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| Number | Title | Issue Date |
| 7422696 | Multicomponent nanorods Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of... | 09/09/2008 |
| 7404885 | Plating method and electronic device A plating method includes the steps of (a) forming a roughened area in a predetermined area of a substrate, (b) forming a surface-active agent layer above at least the roughened area, (c) forming, above the roughened area, a catalyst layer above the surface-active a... | 07/29/2008 |
| RE40218 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seede... | 04/08/2008 |
| 7309413 | Providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 12/18/2007 |
| 7300685 | Steel wire with metal layer and roughnesses Steel wire is coated with a metal layer such that the metal layer has a surface with roughnesses. A surface roughness Ra of above 0.25 μm is reached. Preferably, the roughnesses are randomly dispersed at the surface. The result is an improved visual aspect and an i... | 11/27/2007 |
| 7297247 | Electroformed sputtering target A method of fabricating a sputtering target for sputter depositing material onto a substrate in a sputtering chamber is described. In one embodiment of the method, a preform having a surface is formed and a layer of sputtering material is electroplated onto the surf... | 11/20/2007 |
| 7214440 | Metallic separator for fuel cell and production method for the same A metallic separator for a fuel cell has excellent corrosion resistance and contact resistance, even when a gold coating is applied directly without a surface treatment by a nickel coating. The metallic separator for a fuel cell, comprising stainless steel having a ... | 05/08/2007 |
| 7204925 | Structure and method of preventing electrolytic corrosion for magnesium alloy member A structure and a method of preventing electrolytic corrosion for a magnesium alloy member (20), the structure wherein a first coated layer (11) formed by electro deposition and a second coated layer (12) formed by distributing PTFE particles on... | 04/17/2007 |
| 7140969 | Overmolded yoke assembly A universal joint having a first yoke including a body portion and an overmold portion. The body portion includes a base and a pair of arms that extend from the base. A trunnion assembly is coupled to the first yoke and extends between the arms. A second yoke is cou... | 11/28/2006 |
| 7122466 | Two step semiconductor manufacturing process for copper interconnects An embodiment of the invention is a method of manufacturing copper interconnects 30 on a semiconductor wafer 10 where an electroplating process is used to deposit a first layer of copper grains 30d having an initial grain size and a secon... | 10/17/2006 |
| 7063779 | Method for manufacturing metal-coated optical fiber The optical fiber manufacturing method according to the present invention is characterized by having the steps of forming, on the peripheral surface of a bare fiber having been exposed by removing a resin cover and on which a metallic coating has not been provided, ... | 06/20/2006 |
| 7054142 | Niobium alloy powder, anode for solid electrolytic capacitor and solid electrolytic capacitor There is provided a niobium alloy powder suitable for manufacturing solid electrolytic capacitors having small leakage currents and high capacitances, where the powder is obtained by enhancing the thermal stability of the niobium oxide coating film while improving t... | 05/30/2006 |
| 7052740 | Frame assembly and method for coating a strand of workpieces The subject invention includes a plating apparatus (10) having an electrically conductive rack (12) and a frame assembly (14). The frame assembly (14) includes a rod (24) and series of support structures (26). A number of re... | 05/30/2006 |
| 7030339 | Soldering iron tip with metal particle sintered member connected to heat conducting core A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, ... | 04/18/2006 |
| 6974636 | Protective coating for turbine engine component A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum... | 12/13/2005 |
| 6958114 | Method and apparatus for forming an electrical contact with a semiconductor substrate The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stor... | 10/25/2005 |
| 6946065 | Process for electroplating metal into microscopic recessed features Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plat... | 09/20/2005 |
| 6946716 | Electroplated interconnection structures on integrated circuit chips A process is described for the fabrication of submicron interconnect structures for integrated circuit chips. Void-free and seamless conductors are obtained by electroplating Cu from baths that contain additives and are conventionally used to deposit level, bright, ... | 09/20/2005 |
| 6899796 | Partially filling copper seed layer A two-step method of filling copper into a high-aspect ratio via or dual-damascene structure. The first step sputters at a low temperature of no more than 100° C. and with at least portions of high wafer bias, thereby filling a lower half of the hole. The initial c... | 05/31/2005 |
| 6884523 | Electronic component and method of manufacturing the same An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crysta... | 04/26/2005 |
| 6881452 | Method for improving the TBC life of a single phase platinum aluminide bond coat by preoxidation heat treatment A thermal barrier coating system having an improved life as a result of a preoxidation treatment applied to a single phase platinum aluminide bond coat. After coating the substrate to form a diffusion platinum aluminum bond coat, the surface finish of the bond coat ... | 04/19/2005 |
| 6867149 | Growth of multi-component alloy films with controlled graded chemical composition on sub-nanometer scale The chemical composition of thin films is modulated during their growth. A computer code has been developed to design specific processes for producing a desired chemical composition for various deposition geometries. Good agreement between theoretical and experiment... | 03/15/2005 |
| 6863991 | Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (... | 03/08/2005 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the wor... | 02/08/2005 |
| 6824668 | Method for electroplating Ni-Fe-P alloys using sulfamate solution Disclosed is a method of electroplating a Ni—Fe—P alloy using a sulfamate solution and, in particular, a method of electroplating a Ni—Fe—P alloy using a plating solution containing nickel sulfamate, iron sulfamate, phosphorous acid, and a buffer agent. The ... | 11/30/2004 |
| 6814845 | Method for depositing an enzyme on an electrically conductive substrate Improved biosensors are provided having excellent selectivity and stability properties, together with methods of preparing the biosensors. A preferred biosensor includes an electrode (12) having enzyme (16) deposited thereon together with a layer of el... | 11/09/2004 |
| 6797405 | Method for uniform electrochemical reduction of apertures to micron and submicron dimensions using commercial biperiodic metallic mesh arrays and devices derived therefrom A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting... | 09/28/2004 |
| 6793796 | Electroplating process for avoiding defects in metal features of integrated circuit devices Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density applied to a substrate, avoid defects in plated films on substrates ha... | 09/21/2004 |
| 6776892 | Semiconductor plating system workpiece support having workpiece engaging electrode with pre-conditioned contact face A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrodes which ha... | 08/17/2004 |
| 6720084 | Process for producing heat-resistant resin film having metallic thin film, process for producing endless belt, endless belt, and apparatus for forming image A heat-resistant resin film having a metallic thin film accumulated thereon or an endless belt having a metallic thin film accumulated thereon having good mechanical characteristics is produced in a simple process. A metallic thin film is formed on an inner surface ... | 04/13/2004 |
| 6652669 | Method for producing an ultraphobic surface on an aluminum base The invention relates to a method for producing an ultraphobic surface on aluminium as the supporting material and to the resulting surface and its use. According to said method, the surface of an aluminium support is anodized, especially by anodic oxidat... | 11/25/2003 |
| 6596147 | Methods of overplating surfaces of microelectromechanical structure MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to... | 07/22/2003 |
| 6592740 | Methods to make capacitors containing a partially reduced niobium metal oxide Methods to at least partially reduce a niobium oxide are described wherein the process includes heat treating the niobium oxide in the presence of a getter material and in an atmosphere which permits the transfer of oxygen atoms from the niobium oxide to ... | 07/15/2003 |
| 6576110 | Coated anode apparatus and associated method An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated w... | 06/10/2003 |
| 6562217 | Method and device for manufacturing conductive particles A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid. The apparatus comprises: a disk-shaped bottom plate secured... | 05/13/2003 |
| 6551487 | Methods and apparatus for controlled-angle wafer immersion The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the ... | 04/22/2003 |
| 6527937 | Method of making a capacitor anode of a pellet of niobium oxide Methods to at least partially reduce a niobium oxide are described wherein the process includes heat treating the niobium oxide in the presence of a getter material and in an atmosphere which permits the transfer of oxygen atoms from the niobium oxide to ... | 03/04/2003 |
| 6517698 | System and method for providing rotation to plating flow A system for electroplating integrated circuit wafers includes an electroplating solution containment chamber having a first end that is capable of supporting an integrated circuit wafer so that a surface of the wafer faces an internal volume of the chamb... | 02/11/2003 |
| 6511588 | Plating method using an additive A plating method comprising using a plating solution containing an additive satisfying the following conditions: 0.005×h2 /w | 01/28/2003 |
| 6503341 | Self-compensating spiral for a spiral balance-wheel in watchwork and process for treating this spiral This self-compensating spiral for a mechanical spiral balance-wheel oscillator in watchwork or other precision instrument, made of a paramagnetic alloy, contains at least one of the elements Nb, V, Ta, Ti, Zr, Hf and is covered with a substantially unifor... | 01/07/2003 |
