Bizarre Patents
Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Number | Title | Issue Date |
| 7708875 | Noncontact localized electrochemical deposition of metal thin films A method of selectively depositing metal features on a conductive surface of a substrate. An electrode assembly that includes a plurality of electrodes connected in series so as to be oppositely polarized when a voltage is applied thereacross is positioned over the ... | 05/04/2010 |
| 7618526 | Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board A method for manufacturing a plated film by bringing a film having a conductive surface into electrical contact with a cathode roll with a liquid film interposed between the film and the cathode and forming a metal plating on the conductive surface of the film, char... | 11/17/2009 |
| 7311811 | Device providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 12/25/2007 |
| 7309407 | Method and apparatus for forming an electrical contact with a semiconductor substrate The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stor... | 12/18/2007 |
| 7267726 | Method and apparatus for removing polymer residue from semiconductor wafer edge and back side A method for cleaning a semiconductor device has the steps of securing a wafer (16) with a modified chuck (11) and applying a cleaning solution (18) to the backside (20) of the wafer (16). The cleaning solution (18) is formu... | 09/11/2007 |
| 7153400 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided ... | 12/26/2006 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
| 7077721 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 07/18/2006 |
| 7029365 | Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 04/18/2006 |
| 7025861 | Contact plating apparatus Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid b... | 04/11/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6958114 | Method and apparatus for forming an electrical contact with a semiconductor substrate The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stor... | 10/25/2005 |
| 6855239 | Plating method and apparatus using contactless electrode A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an emf in the substrate to plate the surface. In another embodiment, a co... | 02/15/2005 |
| 6824666 | Electroless deposition method over sub-micron apertures An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/30/2004 |
| 6607652 | Electroplating method A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical conta... | 08/19/2003 |
| 6576110 | Coated anode apparatus and associated method An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated w... | 06/10/2003 |
| 6517697 | Anodizing method A holder (102) made from an HF-resistant material includes annular suction pads (105, 108). The suction pad (105) is used to hold a small silicon substrate by suction, and the suction pad (108) is used to hold a large silicon substrate by suction. This ma... | 02/11/2003 |
| 6471847 | Method for forming an electrical contact with a semiconductor substrate The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conduc... | 10/29/2002 |
| 6350363 | Electric field directed construction of diodes using free-standing three-dimensional components A process of making an electric current rectifying device using spatially coupled bipolar electrochemical deposition includes (a) placing at least two electrically conductive substrates, which may be a source of electrically conductive material, or a sepa... | 02/26/2002 |
| 6258240 | Anodizing apparatus and method It is an object of the present invention to provide an anodizing apparatus capable of efficiently performing anodizing. In order to achieve this object, an anodizing apparatus for anodizing a substrate to be processed in an electrolytic solution includes ... | 07/10/2001 |
| 6238541 | Film-forming method and metal material A method is provided for forming a film having excellent anticorrosion properties on a metal surface without producing sludge, and without using phosphorus or chromium. In this method, the following steps (a)-(c) are performed on a metal material: (a) deg... | 05/29/2001 |
| 6207034 | Method of manufacture of polymer transistors with controllable gap A method of manufacturing a polymer transistor having a controllable gap is provided in an embodiment. In the embodiment, a conducting tip is positioned proximate to a conducting surface so as to form a gap, an electrochemical medium is introduced in cont... | 03/27/2001 |
| 6203936 | Lightweight metal bipolar plates and methods for making the same Thin, light weight bipolar plates for use in electrochemical cells are rapidly, and inexpensively manufactured in mass production by die casting, stamping or other well known methods for fabricating magnesium or aluminum parts. The use of a light metal, s... | 03/20/2001 |
| 6197182 | Apparatus and method for plating wafers, substrates and other articles A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to th... | 03/06/2001 |
| 6190530 | Anode container, electroplating system, method and plated object An anode container, electroplating system, method and object so plated. A feature of the invention is that an anode container has an interior cross-sectional area, at or near a lower end thereof, that is larger than an interior cross-sectional area of an ... | 02/20/2001 |
| 6146516 | Method and device for the repair and/or touch-up of small surface flaws in a press plate or an endless band for surface-embossing of plastic-coated wooden or laminated panels A method and a device are described for the repair and/or touch-up of small surface flaws in large press plates or endless bands of sheet metal, especially steel sheet, having a structured metal coating and a hard-chrome plating for surface-embossing plas... | 11/14/2000 |
| 6143155 | Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary phys... | 11/07/2000 |
| 6132586 | Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly Plating of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly a single metallized surface of a semiconductor wafer without necessary physical contact with the wafer or... | 10/17/2000 |
| 6120669 | Bipolar electrochemical connection of materials The present invention relates to a bipolar electrochemical process for toposelective electrodeposition of a substance on a substrate comprising (a) placing the substrate and at least one of the substance and a source of the substance into an environment c... | 09/19/2000 |
| 6120671 | Method and apparatus for electrolytic pickling a metallic strip A system and method is provided for electrolytic pickling a metal strip, where the electric current is conducted through the strip indirectly without electrically conductive contact between the strip and the electrodes. The strip is run vertically or subs... | 09/19/2000 |
| 6099709 | Method of producing an electrode foil for use in aluminum electrolytic capacitors This invention provides an apparatus for producing an electrode foil for use in aluminum electrolytic capacitors with which a high capacitance is obtained while the distortion of the foil and the leakage current can be controlled. At least two electrode p... | 08/08/2000 |
| 5804052 | Method and device for continuous uniform electrolytic metallizing or etching The invention relates to a method for continuous uniform electrolytic metallizing or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductiv... | 09/08/1998 |
| 5693705 | Matted electrodeposition coating composition and a method of producing a matted electrodeposition coating This invention offers a method of manufacturing a matted electrodeposition coating composition which does not mask the hue and the fine pattern which are inherent to the thing to be coated and also offers a method of conducting such an electrodeposition. ... | 12/02/1997 |
| 5660706 | Electric field initiated electroless metal deposition A technique for utilizing an electric field to initiate electroless deposition of a material to form layers and/or structures on a semiconductor wafer. The wafer is disposed between a positive electrode and a negative electrode and disposed so that its de... | 08/26/1997 |
| 5653052 | Method for immobilizing or killing swimming larvae in a mass of fresh water, and an electric trap for practicing such a method Larvae swimming in a mass of fresh water and having interiors substantially constituted of highly electrically conductive substance are immobilized or killed. Two capacitor plates, which include exterior insulation, are located on opposite sides of the ma... | 08/05/1997 |
| 4681665 | Process and apparatus for electrochemical treatment of the surface of metal products of elongate shape The present invention relates to a process and apparatus for electrochemical treatment in a static mode or in a feed motion mode of the surface of metal products of elongate shape. The process is characterized in that cathodic and anodic zones are produced ... | 07/21/1987 |
| 4648945 | Bipolar plating of metal contacts onto oxide interconnection for solid oxide electrochemical cell Disclosed is a method of forming an adherent metal deposit on a conducting layer of a tube sealed at one end. The tube is immersed with the sealed end down into an aqueous solution containing ions of the metal to be deposited. An ionically conducting aque... | 03/10/1987 |
| 4597837 | Method and apparatus for electrolytic treatment A method and apparatus for electrolytic treatment employing graphite electrodes wherein an asymmetrical waveform alternating current is applied to the electrodes to subject a metal web to a continuous electrolytic treatment. A graphite electrode in a trea... | 07/01/1986 |
