics is produced in a simple process. A metallic thin film is formed on an inner surface ... | 04/13/2004 |
| 6379487 | Component of printed circuit board A method of forming a laminate used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chromium having a thickness from about 30 grams per square meter to about 160 grams per square meter to each side of a steel subs... | 04/30/2002 |
| 6319621 | Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same To establish a technique of further improving the oxidation resistance of the glossy surface of a copper foil that has a composite layer containing chromium, zinc, and phosphorus on its glossy surface is achieved by a copper foil having excellent oxidatio... | 11/20/2001 |
| 6299752 | Very high volt oxide formation of aluminum for electrolytic capacitors An anode foil treatment method produces a useful high quality oxide with inherently high capacitance at voltages as high as 750 Volts or more. The anode foil treatment method comprises a series of formation and relaxation steps. Oxide layer formation is p... | 10/09/2001 |
| 6270648 | Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two "super anodes" on a rotating drum cathode to deposit ... | 08/07/2001 |
| 6231742 | Electrolytic Copper foil and process for producing the same In a process for the production of an electrolytic copper foil from a sulfurically acidic copper sulfate electrolytic solution, the sulfurically acidic copper sulfate electrolytic solution contains additives of 0.1 to 1.0 g/l of an oxyethylenic surfactant... | 05/15/2001 |
| 6187166 | Integrated solution electroplating system and process A method and system for electroplating a metal coating onto a continuous part, such as the leadframe stock used in packaging integrated circuits, whereby the method comprises plating metal from a series of plating baths having the same or compatible chemi... | 02/13/2001 |
| 6176995 | Method and apparatus for electrolytically metallizing or etching material The current density with which the process is used is of essential importance for the economy of a method of electrolytically treating materials. Normally only low or medium current densities are used, as the speed of replacement of consumed materials in ... | 01/23/2001 |
| 6106688 | Method for manufacturing a suspension element for a magnetic head Provided are a method for manufacturing a suspension element having a pattern of wiring lines and an equipment for the same. The method includes the steps of: preparing a roll of band-shaped sheet used as a substrate of the suspension element; sequentiall... | 08/22/2000 |
