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| Number | Title | Issue Date |
| 7854830 | System and method for electroplating metal components A system and a method for electroplating a plurality of turbine blades, comprising providing a rotatable gear for each blade, operatively connecting a mount assembly for each gear, slidably placing an electric charge on the blades. ... | 12/21/2010 |
| 7442285 | Common rack for electroplating and PVD coating operations Disclosed is a multi-step process for the coating of a substrate without re-racking the substrate between the coating operations comprising: providing a substrate holder with an inert protective polymeric coating covering a substantial portion of the holder; affixin... | 10/28/2008 |
| 7323097 | Electroplating method for a semiconductor device An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed ... | 01/29/2008 |
| 7323094 | Process for depositing a layer of material on a substrate An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical curr... | 01/29/2008 |
| 7285202 | Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the in... | 10/23/2007 |
| 7241366 | Continuous coating process A system for coating variable and/or unlimited length parts is provided. The system comprises a process tank, a coating material supply, and an open-ended process tank conveyor is provided. The process tank comprises an entry port, an exit port opposite the entry po... | 07/10/2007 |
| 7208073 | Media for use in plating electronic components Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and m... | 04/24/2007 |
| 7192494 | Method and apparatus for annealing copper films A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system. ... | 03/20/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7029761 | Bonding layer for bonding resin on copper surface A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromi... | 04/18/2006 |
| 7014740 | Brown gas mass production apparatus including a line style electrolytic cell Disclosed is a Brown gas mass production apparatus having a line style electrolytic cell in which an electrolytic cell case having an electrolyte distribution and discharging pipe mounted on the inside bottom surface thereof is coated with insulation material on the... | 03/21/2006 |
| 6994776 | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 02/07/2006 |
| 6939455 | Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method For electrolytic treatment of circuit boards and foils LP, a method and a device are used in which the sheets and foils are transported through a treatment unit and brought thereby in contact with treatment fluid 3. The sheets and foils are guided during tran... | 09/06/2005 |
| 6923898 | Electroplating device, and process for electroplating work using the device An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Alternatively, a... | 08/02/2005 |
| 6916983 | Grounding electrode A grounding electrode suited for installation in very hard or rocky soil is a long conductive metal rod having a drilling bit at one end and a head adapted to mate with a drilling tool, preferably a hammer drill. The grounding electrode, together with a suitable con... | 07/12/2005 |
| 6797142 | Tin plating Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating. ... | 09/28/2004 |
| 6780303 | Continuous nickel plating process for an aluminum conductor and corresponding device A process for continuous nickel plating of an aluminum conductor, by electrolytically pre-treating the aluminum conductor to improve adherence of a nickel coat thereon by passing the aluminum conductor through a pre-treating bath in which is disposed an electrode co... | 08/24/2004 |
| 6695961 | Carrier serving to supply current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces The invention relates to carriers serving to supply current to workpieces to be treated electrolytically or counter-electrodes and a method for the electrolytic treatment of workpieces. The carriers according to the invention comprise at least three elong... | 02/24/2004 |
| 6607652 | Electroplating method A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical conta... | 08/19/2003 |
| 6599412 | In-situ cleaning processes for semiconductor electroplating electrodes Methods and apparatuses for in-situ cleaning of semiconductor electroplating electrodes to remove plating metal without requiring !the manual removal of the electrodes from the semiconductor plating equipment. The electrode is placed into the plating liqu... | 07/29/2003 |
| 6562217 | Method and device for manufacturing conductive particles A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid. The apparatus comprises: a disk-shaped bottom plate secured... | 05/13/2003 |
| 6524463 | Method of processing wafers and other planar articles within a processing cell A method of processing wafers or other articles within a processing cell, entailing transporting a carrier supporting a vertically-oriented wafer horizontally through an inlet opening of a process cell, processing the vertically-oriented wafer within the ... | 02/25/2003 |
| 6500324 | Process for depositing a layer of material on a substrate An electroplating system (30) and process makes electrical current density across, a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical curren... | 12/31/2002 |
| 6471846 | Electric feeding method and apparatus for a continuous plating apparatus To avoid the formation of undesirable plating on electric supply rollers, there is provided a continuous plating apparatus in which a planar article to be plated is vertically clamped on both sides by electric supply rollers and the article to be plated i... | 10/29/2002 |
| 6432292 | Method of electrodepositing metal on electrically conducting particles The present invention relates to a device and method for electrolytic deposition of metals on conducting particles. The conducting particles are completely immersed in a liquid and allowed to flow across a particle contacting surface of a cathode support.... | 08/13/2002 |
| 6391180 | Device for surface treatment by immersion In a device for surface treatment, in particular for electrochemical coating followed by electrophoretic coating, the material to be treated is moved through coating vessels in one or more planes. This is carried out using stepped cage conveyors which are... | 05/21/2002 |
| 6365030 | Method of manufacturing R-Fe-B bond magnets of high corrosion resistance A method of manufacturing R--Fe--B bonded magnets, capable of forming various corrosion resisting films on a R--Fe--B bonded magnet uniformly with a very high bonded strength so as to attain such a very high corrosion resistance thereof that prevents the ... | 04/02/2002 |
| 6342146 | Lead-free alloy plating method A continuous plating system which is horizontal, allows for submersion of the entire article to be plated, and is useful for alloy plating. The invention provides a link/hinge conveyor system, the conveyor acts as the conductor, numerous processes/baths a... | 01/29/2002 |
| 6287444 | Method for producing very small metal ball An efficient method for producing a high-precision, very small metal ball, such as a Cu ball having an outer diameter not greater than 1 mm, comprising the steps of: cutting metal wire having a diameter not greater than 0.3 mm into a predetermined length;... | 09/11/2001 |
| 6265020 | Fluid delivery systems for electronic device manufacture The present invention relates to new methods for delivering solutions during electronic device manufacture. Methods of the invention include delivering metallization solutions to the device at an angle of less than 90 degrees with the surface of the devic... | 07/24/2001 |
| 6254756 | Preparation of components having a partial platinum coating thereon A curved component such as a turbine airfoil, shroud, or combustor centerbody is prepared with a platinum or a platinum-aluminide protective coating over only a portion of the surface thereof. The coating may serve as an environmental coating, or as a bon... | 07/03/2001 |
| 6197178 | Method for forming ceramic coatings by micro-arc oxidation of reactive metals A process and apparatus for forming oxide coatings on bodies of aluminum and aluminum alloys are described. The process includes forming an electrolyte bath in an inert container. At least two reactive metal bodies are suspended in the bath. The bodies ar... | 03/06/2001 |
| 6176995 | Method and apparatus for electrolytically metallizing or etching material The current density with which the process is used is of essential importance for the economy of a method of electrolytically treating materials. Normally only low or medium current densities are used, as the speed of replacement of consumed materials in ... | 01/23/2001 |
| 6090262 | Barrel plating method A barrel plating method wherein each box containing pieces to be plated is provided with a kanban corresponding to the pieces contained in the box. The kanban of each box is read by an apparatus before the pieces are transferred from the box to a plating ... | 07/18/2000 |
| 6059952 | Method of fabricating coated powder materials and their use for high conductivity paste applications Methods for forming pastes of powder particles coated with an electrically conductive coating are described. The powder particles, with or without an optional first conductive coating layer applied to their surface, are placed in contact with a cathode su... | 05/09/2000 |
| 5958210 | Efficient electrowinning of zinc from alkaline electrolytes Zinc metal is deposited from an alkali electrolyte solution onto conductive seed particles in an electrowinning process which yields unusually high current efficiency and low energy consumption.... | 09/28/1999 |
| 5932081 | Method and device for galvanizing plate-shaped products in horizontal continuous plants The invention relates to a method and device for electroplating plate-shaped product, particularly printed circuit boards, in horizontal continuous plants with optional sequence of product, revolving contacting means serving for electrical connection of a... | 08/03/1999 |
| 5914022 | Method and apparatus for monitoring and controlling electrodeposition of paint A method and apparatus for monitoring electrodes for the electrodeposition of paint onto metallic workpieces includes detecting current from the electrodes and displaying a plot of current versus time. A method and apparatus for controlling electrodeposit... | 06/22/1999 |
| 5911865 | Method for electroplating of micron particulates with metal coatings A method of electroplating particulates in a metallic ion containing electrolyte within an electroplating device having an anode and cathode plate by repeating the steps of stirring the particulates, allowing sedimentation of the particulates to occur by ... | 06/15/1999 |
| 5871629 | Method and apparatus for fixturing substrate assemblies for electrolytic plating A fixture for securing a pin grid array (PGA) and grounding all circuits or pins in the PGA for electrolytic plating provides a series of parallel wires that are inserted between every other gap between the PGA pin rows. The cross section of each wire is ... | 02/16/1999 |
