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| Number | Title | Issue Date |
| 7658831 | Three dimensional microstructures and methods for making three dimensional microstructures Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support s... | 02/09/2010 |
| 7655126 | Fabrication of topical stopper on MLS gasket by active matrix electrochemical deposition A method for making a gasket (32) for an internal combustion engine (20) includes forming a generally annual stopper (38) on a metallic gasket body (40) through the process of electrochemical deposition. An electrolytic cell is completed ... | 02/02/2010 |
| 7628902 | Electrochemical deposition method utilizing microdroplets of solution A method of electrochemical deposition uses microdroplets of electrolytic solution over a targeted small circuit element. Only the targeted circuit element is electrically biased so that deposition occurs on the surface of that element, underneath the microdroplet, ... | 12/08/2009 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surfac... | 06/17/2008 |
| 7362495 | Electrostatic fins for a MEMS device A MEMS device includes a hinge that is disposed outwardly from a substrate and capable of at least partially supporting a conductor that is disposed outwardly from the hinge. The conductor being capable of pivoting about a first axis. The device also includes one or... | 04/22/2008 |
| 7179361 | Method of forming a mass over a semiconductor substrate The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a si... | 02/20/2007 |
| 7144490 | Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer A method for selective electroplating of a semiconductor input/output (I/O) pad includes forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer fo... | 12/05/2006 |
| 7070688 | Electroplating tool and method for selective plating A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements. Each of the holes is configured to receive a piece that is to be elec... | 07/04/2006 |
| 7056445 | Method of removing paint applied to magnesium-alloy material A method is provided for removing a paint layer formed on a Mg-alloy material. The method includes a physical removing step and a chemical removing step. At the physical removing step, the paint layer is partially removed by using a cutter or by wet blasting. Then, ... | 06/06/2006 |
| 7048841 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact a... | 05/23/2006 |
| 7005054 | Method for manufacturing probes of a probe card A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Cont... | 02/28/2006 |
| 6971946 | Manufacturing method of roller of film or tape handling machine A lot of concave portions and convex portions are formed on a circumferential face of base metal cylinder or roller. Summits of the convex positions are ground and removed or erased. The base metal cylinder or roller is plated and coated to harden the circumferentia... | 12/06/2005 |
| 6878260 | Process for forming a high-quality interface between a plated and a non-plated area A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. T... | 04/12/2005 |
| 6863936 | Method of forming selective electroless plating on polymer surfaces A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippab... | 03/08/2005 |
| 6689269 | Method for electrochemically processing material The invention relates to a method for electrochemically processing a workpiece (61) in which a pulsating or alternating electrical voltage is applied between the workpiece and a workpiece electrode (62) which are arranged at a distance from one another in... | 02/10/2004 |
| 6673227 | Process for producing three-dimensional, selectively metallized parts The parts are produced by two-component injection molding. Those regions that are to be metallized consist of a first plastic and those regions that are not to be metallized consist of a second plastic. After the entire surface of the parts has been seede... | 01/06/2004 |
| 6652727 | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a two-step process in which the hydrodynamically inaccessible recesses are pla... | 11/25/2003 |
| 6527935 | Process for electroplating pins of an integrated circuit package An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive fle... | 03/04/2003 |
| 6508926 | Method and device for partial electrochemical treatment of bar-shaped objects In a device, rod-shaped objects 10 (rods of various length and diameter) are electrochemically partially processed in dip plants (galvanized, pickled). Stationary tubular electrodes 30, into which the rods 10 are centrically entered, are provided in the p... | 01/21/2003 |
| 6468806 | Potential masking systems and methods for combinatorial library synthesis Methods and apparatus are provided for the preparation of a substrate having an array of diverse materials, the materials being deposited at spatially addressable, predefined regions. In particular, potential masking systems are provided which generate sp... | 10/22/2002 |
| 6436265 | Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array A fabrication method of fabricating an array of microstructures is provided. The method includes the step of preparing a substrate with a surface including a usable region and a dummy region continuously set around the usable region, at least the usable r... | 08/20/2002 |
| 6399153 | Method and apparatus for air masking portion of component during plating or coating A method and an apparatus for restricting the areas of contact between components to be plated or coated and liquid solutions containing plating or coating agents, without the use of masking tape. Components made of electrically conductive material are su... | 06/04/2002 |
| 6391166 | Plating apparatus and method An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod (1) placed in tube (109), and anode rings (2), and (3) placed between cylindrical walls (107) and (105), (103) and (101), respectively. Anode... | 05/21/2002 |
| 6383357 | Production of bevelled galvanic structures A three-dimensional formed metallic structure with varying thickness including sloping flanks is formed on a substrate. A conductive layer is applied to the substrate initially, in the form of laterally spaced electrically isolated conductive islands. A c... | 05/07/2002 |
| 6350363 | Electric field directed construction of diodes using free-standing three-dimensional components A process of making an electric current rectifying device using spatially coupled bipolar electrochemical deposition includes (a) placing at least two electrically conductive substrates, which may be a source of electrically conductive material, or a sepa... | 02/26/2002 |
| 6340421 | Microelectrogravimetric method for plating a biosensor Disclosed is a method for microelectrogravimetrically depositing an electroactive species onto an electrode or a plurality of electrodes comprising dispensing a solution containing the electroactive species from a microdispenser to form a hanging drop of ... | 01/22/2002 |
| 6319383 | Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated The invention relates to a device and a method for evening out the thickness of metal layers on electrical contact points on flat items to be treated 7, such as conductor foil and printed circuit boards, during the electrolytic treatment of the items to b... | 11/20/2001 |
| 6262426 | Technique and process for the imaging and formation of various devices and surfaces A technique is described for the formation of nano and micro-scale patterns and optical wave-guides, by using Bipolar Electrochemistry. Atoms are deposited or removed from a surface by creating and moving ions into or out of a medium by the use of electri... | 07/17/2001 |
| 6254756 | Preparation of components having a partial platinum coating thereon A curved component such as a turbine airfoil, shroud, or combustor centerbody is prepared with a platinum or a platinum-aluminide protective coating over only a portion of the surface thereof. The coating may serve as an environmental coating, or as a bon... | 07/03/2001 |
| 6232144 | Nickel barrier end termination and method A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a nickel plating solution only on an exposed end terminal reg... | 05/15/2001 |
| 6217736 | Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment The apparatus according to the invention is used for electrolytically treating a board-shaped substrate to be treated, preferably printed circuit boards, in a continuous system, through which the item to be treated is guidable in a plane of conveyance in ... | 04/17/2001 |
| 6207331 | Aqueous image recording method for electrochemically depositing an image forming material The image recording process comprises the steps of preparing an aqueous coloring material liquid by dissolving or dispersing fine particles of a coloring material in an aqueous liquid, disposing an image supporting member and a counter electrode opposite ... | 03/27/2001 |
| 6207034 | Method of manufacture of polymer transistors with controllable gap A method of manufacturing a polymer transistor having a controllable gap is provided in an embodiment. In the embodiment, a conducting tip is positioned proximate to a conducting surface so as to form a gap, an electrochemical medium is introduced in cont... | 03/27/2001 |
| 6197180 | High aspect ratio, microstructure-covered, macroscopic surfaces The performance of many macroscopic structures (those whose dimensions are on the order of centimeters, meters, or even larger) can be greatly improved by covering their surfaces with microstructures. There are several applications in which "large," micro... | 03/06/2001 |
| 6187164 | Method for creating and testing a combinatorial array employing individually addressable electrodes An electrochemical deposition and testing system consisting of individually addressable electrode arrays, a fully automated deposition head, and a parallel screening apparatus is described. The system is capable of synthesizing and screening millions of n... | 02/13/2001 |
| 6149791 | Process and apparatus for the selective electroplating of electrical contact elements A process and apparatus for the selective electroplating of electrical coct elements, used for coating at least one contact surface of a metal base for the contact elements with an electrolyte, containing a material with a higher conductivity as compared... | 11/21/2000 |
| 6132583 | Shielding method and apparatus for use in electroplating process An electroplating system includes a tank that holds an electrolytic bath solution. An anode within the tank receives a first voltage having a first potential. A substrate cathode, immersible in the solution within the tank, spaced from the anode, receives... | 10/17/2000 |
| 6120669 | Bipolar electrochemical connection of materials The present invention relates to a bipolar electrochemical process for toposelective electrodeposition of a substance on a substrate comprising (a) placing the substrate and at least one of the substance and a source of the substance into an environment c... | 09/19/2000 |
| 6039858 | Plating process for x-ray mask fabrication A method and apparatus are provided for the electroplating on only one side of a substrate immersed in an electroplating bath comprising using a specially designed device which holds the substrate to be plated in spaced relation to an inhibitor electrode ... | 03/21/2000 |
| 6019883 | Process for producing a deposit on a removable support The invention relates to a process for the production of an electro-chemical deposit (8-1, . . . , 8-4) with the aid of a substrate (2) having connection pieces (4-1, . . . , 4-5), said pieces being used as electrodes, the deposit taking place on the surf... | 02/01/2000 |
